公开(公告)号：US20030146266A1

公开(公告)日：2003-08-07

申请号：US10060812

申请日：2002-02-01

Inventor： Arun K. Chaudhuri ,  Frank Stepniak ,  Matthew R. Walsh

IPC: B23K001/00

CPC classification number: H05K3/321 ,  C08L63/00 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H05K3/3489 ,  H05K2201/0218 ,  H05K2203/0425

Abstract: A conductive adhesive material characterized by metallurgical bonds between electrically-conductive particles dispersed in a polymer matrix of the material. The polymer matrix has a fluxing capability when heated to reduce metal oxides on the surfaces of the particles. At least the outer surfaces of the particles are formed of a fusible material, so that sufficiently heating the conductive adhesive material will reduce metal oxides on the particles, and at least partially melt the fusible metal, enabling the particles to metallurgically bond to each other and to metal surfaces contacted by the adhesive material.

Abstract translation: 导电粘合剂材料，其特征在于分散在材料的聚合物基质中的导电颗粒之间的冶金结合。 聚合物基质在加热时具有助熔能力，以减少颗粒表面上的金属氧化物。 至少颗粒的外表面由可熔材料形成，使得充分加热导电粘合剂材料将减少颗粒上的金属氧化物，并且至少部分地熔化可熔金属，使得颗粒彼此冶金结合， 与由粘合剂材料接触的金属表面。

公开(公告)号：US20020175316A1

公开(公告)日：2002-11-28

申请号：US10087913

申请日：2002-03-05

Applicant: Fujitsu Limited

Inventor： Kozo Shimizu ,  Yasuo Yamagishi

IPC: H01B001/00 ,  H01C001/00

CPC classification number: H01B1/22 ,  H01B1/02 ,  H01C7/005 ,  H01C7/008 ,  H01C17/06526 ,  H01C17/06586 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K3/321 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2203/0425 ,  Y10T428/2982 ,  Y10T428/2991

Abstract: A conductive composition layer, conductive particles as a raw material, a conductive composition therefor, a manufacturing method of the conductive composition layer, etc. are provided wherewith heat conductance can be accelerated between electronic devices or electronic devices can be electrically connected. The conductive composition layer is formed by subjecting to heat treatment at a temperature lower than 230null C. a conductive composition comprising conductive particles having a metal base material and a metal coating material thereon as well as a thermosetting resin having a curing temperature that is lower than 230null C. and/or a thermoplastic resin having a melting point that is lower than 230null C.

Abstract translation: 中，提供了用那个热导的导电颗粒作为原料，其的导电性组合物，所述导电性组合物层的制造方法等的导电组合物层可以电子设备或电子设备之间的加速可以电连接。 导电性组合物层是通过对在低于230℃的导电性组合物，其包括具有金属基体材料和其上的金属涂层材料以及具有固化温度是低的热固性树脂的导电性粒子的温度下进行热处理形成的 大于230℃和/或具有熔点的热塑性树脂，其低于230℃

公开(公告)号：US20020102432A1

公开(公告)日：2002-08-01

申请号：US09993615

申请日：2001-11-27

Applicant: Fujitsu Limited

Inventor： Masayuki Ochiai ,  Yasuo Yamagishi ,  Hiroki Uchida ,  Masayuki Kitajima ,  Masakazu Takesue ,  Tadaaki Shono

IPC: B32B015/20

CPC classification number: B23K35/025 ,  B23K35/0244 ,  B23K35/262 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10689 ,  H05K2203/0545 ,  Y10T428/12063 ,  Y10T428/12882

Abstract: A solder paste, includes a flux, a solder alloy particle scattered or mixed in the flux and including Sn and Zn as composition elements, and a metal particle scattered or mixed in the flux and including an element in the IB group in the periodic table as a composition element.

