公开(公告)号：US08866294B2

公开(公告)日：2014-10-21

申请号：US13536177

申请日：2012-06-28

Applicant: Reza A. Pagaila ,  Yaojian Lin ,  Jun Mo Koo

Inventor： Reza A. Pagaila ,  Yaojian Lin ,  Jun Mo Koo

IPC: H01L23/36

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3677 ,  H01L24/19 ,  H01L24/48 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/20 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device has a semiconductor die with a plurality of bumps formed over a surface of the first semiconductor die. A penetrable adhesive layer is formed over a temporary carrier. The adhesive layer can include a plurality of slots. The semiconductor die is mounted to the carrier by embedding the bumps into the penetrable adhesive layer. The semiconductor die and interconnect structure can be separated by a gap. An encapsulant is deposited over the first semiconductor die. The bumps embedded into the penetrable adhesive layer reduce shifting of the first semiconductor die while depositing the encapsulant. The carrier is removed. An interconnect structure is formed over the semiconductor die. The interconnect structure is electrically connected to the bumps. A thermally conductive bump is formed over the semiconductor die, and a heat sink is mounted to the interconnect structure and thermally connected to the thermally conductive bump.

Abstract translation: 半导体器件具有形成在第一半导体管芯的表面上的多个凸点的半导体管芯。 在临时载体上形成可穿透的粘合剂层。 粘合剂层可以包括多个槽。 通过将凸块嵌入到可穿透的粘合剂层中，将半导体管芯安装到载体上。 半导体管芯和互连结构可以通过间隙分开。 密封剂沉积在第一半导体管芯上。 嵌入可渗透粘合剂层中的凸起减少了第一半导体管芯的移动，同时沉积密封剂。 载体被移除。 在半导体管芯上形成互连结构。 互连结构电连接到凸块。 导热凸块形成在半导体管芯上，并且散热器安装到互连结构并热连接到导热凸块。

公开(公告)号：US20130001771A1

公开(公告)日：2013-01-03

申请号：US13607204

申请日：2012-09-07

Applicant: Reza A. Pagaila ,  Yaojian Lin ,  Jun Mo Koo

Inventor： Reza A. Pagaila ,  Yaojian Lin ,  Jun Mo Koo

IPC: H01L23/48

CPC classification number: H01L21/561 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/13 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68359 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16265 ,  H01L2224/48227 ,  H01L2224/73209 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor die has first and second discrete semiconductor components mounted over a plurality of wettable contact pads formed on a carrier. Conductive pillars are formed over the wettable contact pads. A semiconductor die is mounted to the conductive pillars over the first discrete components. The conductive pillars provide vertical stand-off of the semiconductor die as headroom for the first discrete components. The second discrete components are disposed outside a footprint of the semiconductor die. Conductive TSV can be formed through the semiconductor die. An encapsulant is deposited over the semiconductor die and first and second discrete components. The wettable contact pads reduce die and discrete component shifting during encapsulation. A portion of a back surface of the semiconductor die is removed to reduce package thickness. An interconnect structure is formed over the encapsulant and semiconductor die. Third discrete semiconductor components can be mounted over the semiconductor die.

Abstract translation: 半导体管芯具有安装在形成在载体上的多个可湿性接触焊盘上的第一和第二分立半导体部件。 导电柱形成在可湿性接触垫上。 半导体管芯通过第一分立元件安装到导电柱上。 导电柱提供半导体管芯的垂直间隔作为第一分立元件的余量。 第二分立元件设置在半导体管芯的占位面之外。 可以通过半导体管芯形成导电TSV。 密封剂沉积在半导体管芯和第一和第二分立元件上。 可湿式接触垫在封装期间减少管芯和分立元件的移动。 去除半导体管芯的后表面的一部分以减小封装厚度。 在密封剂和半导体管芯上形成互连结构。 第三分立半导体部件可以安装在半导体管芯上。

公开(公告)号：US20120074585A1

公开(公告)日：2012-03-29

申请号：US13184253

申请日：2011-07-15

Applicant: Jun Mo Koo ,  Pandi Chelvam Marimuthu ,  Jae Hun Ku ,  Seung Wook Yoon

Inventor： Jun Mo Koo ,  Pandi Chelvam Marimuthu ,  Jae Hun Ku ,  Seung Wook Yoon

IPC: H01L23/48 ,  H01L21/56

CPC classification number: H01L21/76898 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81411 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/83

Abstract: A semiconductor device has a substrate with first and second opposing surfaces. A plurality of conductive vias is formed partially through the first surface of the substrate. A first conductive layer is formed over the first surface of the substrate electrically connected to the conductive vias. A first semiconductor die is mounted over the first surface of the substrate. The first semiconductor die and substrate are mounted to a carrier. An encapsulant is deposited over the first semiconductor die, substrate, and carrier. A portion of the second surface of the substrate is removed to expose the conductive vias. An interconnect structure is formed over a surface of the substrate opposite the first semiconductor die. A second semiconductor die can be stacked over the first semiconductor die. A second semiconductor die can be mounted over the first surface of the substrate adjacent to the first semiconductor die.

Abstract translation: 半导体器件具有带有第一和第二相对表面的衬底。 多个导电通孔部分地形成在衬底的第一表面上。 在与导电通孔电连接的基板的第一表面上形成第一导电层。 第一半导体管芯安装在衬底的第一表面上。 第一半导体管芯和衬底安装到载体上。 密封剂沉积在第一半导体管芯，衬底和载体上。 去除衬底的第二表面的一部分以露出导电通孔。 在与第一半导体管芯相对的衬底的表面上形成互连结构。 第二半导体管芯可以堆叠在第一半导体管芯上。 第二半导体管芯可以安装在与第一半导体管芯相邻的衬底的第一表面上。

公开(公告)号：US20120049344A1

公开(公告)日：2012-03-01

申请号：US12868334

申请日：2010-08-25

Applicant: Reza A. Pagaila ,  Yaojian Lin ,  Jun Mo Koo

Inventor： Reza A. Pagaila ,  Yaojian Lin ,  Jun Mo Koo

IPC: H01L23/498 ,  H01L21/50

CPC classification number: H01L21/561 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/13 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68359 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16265 ,  H01L2224/48227 ,  H01L2224/73209 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor die has first and second discrete semiconductor components mounted over a plurality of wettable contact pads formed on a carrier. Conductive pillars are formed over the wettable contact pads. A semiconductor die is mounted to the conductive pillars over the first discrete components. The conductive pillars provide vertical stand-off of the semiconductor die as headroom for the first discrete components. The second discrete components are disposed outside a footprint of the semiconductor die. Conductive TSV can be formed through the semiconductor die. An encapsulant is deposited over the semiconductor die and first and second discrete components. The wettable contact pads reduce die and discrete component shifting during encapsulation. A portion of a back surface of the semiconductor die is removed to reduce package thickness. An interconnect structure is formed over the encapsulant and semiconductor die. Third discrete semiconductor components can be mounted over the semiconductor die.

Abstract translation: 半导体管芯具有安装在形成在载体上的多个可湿性接触焊盘上的第一和第二分立半导体部件。 导电柱形成在可湿性接触垫上。 半导体管芯通过第一分立元件安装到导电柱上。 导电柱提供半导体管芯的垂直间隔作为第一分立元件的余量。 第二分立元件设置在半导体管芯的占位面之外。 可以通过半导体管芯形成导电TSV。 密封剂沉积在半导体管芯和第一和第二分立元件上。 可湿式接触垫在封装期间减少管芯和分立元件的移动。 去除半导体管芯的后表面的一部分以减小封装厚度。 在密封剂和半导体管芯上形成互连结构。 第三分立半导体部件可以安装在半导体管芯上。

公开(公告)号：US08009971B2

公开(公告)日：2011-08-30

申请号：US11958413

申请日：2007-12-18

Applicant: Jun-Mo Koo ,  Jin-Young Choi ,  Byung-Kwon Kang ,  Dong-Hoon Jang ,  Pyo-Jae Kim ,  Dong-Sung Song ,  Hyung-Jin Chang

Inventor： Jun-Mo Koo ,  Jin-Young Choi ,  Byung-Kwon Kang ,  Dong-Hoon Jang ,  Pyo-Jae Kim ,  Dong-Sung Song ,  Hyung-Jin Chang

IPC: G03B17/00 ,  H04N5/228 ,  G05B13/02

CPC classification number: H04N5/23248 ,  H04N5/23258 ,  H04N5/23287

Abstract: A hand-shake correction apparatus and method for a camera module for typical use in a mobile device. A camera unit includes an angular velocity sensor for sensing an angular velocity of a hand-shake motion of a camera, a position detection sensor for detecting a current position of an image sensor, and an actuator for actuating the image sensor. An Optical Image Stabilizer (OIS) circuit unit controls the actuator using a multi-rate Proportional Integrate Derivative (PID) control scheme that performs control a plurality of times using a shorter control period compared with existing PID controls for a basic period, in which a reference value is updated according to a control reference value by which the image sensor optimally shifts to correct a hand-shake motion.

Abstract translation: 一种用于移动设备中典型应用的相机模块的手抖校正装置和方法。 相机单元包括用于感测照相机的手抖动作的角速度的角速度传感器，用于检测图像传感器的当前位置的位置检测传感器和用于致动图像传感器的致动器。 光学图像稳定器（OIS）电路单元使用多比例比例积分微分（PID）控制方案来控制致动器，该控制方案使用比基本周期的现有PID控制更短的控制周期来执行多次控制，其中 参考值根据图像传感器最佳偏移的控制参考值更新，以校正手抖动作。

公开(公告)号：US07489340B2

公开(公告)日：2009-02-10

申请号：US11076382

申请日：2005-03-09

Applicant: Jun-Mo Koo ,  Myoung-Won Kim ,  Byung-Kwon Kang

Inventor： Jun-Mo Koo ,  Myoung-Won Kim ,  Byung-Kwon Kang

IPC: H04N5/228

CPC classification number: H04N5/23248 ,  G02B13/001 ,  G02B27/646 ,  H04N5/2253 ,  H04N5/23287

Abstract: Disclosed is an optical image stabilizer for use with a camera lens assembly. The optical image stabilizer including a fixable substrate; a movable substrate movably disposed on the fixable substrate, a fixable comb structure fixed on the fixable substrate and disposed on the movable substrate, and a movable comb structure disposed on the movable substrate and capable of moving on the fixable substrate with the movable substrate, wherein the movable substrate is moved by an attraction force acting between the fixable comb structure and the movable comb structure, when an electromotive force is applied to the fixable comb structure and the movable comb structure. In the optical image stabilizer, the movable substrate on which an image sensor is disposed and the elements for moving the movable substrate are manufactured using MEMS technology, thereby facilitating downsizing of optical image stabilizers and improving the precision of products.

Abstract translation: 公开了一种用于照相机镜头组件的光学图像稳定器。 所述光学图像稳定器包括可固定基板; 可移动地可移动地设置在可固定基板上的可移动基板，固定在可固定基板上并设置在可移动基板上的可固定梳状结构，以及设置在可移动基板上并且能够利用可移动基板在可固定基板上移动的可动梳状结构，其中 当电动势被施加到可固定梳状结构和可动梳状结构时，可移动衬底被作用在可固定梳状结构和可动梳状结构之间的吸引力移动。 在光学图像稳定器中，使用MEMS技术制造其上设置有图像传感器的可移动基板和用于移动可移动基板的元件，从而有助于光学图像稳定器的小型化并提高产品的精度。

公开(公告)号：US07254122B2

公开(公告)日：2007-08-07

申请号：US10436362

申请日：2003-05-13

Applicant: An Na Choi ,  Jae Hwang Yu ,  Jun Mo Koo ,  Byung Moo Kim

Inventor： An Na Choi ,  Jae Hwang Yu ,  Jun Mo Koo ,  Byung Moo Kim

IPC: H04B7/216

CPC classification number: H04B7/2628

Abstract: An apparatus for generating pilot beacon signals for handoff between base stations having a different frequency assignment FA in a code division multiple access CDMA radio communication system includes a PN code generating unit for generating inphase (I)-channel and quadrature (Q)-channel pseudo noise (PN) sequences; a pulse shaping unit for shaping an I-channel and Q-channel PN signal by filtering the I-channel and Q-channel PN sequences; an equalizing unit for equalizing phases of the I-channel PN signal and the Q-channel PN signal and generating an equalized I-channel signal and an equalized Q-channel signal; an interpolation filtering unit for converting frequencies of the equalized I-channel signal with the equalized Q-channel signal to intermediate frequencies (IF) and generating an IF I-channel signal and an IF Q-channel signal; a modulation unit for modulating IF I-channel and Q-channel signals and generating a modulated I-channel signal and a modulated Q-channel signal; a combining unit for combining the modulated Q-channel signal and generating a digital pilot beacon signal; and a D/A conversion unit for converting the digital beacon signal into an analog pilot beacon signal.

Abstract translation: 一种用于在码分多址CDMA无线电通信系统中生成具有不同频率分配FA的基站之间切换的导频信标信号的装置，包括：PN码产生单元，用于产生同相（I）信道和正交（Q）信道伪 噪声（PN）序列; 脉冲整形单元，用于通过对I信道和Q信道PN序列进行滤波来对I信道和Q信道PN信号进行整形; 均衡单元，用于均衡I信道PN信号和Q信道PN信号的相位，并产生均衡的I信道信号和均衡的Q信道信号; 内插滤波单元，用于将均衡的I信道信号的频率与均衡的Q信道信号转换成中频（IF），并产生IF I信道信号和IF Q信道信号; 调制单元，用于调制IF I信道和Q信道信号并产生调制的I信道信号和调制的Q信道信号; 组合单元，用于组合调制的Q信道信号并产生数字导频信标信号; 以及用于将数字信标信号转换为模拟导频信标信号的D / A转换单元。

