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23 条记录 (耗时 0.026 秒)

    Method of making a substrate having selectively releasing conductive runners
    1.
    发明授权
    Method of making a substrate having selectively releasing conductive runners 失效
    制造具有选择性释放导电流道的基板的方法

    公开(公告)号：US5338391A

    公开(公告)日：1994-08-16

    申请号：US134447

    申请日：1993-10-12

    申请人： Anthony B. Suppelsa ,  William B. Mullen, III ,  Glenn F. Urbish

    发明人： Anthony B. Suppelsa ,  William B. Mullen, III ,  Glenn F. Urbish

    IPC分类号： C23C14/02 ,  H01L21/48 ,  H01L21/60 ,  H05K3/38 ,  H05K3/40 ,  B44C1/22 ,  C23F1/00

    CPC分类号： H01L24/81 ,  C23C14/025 ,  H01L21/4846 ,  H05K3/4092 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/388

    摘要： A selectively releasing runner and substrate assembly (10) comprises a plurality of conductive runners (16) adhered to a substrate (12). A portion (18) of at least some of the conductive runners have a lower adhesion to the substrate for selectively releasing the conductive runner from the substrate when subjected to thermal stress. The selectively releasing runner and substrate assembly is made by selectively depositing an adhesion layer (14) of a first metal to portions of the surface of the substrate where maximum adhesion is desired. The other portions of the substrate are not covered with the first metal. The first metal layer and the uncovered portions of the substrate surface are covered with a second metal layer (16). The adhesion of the second metal layer to the substrate is less than the adhesion of the second metal layer to the first metal layer, and less than the adhesion of the first metal layer tot he substrate. The second metal layer may be copper. Additionally, an electronic component (22), such as an integrated circuit, may be attached to the selectively releasing metal portion.

    摘要翻译： 选择性释放流道和基底组件（10）包括粘附到基底（12）的多个导电流道（16）。 至少一些导电流道的一部分（18）对基底具有较低的粘合力，用于当受到热应力时从基底中选择性地释放导电流道。 通过选择性地将第一金属的粘合层（14）沉积到需要最大粘合力的基底表面的部分上来制备选择性释放流道和基底组件。 基板的其它部分不被第一金属覆盖。 衬底表面的第一金属层和未覆盖部分被第二金属层（16）覆盖。 第二金属层对基板的粘合力小于第二金属层与第一金属层的密合性，小于第一金属层与基板的粘合性。 第二金属层可以是铜。 此外，诸如集成电路的电子部件（22）可以附接到选择性释放金属部分。

    High density electrical lead
    4.
    发明授权
    High density electrical lead 失效
    高密度电铅

    公开(公告)号：US4598972A

    公开(公告)日：1986-07-08

    申请号：US689493

    申请日：1985-01-07

    申请人： William B. Mullen, III ,  Glenn F. Urbish

    发明人： William B. Mullen, III ,  Glenn F. Urbish

    IPC分类号： H01R13/11 ,  H01R13/115 ,  H05K7/10 ,  H01R11/22

    CPC分类号： H01R13/112 ,  H05K7/1053

    摘要： An improved electronic clip-on lead is disclosed. It is comprised of an elongated shaft suitable for electrical connection having a front spring finger extending from one end. A rear bracing member is positioned behind and parallel to the front spring finger by a support structure which fixes the displacement of the rear bracing member to the front spring finger.

    摘要翻译： 公开了一种改进的电子夹式引线。 它由适合于电连接的细长轴组成，具有从一端延伸的前弹簧指。 后支撑构件通过将后支撑构件的位移固定到前弹簧指的支撑结构定位在前弹簧手指的后方并平行。

    Moldable/foldable radio housing
    5.
    发明授权
    Moldable/foldable radio housing 失效
    可成型/可折叠收音机外壳

    公开(公告)号：US4939792A

    公开(公告)日：1990-07-03

    申请号：US121323

    申请日：1987-11-16

    申请人： Glenn F. Urbish ,  John M. McKee ,  Martin J. McKinley ,  Anthony B. Suppelsa

    发明人： Glenn F. Urbish ,  John M. McKee ,  Martin J. McKinley ,  Anthony B. Suppelsa

    IPC分类号： H04B1/08 ,  H04B7/26 ,  H04Q7/14 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K7/06

    CPC分类号： H05K3/326 ,  H04B1/08 ,  H05K1/0278 ,  H05K1/119 ,  H05K1/189 ,  H05K2201/0129 ,  H05K2201/0191 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/10037 ,  H05K2201/10053 ,  H05K2201/10136 ,  H05K2201/10598 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/325

    摘要： A molded thermoplastic housing (100) includes base (102) and cover (104) members joined by a living hinge (106). The base member (102) includes a peripheral wall (108). Four solderable printed circuit patterns (112, 114, 116 and 118) are vacuum deposited onto the interior and exterior surfaces of both housing members. The printed circuit patterns on opposing surfaces of the base and cover members are joined by conductive through-holes (e.g., 120 and 122), while the printed circuit patterns on the interior surfaces of the base and cover members are joined by an interconnecting printed circuit pattern (124) which is vacuum deposited onto the living hinge. Mylar sheets (132) are adhered to the exterior surface of the housing to insulate the exterior printed circuit patterns. An antenna pattern (126) is also vacuum deposited onto an exterior surface of the housing. A switch (136) and battery contact (152) are integrally formed with the housing and an integrally molded structural support means strenghthens the housing members. The housing is manufactured "opened up" and, at the final assembly stage, the cover member is rotated about the hinge until it contacts the upper surface of the peripheral wall (108B). Snap-fit connectors (e.g., 110) join the cover to the base.

