公开(公告)号：US20120061132A1

公开(公告)日：2012-03-15

申请号：US13373388

申请日：2011-11-14

申请人： Myung Sam Kang ,  Jeong Woo Park ,  Ok Tae Kim ,  Kil Yong Yun

发明人： Myung Sam Kang ,  Jeong Woo Park ,  Ok Tae Kim ,  Kil Yong Yun

IPC分类号： H05K1/09 ,  H05K1/11 ,  H05K1/02

CPC分类号： H05K1/111 ,  H05K1/09 ,  H05K1/115 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/0323 ,  H05K2203/0376 ,  Y02P70/611 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

摘要： A printed circuit board having a metal bump, including: an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; wherein the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer.

摘要翻译： 一种具有金属凸块的印刷电路板，包括：上电路层，包括嵌入在绝缘层的上部的电路图案，所述电路图案由导电金属制成; 其中所述金属凸块与所述电路图形一体地形成并且从所述电路图案突出并且在所述绝缘层上方突出。

公开(公告)号：US08039762B2

公开(公告)日：2011-10-18

申请号：US12379056

申请日：2009-02-11

申请人： Myung Sam Kang

发明人： Myung Sam Kang

IPC分类号： H05K1/11

CPC分类号： H05K1/111 ,  H01L2924/0002 ,  H05K3/205 ,  H05K3/28 ,  H05K3/3473 ,  H05K2201/0376 ,  H05K2201/09472 ,  H05K2201/09736 ,  Y02P70/611 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

摘要： Disclosed is a printed circuit board having a buried solder bump, in which a circuit pattern and a solder bump formed on the circuit pattern are buried in an insulating layer, thus improving the degree of matching between the solder bump and the circuit pattern and obviating a need for an additional coining process of the solder bump. A manufacturing method thereof is also provided.

摘要翻译： 公开了一种具有掩埋焊料凸块的印刷电路板，其中形成在电路图案上的电路图案和焊料凸块被掩埋在绝缘层中，从而提高了焊料凸块与电路图案之间的匹配程度，并且消除了 需要额外的冲压焊过程。 还提供了其制造方法。

公开(公告)号：US20110061905A1

公开(公告)日：2011-03-17

申请号：US12654446

申请日：2009-12-18

申请人： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

发明人： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

IPC分类号： H05K1/03 ,  H05K3/36

CPC分类号： H05K3/10 ,  H05K1/0271 ,  H05K1/09 ,  H05K3/4602 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/068 ,  H05K2201/09136

摘要： There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.

摘要翻译： 提供了印刷电路板。 印刷电路板可以被构造为包括：芯层，其中至少两层的弯曲防止部分插入在多个绝缘构件之间并且包括具有不同热膨胀系数的金属层; 形成为在芯层的内部和芯层的外表面中的至少一个上具有期望图案的电路图案; 以及形成在芯层上并包括露出电路图案的开口部分的绝缘层，以及制造印刷电路板的方法。 根据上述印刷电路板和印刷电路板的制造方法，通过在印刷电路板内设置弯曲防止部，能够提高进度和生产率的印刷电路板，以及制造印刷电路板的方法 可以提供印刷电路板。

公开(公告)号：US20100255634A1

公开(公告)日：2010-10-07

申请号：US12801574

申请日：2010-06-15

申请人： Jung-Hyun Park ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Hoe-Ku Jung ,  Ji-Eun Kim

发明人： Jung-Hyun Park ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Hoe-Ku Jung ,  Ji-Eun Kim

IPC分类号： H01L21/60 ,  H01L21/50

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A manufacturing method of bottom substrate of package. A bottom substrate of a package on package electrically connected to a top substrate by means of a solder ball, including a core board, a solder ball pad formed on a surface of the core board in correspondence with a location of the solder ball, an insulation layer laminated on the core board, a through hole formed by removing a part of the insulation layer such that the solder ball pad is exposed, and a metallic layer filled in the through hole and connected electrically with the solder ball, allows the number of ICs mounted on a bottom substrate to be increased without increasing the size of a solder ball, and allows the size and pitch of the solder balls to be made smaller by controlling the thickness of the insulation layer laminated on the bottom substrate, whereby more signal transmission is possible between a top substrate and a bottom substrate.

摘要翻译： 封装底部基板的制造方法。 封装的封装的底部衬底通过焊球电连接到顶部衬底，所述焊球包括芯板，与所述焊球的位置对应地形成在所述芯板的表面上的焊球焊盘，绝缘体 层叠在芯板上的通孔，通过去除绝缘层的一部分使得焊球焊盘露出而形成的通孔以及填充在通孔中并与焊球电连接的金属层允许IC的数量 安装在底部基板上以增加焊球的尺寸，并且通过控制层叠在底部基板上的绝缘层的厚度，可以使焊球的尺寸和间距变小，由此更多的信号传输是 可能在顶部基板和底部基板之间。

公开(公告)号：US07802358B2

公开(公告)日：2010-09-28

申请号：US12453832

申请日：2009-05-22

申请人： Hoe-Ku Jung ,  Myung-Sam Kang ,  Jung-Hyun Park

发明人： Hoe-Ku Jung ,  Myung-Sam Kang ,  Jung-Hyun Park

IPC分类号： H05K3/00

CPC分类号： H05K3/4691 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/183 ,  H05K1/189 ,  H05K3/4623 ,  H05K2201/055 ,  H05K2201/09536 ,  H05K2201/10515 ,  H05K2203/049 ,  H05K2203/063 ,  Y10T29/49124 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method for rigid-flexible multi-layer printed circuit board including: a flexible substrate of which circuits are formed on both sides and which is bendable; a rigid substrate which is laminated on the flexible substrate and circuits are formed on both sides and a cavity within which a semiconductor chip is mounted is formed; and a bonding sheet adhering the flexible substrate and the rigid substrate and having a insulating property. When the same numbers of the semiconductor chips are mounted or the POP is embodied, the whole thickness of the package can be lower. Also, two more semiconductor chips can be mounted using the space as the thickness of the core layer, and the structure impossible when the number of semiconductor chip mounted on the bottom substrate becomes two from one in conventional technology can be embodied.

摘要翻译： 一种刚性柔性多层印刷电路板的制造方法，包括：柔性基板，其两侧形成有可弯曲的电路; 层叠在柔性基板上的刚性基板和电路形成在两侧，并且形成有安装半导体芯片的空腔; 以及粘合柔性基板和刚性基板并具有绝缘性的粘合片。 当安装相同数量的半导体芯片或实施POP时，封装的整体厚度可以更低。 此外，可以使用空间作为芯层的厚度来安装另外两个半导体芯片，并且可以实现当传统技术中安装在底部基板上的半导体芯片的数量变为二倍时的结构是不可能的。

公开(公告)号：US20100193232A1

公开(公告)日：2010-08-05

申请号：US12424511

申请日：2009-04-15

申请人： Myung Sam Kang ,  Ok Tae Kim ,  Gil Yong Shin ,  Kil Yong Yun

发明人： Myung Sam Kang ,  Ok Tae Kim ,  Gil Yong Shin ,  Kil Yong Yun

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K3/4084 ,  H05K3/205 ,  H05K3/328 ,  H05K2201/091 ,  H05K2203/063 ,  H05K2203/1115 ,  H05K2203/1572 ,  Y10T29/49155

摘要： Disclosed herein are a printed circuit board and a process of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and circuit layers disposed at both sides of the insulating layer, each of the circuit layers including a land part and a pattern part. The land parts formed on both sides of the insulating layer are coupled to each other using electrical resistance welding. There is no need for a separate interlayer connection structure such as vias or bumps and a process of forming the interlayer connection structure, thus simplifying the printed circuit board and the process.

摘要翻译： 这里公开了印刷电路板和制造印刷电路板的工艺。 印刷电路板包括绝缘层和设置在绝缘层两侧的电路层，每个电路层包括焊盘部分和图案部分。 形成在绝缘层两侧的接地部分使用电阻焊接彼此连接。 不需要诸如通孔或凸块的单独的层间连接结构和形成层间连接结构的过程，因此简化了印刷电路板和工艺。

公开(公告)号：US20100018633A1

公开(公告)日：2010-01-28

申请号：US12408366

申请日：2009-03-20

申请人： Myung-Sam KANG ,  Jung-Hyun PARK ,  Jeong-Woo PARK ,  Ji-Eun KIM

发明人： Myung-Sam KANG ,  Jung-Hyun PARK ,  Jeong-Woo PARK ,  Ji-Eun KIM

IPC分类号： B32B37/00

CPC分类号： B32B38/04 ,  B32B38/10 ,  B32B2038/0092 ,  B32B2038/047 ,  B32B2309/105 ,  B32B2310/0843 ,  B32B2457/08 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4652 ,  H05K2201/0376 ,  H05K2203/0384 ,  H05K2203/0554 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/1064 ,  Y10T156/1082

摘要： Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for connecting one layer to another layer can include forming a circuit pattern on one surface of a carrier; processing a hole corresponding to the via on one surface of the carrier; compressing the surface of the carrier into one surface of an insulation body; removing the carrier; processing a via hole on the insulation body, corresponding to a position of the hole; and forming a conductive material in the via hole, to thereby easily process a hole for forming a via and have high design freedom

摘要翻译： 公开了印刷电路板的制造方法。 制造具有用于将一层连接到另一层的通路的印刷电路板的制造方法可以包括在载体的一个表面上形成电路图案; 在载体的一个表面上处理与通孔对应的孔; 将载体的表面压缩到绝缘体的一个表面中; 移除载体; 处理绝缘体上的通孔，对应于孔的位置; 并且在通孔中形成导电材料，从而容易地加工用于形成通孔的孔，并且具有高的设计自由度

公开(公告)号：US20090324992A1

公开(公告)日：2009-12-31

申请号：US12320011

申请日：2009-01-14

申请人： Myung-Sam Kang

发明人： Myung-Sam Kang

IPC分类号： B32B15/04 ,  C25D5/10 ,  C25D5/12 ,  B32B37/10 ,  B32B37/06

CPC分类号： H05K3/0035 ,  B32B15/14 ,  B32B15/20 ,  B32B2038/0076 ,  B32B2250/40 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/076 ,  B32B2311/00 ,  B32B2457/00 ,  B32B2535/00 ,  C25D5/12 ,  C25D5/48 ,  H05K3/0038 ,  H05K3/025 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2203/0361 ,  H05K2203/1388 ,  Y10T29/49165 ,  Y10T428/1275 ,  Y10T428/12778

摘要： A metal clad laminate and a method of manufacturing the metal clad laminate are disclosed. The metal clad laminate can include a barrier layer made of a metallic material, a metal foil formed on one side of the barrier layer and coupled with the barrier layer by plating, and an insulator attached to the metal foil. By utilizing the metal clad laminate, the metal foil can be prevented from being perforated when processing a via hole using laser, so that a VOP structure may be implemented with a higher level of reliability.

摘要翻译： 公开了一种覆金属层压板及其制造方法。 金属覆层压板可以包括由金属材料制成的阻挡层，在阻挡层的一侧上形成的金属箔，并且通过电镀与阻挡层耦合，以及附着在金属箔上的绝缘体。 通过利用金属覆层叠体，可以防止在使用激光加工通孔时能够对金属箔进行穿孔，从而可以以更高的可靠性实现VOP结构。

公开(公告)号：US20090101510A1

公开(公告)日：2009-04-23

申请号：US12314783

申请日：2008-12-16

申请人： Myung Sam Kang

发明人： Myung Sam Kang

IPC分类号： C25D5/02

CPC分类号： H05K3/205 ,  H05K3/421 ,  H05K3/428 ,  H05K2201/0376 ,  H05K2203/0156 ,  H05K2203/0353 ,  H05K2203/0376 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention relates to a high density printed circuit board and a method of manufacturing the same which enable a thin printed circuit board to be manufactured and can overcome problems occurring in a conventional method of manufacturing a printed circuit board because a conventional CCL is not used as a raw material. The high density printed circuit board includes a first insulating layer having a constant thickness, and a pair of first circuit layers embedded in two sides of the first insulating layer, respectively.

摘要翻译： 高密度印刷电路板及其制造方法技术领域本发明涉及能够制造薄印刷电路板的高密度印刷电路板及其制造方法，并且可克服传统的印刷电路板的制造方法中出现的问题，因为不使用传统的CCL 作为原料。 高密度印刷电路板包括具有恒定厚度的第一绝缘层和分别嵌入第一绝缘层两侧的一对第一电路层。

公开(公告)号：US20080264676A1

公开(公告)日：2008-10-30

申请号：US11976207

申请日：2007-10-22

申请人： Shuhichi Okabe ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jeong-Woo Park ,  Ji-Eun Kim

发明人： Shuhichi Okabe ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jeong-Woo Park ,  Ji-Eun Kim

IPC分类号： H05K1/00

CPC分类号： H05K1/0265 ,  H05K1/116 ,  H05K3/107 ,  H05K3/108 ,  H05K3/205 ,  H05K3/421 ,  H05K2201/0379 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09736 ,  H05K2203/0361

摘要： A method of manufacturing a circuit board that includes: forming a conductive relievo pattern, including a first plating layer, a first metal layer, and a second plating layer stacked sequentially in correspondence with a first circuit pattern, on a seed layer stacked on a carrier; stacking and pressing together the carrier and an insulator, such that a surface of the carrier having the conductive relievo pattern faces the insulator; transcribing the conductive relievo pattern into the insulator by removing the carrier; forming a conduction pattern, including a third plating layer and a second metal layer stacked sequentially in correspondence with a second circuit pattern, on the surface of the insulator having the conductive relievo pattern transcribed; removing the first plating layer and seed layer; and removing the first and second metal layers, can provide a circuit board that has high-density circuit patterns without an increased amount of insulator.

摘要翻译： 一种电路板的制造方法，其特征在于，包括：在堆叠在载体上的种子层上，形成导电消除图案，所述导电解像图案包括依次与第一电路图案对应地层叠的第一镀层，第一金属层和第二镀层 ; 将载体和绝缘体堆叠并压在一起，使得具有导电缓冲图案的载体的表面面向绝缘体; 通过移除载体将导电释放图案转印到绝缘体中; 在具有转印的导电消除图案的绝缘体的表面上形成包括与第二电路图案顺序堆叠的第三镀层和第二金属层的导电图案; 去除第一镀层和籽晶层; 并且去除第一和第二金属层可以提供具有高密度电路图案而不增加绝缘体量的电路板。