公开(公告)号：US20050142429A1

公开(公告)日：2005-06-30

申请号：US11062597

申请日：2005-02-22

申请人： Shuichi Suzuki ,  Chahn Lee ,  Yuichi Satsu ,  Kishio Hidaka ,  Mitsuo Hayashibara ,  Yoshiyuki Takamori ,  Tomoichi Kamo ,  Yasuhisa Aono

发明人： Shuichi Suzuki ,  Chahn Lee ,  Yuichi Satsu ,  Kishio Hidaka ,  Mitsuo Hayashibara ,  Yoshiyuki Takamori ,  Tomoichi Kamo ,  Yasuhisa Aono

IPC分类号： B01J21/18 ,  B01J23/40 ,  B01J23/74 ,  H01M4/90 ,  H01M4/92 ,  H01M4/96 ,  H01M8/10

CPC分类号： B82Y30/00 ,  H01M4/92 ,  H01M4/926 ,  H01M8/1004 ,  H01M2008/1095

摘要： A catalytic material and electrode of the present invention are characterized in that the catalyst carrier constituting the above-mentioned catalytic material and electrode includes at least one member selected from the group consisting of nitrogen atoms, oxygen atoms, phosphor atoms, and sulfur atoms. Since the cohesion or growth of catalyst grains can hereby be suppressed, it is possible to provide a highly active catalyst, a high-performance electrode, and a high-output-density fuel cell which uses the same.

摘要翻译： 本发明的催化剂材料和电极的特征在于构成上述催化剂材料和电极的催化剂载体包括选自氮原子，氧原子，磷原子和硫原子中的至少一种。 由于可以抑制催化剂颗粒的内聚或生长，所以可以提供高活性催化剂，高性能电极和使用该催化剂颗粒的高输出密度燃料电池。

公开(公告)号：US20050014388A1

公开(公告)日：2005-01-20

申请号：US10484840

申请日：2002-07-22

申请人： Akio Takahashi ,  Yuichi Satsu ,  Harakazu Nakai ,  Yoshiko Nakai ,  Igor Kardash ,  Andrei Pebalk ,  Sergei Chvalun ,  Karen Mailyan

发明人： Akio Takahashi ,  Yuichi Satsu ,  Harakazu Nakai ,  Yoshiko Nakai ,  Igor Kardash ,  Andrei Pebalk ,  Sergei Chvalun ,  Karen Mailyan

IPC分类号： C08G61/02 ,  C08J5/18 ,  C08L65/04 ,  H01L21/312 ,  H01L21/76 ,  H01L21/768 ,  H01L49/02 ,  H05K1/00 ,  H01L21/31 ,  H01L21/469

CPC分类号： C08J5/18 ,  C08G61/02 ,  C08J2365/04 ,  C08L65/04 ,  H01L21/02118 ,  H01L21/0212 ,  H01L21/02203 ,  H01L21/02271 ,  H01L21/312 ,  H01L21/3127 ,  H01L21/7682 ,  H05K3/4676 ,  Y10T428/31913

摘要： An organic polymer film of low dielectric constant and high heating resistance which is applicable as an insulating layer of a semiconductor devices is provided, as well as a manufacturing method for the film and a semiconductor device incorporating the film.

公开(公告)号：US5768108A

公开(公告)日：1998-06-16

申请号：US720028

申请日：1996-09-27

申请人： Osamu Miura ,  Kunio Miyazaki ,  Akio Takahashi ,  Motoyo Wajima ,  Ryuji Watanabe ,  Takao Miwa ,  Yuichi Satsu ,  Shigeo Amagi

发明人： Osamu Miura ,  Kunio Miyazaki ,  Akio Takahashi ,  Motoyo Wajima ,  Ryuji Watanabe ,  Takao Miwa ,  Yuichi Satsu ,  Shigeo Amagi

IPC分类号： H05K1/05 ,  H01L21/48 ,  H01L23/538 ,  H05K1/11 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K1/00 ,  H05K1/09 ,  H05K1/16

CPC分类号： H01L21/4857 ,  H01L23/5385 ,  H05K3/4641 ,  H01L2224/16225 ,  H05K1/113 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623

摘要： A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.

摘要翻译： 在电子计算机，工作站等中使用用于安装电子装置的多层布线结构，特别是具有微细布线层的多层封装板，该板具有优异的尺寸稳定性和 高可靠性，以及制造这种基板的方法。 多层布线结构包括至少两个子组件的复合体，每个子组件具有通过绝缘层分别形成在低热膨胀金属的芯材的相对侧上的布线层，使得布线层对应于区域 相互之间的比例。 子组件通过导体经由通孔彼此连接。 在这种结构中，将具有低热膨胀金属的芯材的布线结构用作基底，因此板的尺寸变化小，并且可以形成微细的布线层，并且子层之间的连接的可靠性 大会组合得到增强。 此外，该板可以低成本生产。

公开(公告)号：US5712080A

公开(公告)日：1998-01-27

申请号：US801421

申请日：1997-02-18

申请人： Yuichi Satsu ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Akio Takahashi ,  Masashi Miyazaki ,  Toshiaki Ishimaru

发明人： Yuichi Satsu ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Akio Takahashi ,  Masashi Miyazaki ,  Toshiaki Ishimaru

IPC分类号： G03F7/004 ,  G03F7/038 ,  G03F7/085 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38

CPC分类号： G03F7/085 ,  H05K3/108 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2203/1105 ,  H05K2203/124 ,  H05K3/0076 ,  H05K3/062 ,  H05K3/384 ,  Y10S430/155

摘要： A method for manufacturing printed circuit board by forming wiring pattern by chemical metal plating using a negative pattern made of a photosensitive resin composition layer as the plating resist, wherein the photosensitive resin comprises at least a linear high polymer composed of repeating units expressed by the following general formula (1); ##STR1## where, R.sub.1 is H, an alkyl group having 1-9 carbon atoms, an alkoxy group having 1-9 carbon atoms, and a carboxyalkyl group having 1-9 carbon atoms, R.sub.2 is an alkylene group having 1-9 carbon atoms, and n is the polymerized number of the repeating unit, and an organic compound expressed by the following general formula (2); ##STR2## where, R.sub.3 is H or an alkyl group having 1-6 carbon atoms, X is NH or S, and Z is N or C--Y, where Y is H, NH.sub.2, or SH.

摘要翻译： 一种印刷电路板的制造方法，其特征在于，使用由感光性树脂组合物层构成的负极图案，通过化学金属电镀形成配线图案作为电镀抗蚀剂，其特征在于，所述感光性树脂至少含有由以下所示的重复单元构成的直链状高分子 通式（1）; 具有1-9个碳原子的烷氧基，具有1-9个碳原子的羧基烷基，R2是具有1-9个碳原子的亚烷基，n是重复单元的聚合数 和由以下通式（2）表示的有机化合物。 （2）其中，R3为H或具有1-6个碳原子的烷基，X为NH或S，Z为N或C-Y，其中Y为H，NH2或SH。

公开(公告)号：US20090289748A1

公开(公告)日：2009-11-26

申请号：US12534530

申请日：2009-08-03

申请人： Makahiro KOMURO ,  Yuichi Satsu

发明人： Makahiro KOMURO ,  Yuichi Satsu

IPC分类号： H01F7/02

CPC分类号： H01F1/0572 ,  H01F41/0293 ,  Y10T428/2991

摘要： The object of the present invention is to provide a rare earth magnet which enables to achieve a good balance between high coercive force and high residual magnetic flux density, and its manufacturing method. The present invention provides a rare earth magnet in which a layered grain boundary phase is formed on a surface or a potion of a grain boundary of Nd2Fe14B which is a main phase of an R—Fe—B (R is a rare-earth element) based magnet, and wherein the grain boundary phase contains a fluoride compound, and wherein a thickness of the fluoride compound is 10 μm or less, or a thickness of the fluoride compound is from 0.1 μm to 10 μm, and wherein the coverage of the fluoride compound over a main phase particle is 50% or more on average. Moreover, after layering fluoride compound powder, which is formed in plate-like shape, in the grain boundary phase, the rare earth magnet is manufactured by quenching the layered compound after melting it at a vacuum atmosphere at a predetermined temperature, or by heating and pressing the main phase and the fluoride compound to make the fluoride compound into a layered fluoride compound along the grain boundary phase.