    摘要翻译： 模制的热塑性外壳（100）包括由活动铰链（106）连接的基座（102）和盖（104）构件。 基部构件（102）包括周壁（108）。 四个可焊接印刷电路图案（112,114,116和118）被真空沉积到两个壳体构件的内表面和外表面上。 基座和盖构件的相对表面上的印刷电路图案通过导电通孔（例如，120和122）连接，而基座和盖构件的内表面上的印刷电路图案通过互连印刷电路 图案（124），其被真空沉积到活动铰链上。 聚酯薄膜片（132）粘附到外壳的外表面以使外部印刷电路图案绝缘。 天线图案（126）也被真空沉积到外壳的外表面上。 开关（136）和电池触点（152）与壳体一体地形成，并且整体模制的结构支撑装置加强了壳体构件。 壳体被制造为“开放”，并且在最终组装阶段，盖构件围绕铰链旋转直到其接触周壁（108B）的上表面。 卡扣连接器（例如，110）将盖连接到基座。

    Process for photoimaging a three dimensional printed circuit substrate
    9.
    发明授权
    Process for photoimaging a three dimensional printed circuit substrate 失效
    用于三维印刷电路基板的光学成像的方法

    公开(公告)号：US5001038A

    公开(公告)日：1991-03-19

    申请号：US121326

    申请日：1987-11-16

    申请人： Dale W. Dorinski ,  M. William Branan, Jr. ,  Glenn F. Urbish ,  Anthony B. Suppelsa ,  Martin J. McKinley ,  Douglas W. Hendricks

    发明人： Dale W. Dorinski ,  M. William Branan, Jr. ,  Glenn F. Urbish ,  Anthony B. Suppelsa ,  Martin J. McKinley ,  Douglas W. Hendricks

    IPC分类号： G03F7/20 ,  H05K1/00 ,  H05K3/00

    CPC分类号： G03F7/70283 ,  G03F7/20 ,  G03F7/2022 ,  G03F7/70333 ,  G03F7/70466 ,  H05K3/0082 ,  H05K1/0284 ,  H05K2203/056 ,  H05K3/0002

    摘要： Printed circuit patterns are photolithographically defined on a three dimensional "projection" surface (204) of a printed circuit substrate (202) using a projection image aligner and a photomask (210) having a planar image (210A). The geometry of the projection is restricted such that the slope of the projection surface, as measured at any point on the projection surface and relative to a reference plane which is parallel to the focal plane of the projection image aligner, is less than 90 degrees. A solution of photoresist includes a photoresist solvent, a fluorosurfactant and an aromatic hydrocarbon solvent, and is preferably sprayed over the projection surface. In one method of manufacture, the printed circuit substrate is moved from one position to another during the exposure of the photoresist layer (206). In another method, after a first portion of the projection surface is exposed by a first photomask (502), a second photomask (504) is substituted and the remainder of the projection surface exposed. In still another method, a photomask having a plurality of planar images (604A, 604B and 606A) each image being positioned parallel to the others but separated by a small distance, is used to simultaneously exposed the entire projection surface.

    摘要翻译： 使用投影图像对准器和具有平面图像（210A）的光掩模（210）将印刷电路图案光刻地限定在印刷电路基板（202）的三维“投影”表面（204）上。 突起的几何形状受到限制，使得投影表面的倾斜度（在投影表面上的任何点上相对于平行于投影图像对准器的焦平面的参考平面）测得的小于90度。 光致抗蚀剂溶液包括光致抗蚀剂溶剂，含氟表面活性剂和芳族烃溶剂，并且优选地喷射在投影表面上。 在一种制造方法中，在光致抗蚀剂层（206）的曝光期间，印刷电路基板从一个位置移动到另一个位置。 在另一种方法中，在投影表面的第一部分被第一光掩模（502）暴露之后，替换第二光掩模（504），并且突出表面的其余部分被暴露。 在另一种方法中，使用具有多个平面图像（604A，604B和606A）的光掩模，每个图像平行于另一个平行而被分开一小段距离，以同时曝光整个投影表面。

    Ultra thin radio housing with integral antenna
    10.
    发明授权
    Ultra thin radio housing with integral antenna 失效
    超薄无线电外壳，带集成天线

    公开(公告)号：US4894663A

    公开(公告)日：1990-01-16

    申请号：US121322

    申请日：1987-11-16

    申请人： Glenn F. Urbish ,  Quirino Balzano ,  Dale W. Dorinski ,  Martin J. McKinley ,  Leng H. Ooi ,  John A. Stoutland ,  Anthony B. Suppelsa

    发明人： Glenn F. Urbish ,  Quirino Balzano ,  Dale W. Dorinski ,  Martin J. McKinley ,  Leng H. Ooi ,  John A. Stoutland ,  Anthony B. