公开(公告)号：US20090199999A1

公开(公告)日：2009-08-13

申请号：US11989130

申请日：2006-07-19

申请人： Gerhard Mitic ,  Eckhard Wolfgang

发明人： Gerhard Mitic ,  Eckhard Wolfgang

IPC分类号： F28D15/00 ,  H01R43/00

CPC分类号： H01L23/427 ,  F28D15/0241 ,  F28D15/046 ,  F28D15/06 ,  F28F13/187 ,  H01L23/3735 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  Y10T29/49169 ,  H01L2924/00

摘要： At least one electric component, such as a power semiconductor component, has at least a two-phase cooling device having at least one evaporator. The evaporator has a liquefier with a structured liquefier surface for evaporating a cooling fluid, formed by an electric connecting line making electrical contact with an electric contact face of the component. The connecting line cools the power semiconductor component and a module equipped therewith. Isothermal cooling with a low thermal loading of the power semiconductor component or of the module is possible by virtue of the two-phase cooling device acting as an evaporating bath cooling system. The device is applied in the planar contact-making technology with a large surface by providing an electric component with an electric contact face and producing the electric connecting line to the evaporator surface on the contact face of the component.

摘要翻译： 至少一个电子部件，例如功率半导体部件，具有至少一个具有至少一个蒸发器的两相冷却装置。 蒸发器具有液化器，其具有结构化的液化器表面，用于蒸发由与组件的电接触面电接触的电连接线形成的冷却流体。 连接线冷却功率半导体部件和配备其的模块。 通过用作蒸发浴冷却系统的两相冷却装置，功率半导体部件或模块的热负荷低的等温冷却是可能的。 该装置通过提供具有电接触面的电气部件并且产生到部件的接触面上的蒸发器表面的电连接线，以大的表面施加在平面接触制造技术中。

公开(公告)号：US07466020B2

公开(公告)日：2008-12-16

申请号：US11568087

申请日：2005-04-14

申请人： Dieter Eckardt ,  Carsten Rebbereh

发明人： Dieter Eckardt ,  Carsten Rebbereh

IPC分类号： H01L23/02

CPC分类号： H01L25/18 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/071 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32145 ,  H01L2224/82007 ,  H01L2924/01004 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/30107 ,  H01L2924/00

摘要： The invention relates to a power module comprising a substrate (2), whose surfaces are provided with at least one electrically conductive layer (4, 6), at least one active semiconductor chip (8), which is electrically connected to an electrically conductive layer (6), a film (12) consisting of an electrically conductive material, which is in close contact with the surfaces of the semiconductor chips (8) of the electrically conductive layer (6) and the substrate (2) and is provided with planar printed conductors (16). According to the invention: the module is equipped with a second film (18), which is in close contact with the surfaces of the printed conductors (16) and the first film (12); a passive semiconductor chip (22) is applied to said second film (18), above the active semiconductor chip (8) and is electrically connected to the planar printed conductor (16) lying below by means of a window (14) that is configured in the second film (18); the module is equipped with a third film (24), which is in close contact with the surfaces of the passive semiconductor chip (22) and the second film (18) and said third film (24) is provided with a planar printed conductor (28), which is conductively connected to the conductive layer (6) lying below the active semiconductor chip (8). The invention thus provides a compact power module that can comprise complex topologies.

摘要翻译： 本发明涉及一种功率模块，其包括基板（2），其表面设置有至少一个导电层（4,6），至少一个有源半导体芯片（8），其电连接到导电层 （6），与导电层（6）的半导体芯片（8）的表面和基板（2）紧密接触的由导电材料组成的薄膜（12），并且设置有平面 印刷导体（16）。 根据本发明：模块配备有与印刷导体（16）和第一薄膜（12）的表面紧密接触的第二薄膜（18）。 无源半导体芯片（22）被施加到所述第二膜（18）上方的有源半导体芯片（8）上方并且通过构造在窗口（14）下面的平面印刷导体（16）电连接， 在第二片（18）中; 模块配备有与无源半导体芯片（22）和第二膜（18）的表面紧密接触的第三膜（24），并且所述第三膜（24）设置有平面印刷导体（ 28），其导电地连接到位于有源半导体芯片（8）下方的导电层（6）。 因此，本发明提供了可以包括复杂拓扑的紧凑型功率模块。

公开(公告)号：US20080305582A1

公开(公告)日：2008-12-11

申请号：US11846024

申请日：2007-08-28

申请人： Raymond Albert Fillion ,  Richard Alfred Beaupre ,  Ahmed Elasser ,  Robert John Wojnarowski ,  Charles Steven Korman

发明人： Raymond Albert Fillion ,  Richard Alfred Beaupre ,  Ahmed Elasser ,  Robert John Wojnarowski ,  Charles Steven Korman

IPC分类号： H01L21/50

CPC分类号： H01L23/4821 ,  H01L23/4822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/72 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83801 ,  H01L2224/92144 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor chip packaging structure is fabricated by using a dielectric film with two surfaces, and a power semiconductor chip with an active surface having contact pads. An adhesive layer is used to connect the first surface of the dielectric film and the active surface of the power semiconductor chip. A patterned electrically conductive layer is formed adjacent to the second surface of the film, extending through holes in the film to the contact pads.

摘要翻译： 通过使用具有两个表面的电介质膜和具有接触焊盘的有源表面的功率半导体芯片来制造半导体芯片封装结构。 使用粘合剂层来连接电介质膜的第一表面和功率半导体芯片的有源表面。 形成邻近膜的第二表面的图案化导电层，延伸穿过膜中的孔到接触垫。

公开(公告)号：US07402457B2

公开(公告)日：2008-07-22

申请号：US10491137

申请日：2002-09-25

申请人： Kerstin Häse ,  Laurence Amigues ,  Herbert Schwarzbauer ,  Norbert Seliger ,  Karl Weidner ,  Jörg Zapf ,  Matthias Rebhan

发明人： Kerstin Häse ,  Laurence Amigues ,  Herbert Schwarzbauer ,  Norbert Seliger ,  Karl Weidner ,  Jörg Zapf ,  Matthias Rebhan

IPC分类号： H01L21/00

CPC分类号： H05K3/4605 ,  H01L23/051 ,  H01L23/3735 ,  H01L23/482 ,  H01L24/24 ,  H01L24/82 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/32 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2203/068 ,  H05K2203/085 ,  H05K2203/1469 ,  H01L2924/00 ,  H01L2224/48

摘要： A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.

摘要翻译： 将基于聚酰亚胺或环氧树脂的薄膜在真空下层压到基材的表面上，使得薄膜紧密地覆盖表面并附着在其上。 在表面上形成的接触表面通过打开薄膜中的窗口而被覆盖。 在每个未覆盖的接触表面和一层金属之间以平面方式建立接触。 这就形成了大面积接触，为功率半导体芯片提供高电流密度。

公开(公告)号：US20080110021A1

公开(公告)日：2008-05-15

申请号：US12004431

申请日：2007-12-21

申请人： Masatoshi Akagawa ,  Kazunari Sekigawa ,  Shinichi Wakabayashi

发明人： Masatoshi Akagawa ,  Kazunari Sekigawa ,  Shinichi Wakabayashi

IPC分类号： H01K3/10 ,  G06F19/00

CPC分类号： H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/8203 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/185 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49131 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/53061 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/532 ,  H01L2224/82 ,  H01L2924/00

摘要： An apparatus 1 for fabricating a component-embedded board according to the present invention comprises: a detecting unit 11 for detecting, before the board 21 is covered with an insulating layer 23, the actual position of an electronic component 22 formed on the surface of the board 21; a holding unit 12 for calculating a displacement between the design position of the electronic component 22 and the actual position of the electronic component 22 on the surface of the board 21, and for holding the displacement as displacement data; and a correcting unit 13 for correcting, based on the displacement data, design data to be used for processing the board 21 after the board 21 is covered with the insulating layer 23.

摘要翻译： 根据本发明的用于制造部件嵌入式基板的装置1包括：检测单元11，用于在板21被绝缘层23覆盖之前检测形成在该表面上的电子部件22的实际位置 板21; 用于计算电子部件22的设计位置与电子部件22在电路板21的表面上的实际位置之间的位移并保持位移作为位移数据的保持单元12; 以及校正单元13，用于基于位移数据，校正板21被绝缘层23覆盖之后用于处理板21的设计数据。

公开(公告)号：US07368324B2

公开(公告)日：2008-05-06

申请号：US10547174

申请日：2004-01-15

申请人： Karl Weidner ,  Eckhard Wolfgang ,  Jörg Zapf

发明人： Karl Weidner ,  Eckhard Wolfgang ,  Jörg Zapf

IPC分类号： H01L21/00

CPC分类号： H01L23/4822 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/82001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

摘要： A self-supporting contacting structure is directly produced on a component that does not have a housing by applying a layer made of non conducting material and a layer made of an electrically conductive material to the component and to a support and by subsequently removing these layers from said support.

