公开(公告)号：US08564006B2

公开(公告)日：2013-10-22

申请号：US13405985

申请日：2012-02-27

申请人： Koichi Tachibana ,  Hisashi Yoshida ,  Hiroshi Ono ,  Hajime Nago ,  Yoshiyuki Harada ,  Toshiki Hikosaka ,  Maki Sugai ,  Toshiyuki Oka ,  Shinya Nunoue

发明人： Koichi Tachibana ,  Hisashi Yoshida ,  Hiroshi Ono ,  Hajime Nago ,  Yoshiyuki Harada ,  Toshiki Hikosaka ,  Maki Sugai ,  Toshiyuki Oka ,  Shinya Nunoue

IPC分类号： H01L33/00

CPC分类号： H01L33/20 ,  H01L29/045 ,  H01L29/2003 ,  H01L33/16 ,  H01L33/32

摘要： According to one embodiment, a nitride semiconductor device includes a substrate and a semiconductor functional layer. The substrate is a single crystal. The semiconductor functional layer is provided on a major surface of the substrate and includes a nitride semiconductor. The substrate includes a plurality of structural bodies disposed in the major surface. Each of the plurality of structural bodies is a protrusion provided on the major surface or a recess provided on the major surface. An absolute value of an angle between a nearest direction of an arrangement of the plurality of structural bodies and a nearest direction of a crystal lattice of the substrate in a plane parallel to the major surface is not less than 1 degree and not more than 10 degrees.

摘要翻译： 根据一个实施例，氮化物半导体器件包括衬底和半导体功能层。 衬底是单晶。 半导体功能层设置在基板的主表面上并且包括氮化物半导体。 基板包括设置在主表面中的多个结构体。 多个结构体中的每一个是设置在主表面上的突起或设置在主表面上的凹部。 多个结构体的排列的最近方向与平行于主表面的平面中的基板的晶格的最近方向之间的角度的绝对值不小于1度且不大于10度 。

公开(公告)号：US08530278B2

公开(公告)日：2013-09-10

申请号：US13179468

申请日：2011-07-08

申请人： Nobuyasu Muto ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

发明人： Nobuyasu Muto ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

IPC分类号： H01L25/065 ,  H01L25/10 ,  H01L21/60

CPC分类号： H01L24/85 ,  H01L23/5388 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/743 ,  H01L24/78 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at.Since it becomes possible to form the wire of two directions on the pad of a memory chip by performing the over-bonding of reverse bonding by ball bonding, an effect equivalent to continuation stitch bonding of wedge bonding can be produced by ball bonding. Hereby, the degree of freedom of a chip layout and the degree of freedom of the lead layout of substrate 3 can be improved, and the packaging density on a substrate in a chip lamination type semiconductor device (memory card) can be improved.

摘要翻译： 提高了半导体器件中的芯片布局的自由度，并且旨在提高封装密度。 由于可以通过通过球接合进行反向接合的过粘结而在存储芯片的焊盘上形成两个方向的线，因此可以通过球接合产生与楔形接合的连续接合接合相当的效果。 因此，可以提高芯片布局的自由度和基板3的引线布局的自由度，并且可以提高芯片层叠型半导体器件（存储卡）中的基板上的封装密度。

公开(公告)号：US08461611B2

公开(公告)日：2013-06-11

申请号：US13208658

申请日：2011-08-12

申请人： Hiroshi Ono ,  Toshiki Hikosaka ,  Tomoko Morioka ,  Toshiyuki Oka ,  Shinya Nunoue

发明人： Hiroshi Ono ,  Toshiki Hikosaka ,  Tomoko Morioka ,  Toshiyuki Oka ,  Shinya Nunoue

IPC分类号： H01L33/22

CPC分类号： H01L33/22 ,  H01L21/0243 ,  H01L21/02458 ,  H01L21/0254 ,  H01L33/007 ,  H01L33/06 ,  H01L33/20

摘要： According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a second semiconductor layer and a light emitting part. The first semiconductor layer includes an n-type semiconductor layer. The second semiconductor layer includes a p-type semiconductor layer. The light emitting part is provided between the first semiconductor layer and the second semiconductor layer, and includes a plurality of barrier layers and a well layer provided between the plurality of barrier layers. The first semiconductor layer has a first irregularity and a second irregularity. The first irregularity is provided on a first major surface of the first semiconductor layer on an opposite side to the light emitting part. The second irregularity is provided on a bottom face and a top face of the first irregularity, and has a level difference smaller than a level difference between the bottom face and the top face.

