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    Printed circuit board with heat spreader and method of making
    76.
    发明授权
    Printed circuit board with heat spreader and method of making 有权
    带散热片的印刷电路板及其制作方法

    公开(公告)号：US06448509B1

    公开(公告)日：2002-09-10

    申请号：US09505395

    申请日：2000-02-16

    申请人： Ronald P. Huemoeller

    发明人： Ronald P. Huemoeller

    IPC分类号： H01R1204

    CPC分类号： H05K3/445 ,  H01L21/4857 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/427 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A method of making a PCB having an integral heat spreader and/or central ground plane includes forming one or more first openings in a first layer of a metal at selected locations and filling the. openings with an electrically insulating material. The first sheet is laminated between second and third layers of a metal interleaved with first and second layers of a dielectric material. At least one second opening is formed through the insulating material in one of the first openings, and at least one third opening is formed in the laminate at a position displaced from the first openings. The upper and lower layers of metal are electrically connected to each other through the at least one second and third openings to define “vias” through the laminate. The vias comprise “clearance vias” from which the first metal sheet is electrically isolated, and “thermal vias” to which the first metal sheet is electrically connected. The thermally enhanced PCB is fabricated using only conventional PCB fabrication techniques.

    摘要翻译： 一种制造具有整体散热器和/或中心接地平面的PCB的方法包括在选定位置的金属的第一层中形成一个或多个第一开口并填充。 具有电绝缘材料的开口。 第一片层压在与介电材料的第一和第二层交错的金属的第二和第三层之间。 在第一开口之一中通过绝缘材料形成至少一个第二开口，并且在离开第一开口的位置处在层叠体中形成至少一个第三开口。 金属的上层和下层通过至少一个第二和第三开口彼此电连接以限定通过层压体的“通路”。 通孔包括第一金属片电隔离的“间隙通孔”和第一金属片电连接到的“热通孔”。 热增强型PCB仅使用传统的PCB制造技术制造。

    Capacitor laminate for use in printed circuit board and as an interconnector
    78.
    发明授权
    Capacitor laminate for use in printed circuit board and as an interconnector 有权
    电容层压板用于印刷电路板和互连器

    公开(公告)号：US06370012B1

    公开(公告)日：2002-04-09

    申请号：US09652596

    申请日：2000-08-30

    申请人： Sylvia Adae-Amoakoh ,  John M. Lauffer ,  Michael D. Lowell ,  Voya R. Markovich ,  Joseph J. Sniezek

    发明人： Sylvia Adae-Amoakoh ,  John M. Lauffer ,  Michael D. Lowell ,  Voya R. Markovich ,  Joseph J. Sniezek

    IPC分类号： H01G4228

    CPC分类号： H05K1/053 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/162 ,  H05K3/403 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0338 ,  H05K2201/0919 ,  H05K2201/10378 ,  H05K2203/0315 ,  Y10T29/417 ,  H01L2924/00

    摘要： A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e.g., chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layer's outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.

    摘要翻译： 能够形成较大的电路板或类似结构的内部部分以提供电容的并联电容器结构。 或者，电容器可以用作互连器以互连两个不同的电子部件（例如，芯片载体，电路板，甚至半导体芯片），同时仍然为一个或多个所述部件提供期望的电容水平。 电容器包括至少一个内部导电层，在内部导体的相对侧上添加两个附加的导体层，以及无机介电材料（优选地，在第二导体层的外表面上的氧化物层或适用于诸如钛酸钡的适当介电材料 第二导体层）。 此外，电容器包括无机介电材料顶部的外部导体层，从而在内部和附加的导电层和外部导体之间形成并联的电容器。

    PLATED THROUGH-HOLES FOR SIGNAL INTERCONNECTIONS IN AN ELECTRONIC COMPONENT ASSEMBLY
    80.
    发明申请
    PLATED THROUGH-HOLES FOR SIGNAL INTERCONNECTIONS IN AN ELECTRONIC COMPONENT ASSEMBLY 失效
    电子元器件组件中信号互连的通孔

    公开(公告)号：US20020012229A1

    公开(公告)日：2002-01-31

    申请号：US09393889

    申请日：1999-09-10

    发明人： GARY J. SCHREFFLER

    IPC分类号： H05K007/20

    CPC分类号： H05K3/445 ,  H05K3/427 ,  H05K2203/143

    摘要： The present invention is directed to an electronic component assembly and method of manufacture which can be efficiently implemented and which reduces the amount of work required to create a plated through-hole for connecting one circuit to another circuit in an electronic component assembly. During electronic component assembly fabrication, at least a portion of an inner core of the electronic component assembly's heat sink assembly is replaced with a dielectric nullzone.null Once the electronic component assembly is manufactured, connections from one circuit on one side of the electronic component assembly to another circuit on the other side of the electronic component assembly can be achieved using plated through-holes. As such, circuit boards can be connected on opposite sides of the electronic component assembly without having to perform the labor intensive connection of circuits through the use of discrete wires or printed flexes.

    摘要翻译： 本发明涉及一种电子部件组件和制造方法，其可以被有效地实现，并且减少了创建用于将一个电路连接到电子部件组件中的另一个电路的电镀通孔所需的工作量。 在电子部件组装制造期间，电子部件组件的散热器组件的内芯的至少一部分被电介质“区域”所取代。 一旦制造了电子部件组件，就可以使用电镀通孔来实现从电子部件组件的一侧的一个电路到电子部件组件的另一侧的另一个电路的连接。 因此，电路板可以连接在电子部件组件的相对侧上，而不必通过使用分立的电线或印刷的弯曲来执行电路的劳动密集连接。