Abstract translation: 焊膏包括焊剂，焊剂中散布或混合的焊料合金颗粒，并且包括作为组成元素的Sn和Zn，以及在焊剂中散布或混合的金属颗粒，并且包括周期表中的IB组中的元素作为 组成元素。

公开(公告)号：US06199751B1

公开(公告)日：2001-03-13

申请号：US09533196

申请日：2000-03-23

Applicant: Michael A. Gaynes ,  Kostas I. Papathomas ,  Giana M. Phelan ,  Charles G. Woychik

Inventor： Michael A. Gaynes ,  Kostas I. Papathomas ,  Giana M. Phelan ,  Charles G. Woychik

IPC: B23K2000

CPC classification number: H01L24/31 ,  B23K35/0244 ,  B23K35/26 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2203/0425 ,  Y10T428/12014 ,  Y10T428/12181 ,  Y10T428/12569 ,  Y10T428/12646 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase. The polymer containing particles is placed between the two metal surfaces with the particles interfacing with each other and the surface layer of metal. The structure is heated to a temperature higher than the low melting liquid constituent to form a liquid phase which extends to include the surface of the pads and the surface of the particles, and thereafter form a solid phase by diffusion of the core material into the surface material and the base metal into the coating material.

Abstract translation: 提供了在两个表面上的焊盘之间形成冶金结合的技术。 放置在每个表面上的金属涂层包括第一金属基底层和第二金属表面层。 第一和第二种金属包括低熔点成分。 两种金属的第一比率形成液相，其中第二比例的两种金属形成固相。 基底层金属的体积超过在母材和表面金属之间形成固相所需的体积。 提供导电金属颗粒，其具有分散在未固化的聚合物材料中的芯金属和涂覆金属，其体积分数高于渗滤阈值。 核心金属和涂覆金属一起包括低熔点成分。 以第一比例，组分形成液相，并且以第二比例，两种组分形成固相。 含有聚合物的颗粒被放置在两个金属表面之间，其中颗粒彼此接合并且金属的表面层。 将该结构加热到比低熔点液体成分高的温度，形成液相，其延伸以包括焊盘的表面和颗粒的表面，然后通过将芯材扩散到表面中而形成固相 材料和贱金属进入涂料。

公开(公告)号：US5962133A

公开(公告)日：1999-10-05

申请号：US981565

申请日：1997-12-19

Applicant: Atsushi Yamaguchi ,  Kenichiro Suetsugu ,  Tetsuo Fukushima ,  Akio Furusawa

Inventor： Atsushi Yamaguchi ,  Kenichiro Suetsugu ,  Tetsuo Fukushima ,  Akio Furusawa

IPC: B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H01L23/495 ,  H05K3/24 ,  H05K3/34 ,  B32B5/16 ,  B32B15/00

CPC classification number: H05K3/244 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/26 ,  H01L23/49582 ,  H05K3/3463 ,  H05K3/3484 ,  B23K35/025 ,  H01L2924/0002 ,  H05K2201/0218 ,  H05K2201/10636 ,  H05K2203/0425 ,  H05K3/3421 ,  Y02P70/611 ,  Y10T428/24917 ,  Y10T428/2938 ,  Y10T428/294 ,  Y10T428/2951 ,  Y10T428/2991

Abstract: The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).

Abstract translation: PCT No.PCT / JP96 / 01680 Sec。 371 1997年12月19日第 102（e）1997年12月19日PCT PCT 1996年6月19日PCT公布。 出版物WO97 / 00753 日期1997年1月9日通过提高粘合强度的润湿性，并且能够使焊料逐渐熔化，从而降低部分切屑剥离的发生。 提供了具有更高性能和更高可靠性的焊料，电子元件和电子电路板。 焊料芯，引线框架表面和电子部件的电极表面以及电子电路板的铜（Cu）表面的表面涂覆有铟（In）或铋（Bi）的金属元素。

公开(公告)号：US5225966A

公开(公告)日：1993-07-06

申请号：US735231

申请日：1991-07-24

Applicant: Nagesh R. Basavanhally ,  Benjamin H. Cranston

Inventor： Nagesh R. Basavanhally ,  Benjamin H. Cranston

IPC: H01B1/22 ,  H01B5/16 ,  H01L21/60 ,  H01R4/04 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/38

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L24/31 ,  H01R4/04 ,  H05K3/323 ,  H01L2224/29101 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/30107 ,  H05K1/181 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0266 ,  H05K2201/10719 ,  H05K3/3473 ,  H05K3/386

Abstract: A compliant element (23, 25) is provided between an integrated circuit (11) and a substrate (19) which are bonded and interconnected by an anisotropic conductive adhesive (20) comprising conductive particles (21) in a polymer matrix (22). In one embodiment, one set of bonding pads (12, FIG. 2) is coated with a layer (23) of a metal that is significantly softer than the metal from which the conductive particles are made, which permits an oversized conductive particle (21a) to indent into the soft metal layer (23). In another embodiment, one of the sets of bonding pads (15, FIG. 3) is arranged on a relatively thick layer of adhesive (25) which is sufficiently viscous at the temperature at which contact is made to permit the bonding pad (15) to pivot in response to pressure from an oversized conductive particle (21d).

Abstract translation: 柔性元件（23,25）设置在集成电路（11）和基板（19）之间，所述集成电路（11）和基板（19）通过在聚合物基体（22）中包含导电颗粒（21）的各向异性导电粘合剂（20）结合并互连。 在一个实施例中，一组接合焊盘（图2中的12）涂覆有金属层（23），其比制成导电颗粒的金属显着更软，这允许过大的导电颗粒（21a ）压入软金属层（23）中。 在另一个实施例中，一组接合焊盘（图3中的15个）布置在相对较厚的粘合剂层25上，粘合剂层25在接触的温度下具有足够的粘性以允许接合焊盘（15） 响应于来自过大导电颗粒（21d）的压力而枢转。

公开(公告)号：US5183593A

公开(公告)日：1993-02-02

申请号：US533682

申请日：1990-06-04

Applicant: David Durand ,  David P. Vieau ,  Tai S. Wei ,  Ang-Ling Chu

Inventor： David Durand ,  David P. Vieau ,  Tai S. Wei ,  Ang-Ling Chu

IPC: C08K3/08 ,  C08G59/00 ,  C08K3/02 ,  C08K7/00 ,  C08K9/02 ,  C08L63/00 ,  C08L75/00 ,  C08L75/04 ,  C08L83/04 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K3/321 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K3/0023

Abstract: An electrically conductive cement which when used to bond electrically conductive mating surfaces provides substantially stable conductivity characteristics under high humidity conditions; comprised of a carrier that provides a volumetric shrinkage of more than about 6.8% (vol.) and a conductive filler including agglomerates, particles, powders, flakes, coated nickel particles, and coated glass spheres, having size and surface characteristics that maintain stable electrical contact by forming a moisture resistant contact with an electrical component lead. The carrier having a volumetric shrinkage between the uncured and cured states of greater than about 6.8% (vol) appears to effect a compaction of the filler particles causing the particles to be forced into enhanced electrical contact with the surfaces to be connected and to provide a measure of compaction between the particles themselves to enhance particle-to-particle conduction. The shrinkage of the polymeric carrier during curing places the interior particles under compression with sufficient force to urge the particles into engagement with one another as well as to cause the particles to penetrate non-conductive oxides that may be present on a component lead.

Abstract translation: 用于粘合导电配合表面的导电胶粘剂在高湿度条件下提供基本稳定的导电特性; 包括提供超过约6.8％（体积）的体积收缩率的载体和包含附聚物，颗粒，粉末，薄片，涂覆的镍颗粒和涂覆的玻璃球的导电填料，其具有保持稳定的电气的尺寸和表面特性 通过与电气部件引线形成防潮接触来进行接触。 具有大于约6.8％（vol）的未固化状态和固化状态之间的体积收缩率的载体似乎会影响填料颗粒的压实，导致颗粒被强制与要连接的表面增强的电接触并提供一种 测量颗粒本身之间的压实度以增强颗粒到颗粒的传导。 在固化期间聚合物载体的收缩使内部颗粒在足够的压力下被压缩以促使颗粒彼此接合，并且使颗粒渗透可能存在于组分引线上的非导电氧化物。

公开(公告)号：US4902857A

公开(公告)日：1990-02-20

申请号：US290611

申请日：1988-12-27

Applicant: Benjamin H. Cranston ,  Lloyd Shepherd

Inventor： Benjamin H. Cranston ,  Lloyd Shepherd

IPC: C08L63/00 ,  C08L83/04 ,  H01B5/00 ,  H01B5/16 ,  H01B13/00 ,  H01L21/52 ,  H01R4/02 ,  H01R11/01 ,  H05K3/32

CPC classification number: H01R4/02 ,  H05K3/323 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29355 ,  H01L2224/29388 ,  H01L2224/29399 ,  H01L2224/294 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2201/10674 ,  H05K2203/0425 ,  Y10T29/49201 ,  Y10T428/256 ,  Y10T428/2991