摘要翻译： 本发明的目的是提供一种能够在高矫顽力和高残留磁通密度之间实现良好平衡的稀土类磁铁及其制造方法。 本发明提供一种在作为R-Fe-B（R为稀土类元素）的主相的Nd2Fe14B的晶界的表面或部分形成层状晶界相的稀土类磁铁， 并且其中所述晶界相包含氟化物，并且其中所述氟化物的厚度为10μm以下，或者所述氟化物的厚度为0.1μm〜10μm，并且其中所述氟化物的覆盖率 主相粒子上的化合物平均为50％以上。 此外，在晶界相中形成板状的氟化物复合粉末之后，通过在预定温度下在真空气氛下或通过加热熔化之后将层状化合物淬火来制造稀土磁铁， 按下主相和氟化物，使氟化合物沿着晶界相成为层状氟化物。

公开(公告)号：US07112634B2

公开(公告)日：2006-09-26

申请号：US10752535

申请日：2004-01-08

申请人： Yuichi Satsu ,  Harukazu Nakai ,  Akio Takahashi ,  Masao Suzuki ,  Katsuo Sugawara

发明人： Yuichi Satsu ,  Harukazu Nakai ,  Akio Takahashi ,  Masao Suzuki ,  Katsuo Sugawara

IPC分类号： C08F8/00 ,  C08G18/83 ,  C08G65/336

CPC分类号： C08G59/1433 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0366 ,  H05K1/0373 ,  Y10T428/31663 ,  H01L2924/00 ,  H01L2224/0401

摘要： A thermosetting resin composition is produced by heat treating a mixture of a polyaddition thermosetting resin, a silicic compound of the formula wherein R is an organic group containing a functional group that causes an addition reaction with the curing agent and R5 and R6 are independently a methyl group or an ethyl group, and water and adding a curing agent of the polyaddition thermosetting resin to the mixture that has undergone heat treatment.

摘要翻译： 热固性树脂组合物是通过热处理加聚热固性树脂，下式的硅化合物的混合物制备的，其中R是含有与固化剂引起加成反应的官能团的有机基团，R 5是氢， SUP>和R 6独立地是甲基或乙基，和水，并将加成热固性树脂的固化剂加入到经过热处理的混合物中。

公开(公告)号：US07105246B2

公开(公告)日：2006-09-12

申请号：US11062597

申请日：2005-02-22

申请人： Shuichi Suzuki ,  Chahn Lee ,  Yuichi Satsu ,  Kishio Hidaka ,  Mitsuo Hayashibara ,  Yoshiyuki Takamori ,  Tomoichi Kamo ,  Yasuhisa Aono

发明人： Shuichi Suzuki ,  Chahn Lee ,  Yuichi Satsu ,  Kishio Hidaka ,  Mitsuo Hayashibara ,  Yoshiyuki Takamori ,  Tomoichi Kamo ,  Yasuhisa Aono

IPC分类号： H01M4/96

CPC分类号： B82Y30/00 ,  H01M4/92 ,  H01M4/926 ,  H01M8/1004 ,  H01M2008/1095

摘要： A catalytic material and electrode of the present invention are characterized in that the catalyst carrier constituting the above-mentioned catalytic material and electrode includes at least one member selected from the group consisting of nitrogen atoms, oxygen atoms, phosphor atoms, and sulfur atoms. Since the cohesion or growth of catalyst grains can hereby be suppressed, it is possible to provide a highly active catalyst, a high-performance electrode, and a high-output-density fuel cell which uses the same.

摘要翻译： 本发明的催化剂材料和电极的特征在于构成上述催化剂材料和电极的催化剂载体包括选自氮原子，氧原子，磷原子和硫原子中的至少一种。 由于可以抑制催化剂颗粒的内聚或生长，所以可以提供高活性催化剂，高性能电极和使用该催化剂颗粒的高输出密度燃料电池。

公开(公告)号：US06924971B2

公开(公告)日：2005-08-02

申请号：US10212750

申请日：2002-08-07

申请人： Yuichi Satsu ,  Akio Takahashi ,  Tadashi Fujieda ,  Takumi Ueno ,  Haruo Akahoshi

发明人： Yuichi Satsu ,  Akio Takahashi ,  Tadashi Fujieda ,  Takumi Ueno ,  Haruo Akahoshi

IPC分类号： H05K3/46 ,  H01B3/00 ,  H01B3/30 ,  H01L23/12 ,  H01L23/14 ,  H01L23/498 ,  H01L23/64 ,  H01L23/66 ,  H05K1/16 ,  H01G4/06

CPC分类号： H05K1/162 ,  H01L23/145 ,  H01L23/49894 ,  H01L23/642 ,  H01L23/66 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0218 ,  Y10T428/249921 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998 ,  Y10T428/31 ,  H01L2924/00

摘要： A high dielectric composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility with organic resins, and then dispersing in an organic resin, has a dielectric constant of 15 or above, with its dielectric loss tangent in the frequency region of from 100 MHz to 80 GHz being 0.1 or less, and can therefore be used effectively for multilayer wiring boards and module substrates.