摘要翻译： 通过将由非导电材料制成的层和由导电材料制成的层施加到组件和支撑件上并随后从其中除去这些层而直接在不具有外壳的部件上产生自支撑接触结构 说支持。

公开(公告)号：US20080013249A1

公开(公告)日：2008-01-17

申请号：US11457318

申请日：2006-07-13

申请人： Henrik Ewe ,  Karl Weidner

发明人： Henrik Ewe ,  Karl Weidner

IPC分类号： H01G4/008

CPC分类号： H01L23/49548 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3135 ,  H01L23/3185 ,  H01L23/49517 ,  H01L23/49562 ,  H01L24/24 ,  H01L24/33 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24246 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/82039 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/8382 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for producing a dielectric layer extending between two or more elements of an electronic component includes arranging a free-standing dielectric layer above the elements and a deformable support layer below the elements. The free-standing dielectric layer is laminated onto at least a portion of the first surface of the first element and onto at least a portion of the first surface of the second element such that a portion of the dielectric layer extends between the first surface of the first element and the first surface of the second element.

摘要翻译： 用于制造在电子部件的两个或更多个元件之间延伸的电介质层的方法包括在元件上方设置独立的电介质层和在元件下面形成可变形的支撑层。 独立电介质层被层压到第一元件的第一表面的至少一部分上并且到达第二元件的第一表面的至少一部分上，使得电介质层的一部分在第一元件的第一表面之间延伸 第一元件和第二元件的第一表面。

公开(公告)号：US20070216025A1

公开(公告)日：2007-09-20

申请号：US11728900

申请日：2007-03-27

申请人： Norbert Seliger ,  Karl Weidner ,  Jorg Zapf

发明人： Norbert Seliger ,  Karl Weidner ,  Jorg Zapf

IPC分类号： H01L23/485

CPC分类号： H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/01004 ,  H01L2924/00015

摘要： A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

摘要翻译： 将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

公开(公告)号：US20070026567A1

公开(公告)日：2007-02-01

申请号：US11421684

申请日：2006-06-01

申请人： Gottfried Beer ,  Christoph Kienmayer ,  Klaus Pressel ,  Werner Simbuerger

发明人： Gottfried Beer ,  Christoph Kienmayer ,  Klaus Pressel ,  Werner Simbuerger

IPC分类号： H01L21/00

CPC分类号： H01L23/66 ,  G01S7/032 ,  G01S19/36 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/96 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/44 ,  H01Q9/0407 ,  H01Q9/0457 ,  H01Q19/00 ,  H01Q21/0087 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module (1) has components (6) for microwave engineering in a plastic casing (7). The semiconductor module (1) has a principal surface (8) with an upper side (9) of a plastic package molding compound (10) and at least one active upper side (11) of a semiconductor chip (12). Disposed on the principal surface (8) is a multilayered conductor track structure (13) which alternately comprises structured metal layers (14, 15) and structured insulation layers (16, 17), where at least one of the insulation layers (16, 17) and/or the plastic package molding compound (10) has at least one microwave insulation region.

摘要翻译： 半导体模块（1）在塑料外壳（7）中具有用于微波工程的部件（6）。 半导体模块（1）具有主表面（8），其具有塑料封装模制化合物（10）的上侧（9）和半导体芯片（12）的至少一个有源上侧面（11）。 设置在主表面（8）上的是多层导体轨道结构（13），其交替地包括结构化金属层（14,15）和结构化绝缘层（16,17），其中至少一个绝缘层（16,17） ）和/或塑料包装模塑料（10）具有至少一个微波绝缘区域。

公开(公告)号：US20060290009A1

公开(公告)日：2006-12-28

申请号：US11497169

申请日：2006-08-01

申请人： Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani

发明人： Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani

IPC分类号： H01L23/48

CPC分类号： H05K3/328 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/94 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/0373 ,  H05K3/20 ,  H05K3/326 ,  H05K3/4614 ,  H05K3/4626 ,  H05K2201/091 ,  H05K2201/10674 ,  H01L2224/97 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05144 ,  H01L2924/00014 ,  H01L2224/05147

摘要： A semiconductor device (1) of the present invention includes a semiconductor element (103) including electrode parts (104), and a wiring substrate (108) including an insulation layer (101), electrode-part-connection electrodes (102) provided in the insulation layer (101), and external electrodes (107) that is provided in the insulation layer (101) and that is connected electrically with the electrode-part-connection electrodes (102), in which the electrode parts (104) and the electrode-part-connection electrodes (102) are connected electrically with each other. The insulation layer (101) has an elastic modulus measured according to JIS K6911 of not less than 0.1 GP a and not more than 5 GPa, and the electrodes (104) and the electrode-part-connection electrodes (102) are connected by metal joint.

摘要翻译： 本发明的半导体器件（1）包括包括电极部分（104）的半导体元件（103）和包括绝缘层（101）的布线基板（108），电极部分连接电极（102） 绝缘层（101）和设置在绝缘层（101）中并与电极部分连接电极（102）电连接的外部电极（107），其中电极部分（104）和 电极部分连接电极（102）彼此电连接。 绝缘层（101）具有根据JIS K6911测定的弹性模量为0.1GPa以上且5GPa以下，电极（104）和电极部连接用电极（102）通过金属 联合。