公开(公告)号：US20060092514A1

公开(公告)日：2006-05-04

申请号：US11076382

申请日：2005-03-09

Applicant: Jun-Mo Koo ,  Myoung-Won Kim ,  Byung-Kwon Kang

Inventor： Jun-Mo Koo ,  Myoung-Won Kim ,  Byung-Kwon Kang

IPC: G02B27/64

CPC classification number: H04N5/23248 ,  G02B13/001 ,  G02B27/646 ,  H04N5/2253 ,  H04N5/23287

Abstract: Disclosed is an optical image stabilizer for use with a camera lens assembly. The optical image stabilizer including a fixable substrate; a movable substrate movably disposed on the fixable substrate, a fixable comb structure fixed on the fixable substrate and disposed on the movable substrate, and a movable comb structure disposed on the movable substrate and capable of moving on the fixable substrate with the movable substrate, wherein the movable substrate is moved by an attraction force acting between the fixable comb structure and the movable comb structure, when an electromotive force is applied to the fixable comb structure and the movable comb structure. In the optical image stabilizer, the movable substrate on which an image sensor is disposed and the elements for moving the movable substrate are manufactured using MEMS technology, thereby facilitating downsizing of optical image stabilizers and improving the precision of products.

公开(公告)号：US06516007B1

公开(公告)日：2003-02-04

申请号：US09307745

申请日：1999-05-10

Applicant: Een Kee Hong ,  Dong Do Lee ,  Jun Mo Koo ,  Sang Yon Lee ,  Sung Jae Lee

Inventor： Een Kee Hong ,  Dong Do Lee ,  Jun Mo Koo ,  Sang Yon Lee ,  Sung Jae Lee

IPC: H04J306

CPC classification number: H04W56/0005 ,  H04B7/2681

Abstract: A transmission method using synchronous reverse links establishes synchronization by controlling transmission times of mobile stations according to synchronization control messages received through a control channel and then controlling the transmission times according to synchronization control bits received through a traffic channel.

Abstract translation: 使用同步反向链路的传输方法通过根据通过控制信道接收的同步控制消息来控制移动台的传输时间，然后根据通过业务信道接收到的同步控制比特来控制传输时间来建立同步。

公开(公告)号：US08993377B2

公开(公告)日：2015-03-31

申请号：US13231839

申请日：2011-09-13

Applicant: Jun Mo Koo ,  Pandi C. Marimuthu ,  Seung Wook Yoon ,  Il Kwon Shim

Inventor： Jun Mo Koo ,  Pandi C. Marimuthu ,  Seung Wook Yoon ,  Il Kwon Shim

IPC: H01L21/56 ,  H01L25/07 ,  H01L23/00 ,  H01L21/683 ,  H01L21/768 ,  H01L25/065 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L24/96 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/3107 ,  H01L23/3128 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02317 ,  H01L2224/02372 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06131 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/21 ,  H01L2224/2105 ,  H01L2224/215 ,  H01L2224/22 ,  H01L2224/221 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/48105 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/95001 ,  H01L2224/96 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/01014 ,  H01L2924/0665 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: A semiconductor wafer has first and second opposing surfaces. A plurality of conductive vias is formed partially through the first surface of the semiconductor wafer. The semiconductor wafer is singulated into a plurality of first semiconductor die. The first semiconductor die are mounted to a carrier. A second semiconductor die is mounted to the first semiconductor die. A footprint of the second semiconductor die is larger than a footprint of the first semiconductor die. An encapsulant is deposited over the first and second semiconductor die and carrier. The carrier is removed. A portion of the second surface is removed to expose the conductive vias. An interconnect structure is formed over a surface of the first semiconductor die opposite the second semiconductor die. Alternatively, a first encapsulant is deposited over the first semiconductor die and carrier, and a second encapsulant is deposited over the second semiconductor die.

Abstract translation: 半导体晶片具有第一和第二相对表面。 多个导电通孔部分地形成在半导体晶片的第一表面上。 将半导体晶片分割成多个第一半导体管芯。 第一半导体管芯安装到载体上。 第二半导体管芯安装到第一半导体管芯。 第二半导体管芯的占地面积大于第一半导体管芯的占地面积。 密封剂沉积在第一和第二半导体管芯和载体上。 载体被移除。 去除第二表面的一部分以暴露导电通孔。 在与第二半导体管芯相对的第一半导体管芯的表面上形成互连结构。 或者，第一密封剂沉积在第一半导体管芯和载体上，并且第二密封剂沉积在第二半导体管芯上。