摘要翻译： 根据一个实施例，半导体发光器件包括第一半导体层，第二半导体层和发光部分。 第一半导体层包括n型半导体层。 第二半导体层包括p型半导体层。 发光部分设置在第一半导体层和第二半导体层之间，并且包括多个势垒层和设置在多个势垒层之间的阱层。 第一半导体层具有第一不规则性和第二不规则性。 第一不规则性设置在第一半导体层的与发光部相反的一侧的第一主表面上。 第二不规则性设置在第一凹凸的底面和顶面上，并且具有小于底面与顶面之间的水平差的水平差。

公开(公告)号：US08395462B2

公开(公告)日：2013-03-12

申请号：US13422023

申请日：2012-03-16

申请人： Takashi Kawakubo ,  Toshihiko Nagano ,  Michihiko Nishigaki ,  Hiroshi Ono

发明人： Takashi Kawakubo ,  Toshihiko Nagano ,  Michihiko Nishigaki ,  Hiroshi Ono

IPC分类号： H03H9/21 ,  H03H9/10 ,  H03B5/32 ,  H03L1/02

CPC分类号： H03H9/172 ,  H03H9/02338 ,  H03H9/2473 ,  H03H2009/02496 ,  H03H2009/241

摘要： A resonator according to the embodiment includes: a substrate; a flat layered body which is formed above the substrate and is formed with at least a lower electrode, a piezoelectric film and an upper electrode; an anchor portion which fixes the layered body above the substrate; a cut-out portion inside the layered body; a tuning fork vibrator which is formed in the cut-out portion, has both ends supported by the layered body and is formed with at least a lower electrode, a piezoelectric film and an upper electrode; and an envelope which envelopes the layered body and the tuning fork vibrator in a noncontact fashion, and prevents an external force from being applied to the layered body and the tuning fork vibrator.

摘要翻译： 根据实施例的谐振器包括：基板; 形成在基板的上方并形成有至少一个下电极，压电膜和上电极的平坦层状体; 锚定部，其将层叠体固定在基板的上方; 分层体内的切口部分; 形成在切口部分的音叉振动器具有由层叠体支撑的两端，并且至少形成有下电极，压电膜和上电极; 以及以非接触的方式包围层叠体和音叉振动器的信封，并且防止外力施加到层叠体和音叉振动器。

公开(公告)号：US08369770B2

公开(公告)日：2013-02-05

申请号：US12461998

申请日：2009-08-31

申请人： Michiya Okamoto ,  Hiroyuki Nagashima ,  Fumihito Itoh ,  Hiroshi Ono ,  Ken Amemiya ,  Masahiko Shakuto ,  Toshio Koike ,  Yuji Arai ,  Kaoru Yoshino ,  Takuma Iwasaki

发明人： Michiya Okamoto ,  Hiroyuki Nagashima ,  Fumihito Itoh ,  Hiroshi Ono ,  Ken Amemiya ,  Masahiko Shakuto ,  Toshio Koike ,  Yuji Arai ,  Kaoru Yoshino ,  Takuma Iwasaki

IPC分类号： G03G21/12

CPC分类号： G03G21/12 ,  G03G2215/0888

摘要： A collection container for collecting and containing waste toner includes a leveling member, a detector, and at least one inlet. The leveling member levels the waste toner contained in the collection container. The detector detects an amount of the waste toner contained in the collection container. The leveling member levels the waste toner delivered to the collection container through the at least one inlet by conveying the waste toner simultaneously in a first direction toward the detector and a second direction opposite to the first direction, starting from an origination position corresponding to the at least one inlet.