摘要翻译： 通过将含有金属的无机填料的亚微米颗粒作为必要组分进行绝缘处理如化学处理获得的高介电复合材料，进一步进行表面处理以提高其与有机树脂的相容性，然后分散在 有机树脂的介电常数为15以上，在100MHz〜80GHz的频率范围内的介电损耗角正切为0.1以下，因此能够有效地用于多层布线基板和模块基板。

公开(公告)号：US06762511B2

公开(公告)日：2004-07-13

申请号：US09810467

申请日：2001-03-19

申请人： Yuichi Satsu ,  Harukazu Nakai ,  Akio Takahashi ,  Masao Suzuki ,  Katsuo Sugawara

发明人： Yuichi Satsu ,  Harukazu Nakai ,  Akio Takahashi ,  Masao Suzuki ,  Katsuo Sugawara

IPC分类号： H01L2329

CPC分类号： C08G59/1433 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0366 ,  H05K1/0373 ,  Y10T428/31663 ,  H01L2924/00 ,  H01L2224/0401

摘要： A device allows for continuous regulation of the composition of a fluid mixture that includes at least two components of different polarities. The device is designed, for example, to be inserted in a separation system that the device supplies with a carrier fluid of stabilized composition. The device includes a storage tank (3) receiving a mixture coming from the separation system and at least one auxiliary vessel (6) containing one of the components of the mixture. To control the transfer of this component from auxiliary vessel (6) to storage tank (3), the device further includes at least one tubular capacitive sonde (CS) totally immersed in the fluid mixture, a sonde (TS) for measuring the temperature of the mixture, and a sondc (LS) for measuring the mixture level in storage tank (3). A regulating unit (10) is connected to the various sondes to determine the volume of the component to be transferred to storage tank (3) from the at least one auxiliary vessel in order to restore a set composition for the mixture. The device can be used, for example, for the control of simulated moving beds, of distillation columns, etc.

摘要翻译： 装置允许连续调节包括至少两个不同极性分量的流体混合物的组成。 该装置被设计成例如插入到分离系统中，该装置为装置提供具有稳定组合物的载体流体。 该装置包括容纳来自分离系统的混合物的储罐（3）和至少一个含有混合物组分之一的辅助容器（6）。 为了控制该组件从辅助容器（6）到储罐（3）的转移，该装置还包括完全浸入流体混合物中的至少一个管状电容式探测器（CS），用于测量温度 混合物和用于测量储罐（3）中的混合物水平的软管（LS）。 调节单元（10）连接到各种声源以确定要从至少一个辅助容器传送到储罐（3）的部件的体积，以便恢复混合物的组合物。 该装置可用于例如模拟移动床，蒸馏塔等的控制。

公开(公告)号：US06638631B2

公开(公告)日：2003-10-28

申请号：US10188961

申请日：2002-07-05

申请人： Yuichi Satsu ,  Morimichi Umino ,  Takumi Ueno ,  Akio Takahashi ,  Akira Nagai ,  Toshiya Satoh ,  Shinji Yamada ,  Kazuhiro Suzuki

发明人： Yuichi Satsu ,  Morimichi Umino ,  Takumi Ueno ,  Akio Takahashi ,  Akira Nagai ,  Toshiya Satoh ,  Shinji Yamada ,  Kazuhiro Suzuki

IPC分类号： B32B904

CPC分类号： H01L24/10 ,  C08L79/08 ,  C08L83/10 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/49894 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/351 ,  H05K1/0271 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same. The present invention also provides a thermal stable low elastic modulus resin composition obtained by heat-curing a mixture containing a polyimide, polyamide-imide or polyamide resin or resin precursor, whose cured product has an elastic modulus measured at −50° C. of 2-0.01 GPa, and an oligomer of an organosilicon compound having a functional group capable of causing addition reaction with an NH and/or COOH group.