Abstract: A conductive polymer interconnect structure (10) is comprised of an insulative polymer (18), a silicone or an epoxy, having a plurality of particles (20) arranged therein to provide conductive paths which extend in the z direction. At least a portion of those particles (20) proximate a separate one of the major surfaces of the matrix has at least a portion thereof coated with a solder 24 whose composition is tailored to melt below the cure temperature of the matrix (18). In this way, when the matrix (18) is sandwiched between a pair of conductive members (12 and 14) and the matrix is cured, a metallurgical bond, rather than a mechanical bond, will be formed between the members.

Abstract translation: 导电聚合物互连结构（10）由绝缘聚合物（18），硅树脂或环氧树脂组成，其中布置有多个颗粒（20）以提供在z方向上延伸的导电路径。 靠近基质的主要表面之一的那些颗粒（20）的至少一部分具有涂覆有焊料24的至少一部分，焊料24的组成被定制成低于基体（18）的固化温度。 以这种方式，当基体（18）夹在一对导电构件（12和14）之间并且基体固化时，将在构件之间形成冶金结合而不是机械结合。

公开(公告)号：US09914855B2

公开(公告)日：2018-03-13

申请号：US14620576

申请日：2015-02-12

Applicant: HENKEL AG & CO. KGAA

Inventor： Anja Henckens ,  Nabila Idrissi

IPC: C09J9/02 ,  C09J5/06 ,  C09J11/04 ,  H05K3/32 ,  C09J163/00 ,  B32B37/12 ,  B32B37/18 ,  C09J133/00 ,  C08K3/08 ,  C08K3/10 ,  H01R4/04 ,  H05K1/05 ,  H05K3/36

CPC classification number: C09J9/02 ,  B32B37/1284 ,  B32B37/18 ,  C08K3/08 ,  C08K3/10 ,  C09J5/06 ,  C09J11/04 ,  C09J133/00 ,  C09J163/00 ,  C09J2203/322 ,  C09J2400/163 ,  C09J2433/00 ,  H01R4/04 ,  H05K1/053 ,  H05K3/321 ,  H05K3/368 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: The present invention relates to curable compositions that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The curable compositions comprise a) one or more curable resins; b) composite particles, which comprise i) an electrically conductive core, and ii) an electrically conductive shell, comprising one or more shell materials each selected from the group consisting of metal carbides, metal sulfides, metal borides, metal silicides, and metal nitrides; and c) electrically conductive particles different from component b). The present invention further relates to a method of bonding a first substrate to a second substrate, wherein the substrates are bonded under heat and pressure using said curable composition.

公开(公告)号：US09869025B2

公开(公告)日：2018-01-16

申请号：US14943861

申请日：2015-11-17

Applicant: BYD COMPANY LIMITED

Inventor： Qing Gong ,  Wei Zhou ,  Weifeng Miao

IPC: C23C18/38 ,  C01G19/02 ,  C01G31/00 ,  C08K3/22 ,  C09D11/03 ,  C23C18/16 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  C23C18/20 ,  B29C37/00 ,  C23C18/28 ,  C01G19/00 ,  C01G30/00 ,  C01G39/00 ,  B29C35/08

CPC classification number: C23C18/1608 ,  B29C37/0025 ,  B29C2035/0838 ,  B29C2035/0872 ,  B29C2035/0877 ,  C01G19/006 ,  C01G19/02 ,  C01G30/002 ,  C01G31/00 ,  C01G39/00 ,  C01P2002/50 ,  C01P2002/52 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C08K3/22 ,  C08K2003/2231 ,  C08K2003/2255 ,  C09D11/03 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/285 ,  C23C18/38 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/185 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0236 ,  H05K2203/107

Abstract: Embodiments of the present disclosure are directed to a doped tin oxide. The doped tin oxide includes a tin oxide and at least one oxide of a doping element. The doping element includes at least one of vanadium and molybdenum. The doped tin oxide includes an amount of the tin oxide ranging from 90 mol % to 99 mol %, and an amount of the at least one oxide ranging from 1 mol % to 10 mol %.