摘要翻译： 用于收集和容纳废调色剂的收集容器包括调平构件，检测器和至少一个入口。 调平构件使包含在收集容器中的废调色剂水平。 检测器检测包含在收集容器中的废调色剂的量。 调平构件使通过至少一个入口输送到收集容器的废调色剂通过沿着朝向检测器的第一方向同时输送废调色剂并且与从第一方向相反的第二方向输送到收集容器， 最少一个入口

公开(公告)号：US20120098631A1

公开(公告)日：2012-04-26

申请号：US13274832

申请日：2011-10-17

申请人： Hiroshi Ono

发明人： Hiroshi Ono

IPC分类号： H01F27/02

CPC分类号： H01F41/02 ,  H01F3/14 ,  H01F27/02 ,  H01F27/022 ,  H01F27/263 ,  H01F41/00 ,  Y10T29/4902

摘要： An induction device includes a first core, a coil wound around the first core, and a second core cooperating with the first core to form a closed magnetic circuit. The first core and the coil are molded by a mold resin to form a molding, and the second core is assembled to the molding.

摘要翻译： 感应装置包括第一芯，缠绕在第一芯上的线圈，以及与第一芯协作以形成闭合磁路的第二芯。 第一芯和线圈由模制树脂模制以形成模制件，并且第二芯组装成模制件。

公开(公告)号：US08164001B2

公开(公告)日：2012-04-24

申请号：US11986432

申请日：2007-11-21

申请人： Shigeyoshi Yoshida ,  Koichi Kondo ,  Hiroshi Ono ,  Satoshi Arai ,  Tadashi Kubodera

发明人： Shigeyoshi Yoshida ,  Koichi Kondo ,  Hiroshi Ono ,  Satoshi Arai ,  Tadashi Kubodera

IPC分类号： H05K1/03

CPC分类号： H05K1/0233 ,  H05K3/429 ,  H05K2201/086 ,  H05K2201/09309 ,  H05K2203/072 ,  Y10T428/26 ,  Y10T428/31678

摘要： A multilayer printed circuit board includes an inner magnetic layer essentially consisting of magnetic material. The inner magnetic layer may be formed by an action of chemical bond or van der Waals force. The inner magnetic layer may comprise a plurality of magnetic units, each of which provides magnetism, and may be formed by magnetically coupling the magnetic units with each other by using a strong interaction. The inner magnetic layer may essentially consist of a ferrite film. The ferrite film may be formed directly on the inner conductive layer by means of an electroless plating method. The ferrite film may essentially consist of an oxide metal composition, the metal composition being represented by the formula of FeaNibZncCod, where: a+b+c+d=3.0; 2.1≦a≦2.7; 0.1≦b≦0.3; 0.1≦c≦0.7; and 0≦d≦0.15.

摘要翻译： 多层印刷电路板包括基本由磁性材料组成的内部磁性层。 内部磁性层可以通过化学键或范德华力的作用形成。 内磁性层可以包括多个磁性单元，每个磁性单元提供磁性，并且可以通过使用强相互作用将磁性单元彼此磁耦合而形成。 内部磁性层可以基本上由铁氧体膜组成。 铁氧体膜可以通过化学镀方法直接形成在内导电层上。 铁氧体膜可以基本上由氧化物金属组合物组成，金属组成由式FeaNibZncCod表示，其中：a + b + c + d = 3.0; 2.1＆nlE; a＆nlE; 2.7; 0.1＆nlE; b＆nlE; 0.3; 0.1＆nlE; c＆nlE; 0.7; 和0＆nlE; d＆nlE; 0.15。

公开(公告)号：US20120091857A1

公开(公告)日：2012-04-19

申请号：US13235951

申请日：2011-09-19

申请人： Yoichi IKEJI ,  Hiroshi Ono

发明人： Yoichi IKEJI ,  Hiroshi Ono

IPC分类号： H01L41/09 ,  H01L41/053

CPC分类号： G11B5/4873 ,  H01L41/053

摘要： A fitting structure for fitting a piezoelectric element to an actuator base that includes an opening that formed in the actuator base and accommodates the piezoelectric element, a receiver that inwardly protrudes from an inner circumferential edge of the opening and receives the piezoelectric element, a hole defined by an inner end of the receiver and communicates with the opening, a protrusion that protrudes from the inner end of the receiver onto the hole and faces the piezoelectric element through the hole, an adhesive part filled in a space defined by the piezoelectric element, the inner circumferential edge, and the receiver and is solidified in the space to adhere the piezoelectric element to the inner circumferential edge and the receiver, and a stopper formed on one of the receiver and protrusion and stops a capillary phenomenon of the adhesive between the piezoelectric element and the receiver and protrusion.

摘要翻译： 一种用于将压电元件装配到致动器基座的装配结构，该致动器基座包括形成在致动器基座中并容纳压电元件的开口，从开口的内周边缘向内突出并接收压电元件的接收器， 通过所述接收器的内端与所述开口连通，从所述接收器的内端突出到所述孔上且通过所述孔面对所述压电元件的突起，填充在由所述压电元件限定的空间中的粘合部， 内圆周边缘和接收器，并且在空间中固化以将压电元件粘附到内周边缘和接收器，以及形成在接收器和突起中的一个上的止动件，并且阻止压电元件之间的粘合剂的毛细现象 和接收器和突起。

公开(公告)号：US08041280B2

公开(公告)日：2011-10-18

申请号：US12408360

申请日：2009-03-20

申请人： Toshio Koike ,  Hiroyuki Nagashima ,  Nobuo Kuwabara ,  Fumihito Itoh ,  Masahiko Shakuto ,  Ken Amemiya ,  Yuji Arai ,  Michiya Okamoto ,  Hiroshi Ono

发明人： Toshio Koike ,  Hiroyuki Nagashima ,  Nobuo Kuwabara ,  Fumihito Itoh ,  Masahiko Shakuto ,  Ken Amemiya ,  Yuji Arai ,  Michiya Okamoto ,  Hiroshi Ono

IPC分类号： G03G21/00

CPC分类号： G03G21/1814 ,  G03G21/0035

摘要： A lubricant applying unit has a residual-toner collection rate X of 50% when the lubricant applying unit has not been used. The collection rate X is obtained by X=(Ta−Tb)/Ta×100, where Ta is weight per unit area of the residual toner on an area of the image carrier that has not come into contact with the lubricant applying unit, and Tb is weight per unit area of the residual toner on an area of the image carrier that has come into contact with the lubricant applying unit.

摘要翻译： 当未使用润滑剂涂布单元时，润滑剂涂布单元的残留调色剂收集率X为50％。 收集率X通过X =（Ta-Tb）/ Ta×100获得，其中Ta是未与润滑剂施加单元接触的图像载体的区域上残留调色剂的每单位面积的重量， Tb是与润滑剂施加单元接触的图像载体的区域上的残留调色剂的每单位面积的重量。

公开(公告)号：US20110177690A1

公开(公告)日：2011-07-21

申请号：US12737650

申请日：2009-07-23

申请人： Hisataka Minami ,  Ryouta Saisyo ,  Hiroshi Ono

发明人： Hisataka Minami ,  Ryouta Saisyo ,  Hiroshi Ono

IPC分类号： H01L21/306 ,  C09K13/06

CPC分类号： C09K3/1463 ,  B24B37/044 ,  C09G1/02 ,  H01L21/3212 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L29/0657 ,  H01L2224/03616 ,  H01L2224/0401 ,  H01L2224/05026 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/051 ,  H01L2224/05155 ,  H01L2224/05571 ,  H01L2224/05664 ,  H01L2224/11462 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/05552

摘要： The CMP polishing liquid of the present invention contains 1,2,4-triazole, a phosphoric acid, an oxidant, and abrasive particles. The polishing method of the present invention is a substrate polishing method for polishing a substrate with a polishing cloth while supplying a CMP polishing liquid between the substrate and the polishing cloth, in which the substrate is a substrate having a palladium layer, and the CMP polishing liquid is a CMP polishing liquid containing 1,2,4-triazole, a phosphoric acid, an oxidant, and abrasive particles.

摘要翻译： 本发明的CMP抛光液含有1,2,4-三唑，磷酸，氧化剂和磨料颗粒。 本发明的研磨方法是在基板和具有钯层的基板的基板和研磨布之间供给CMP研磨液的同时，用抛光布对基板进行研磨的基板研磨方法， 液体是含有1,2,4-三唑，磷酸，氧化剂和磨料颗粒的CMP抛光液。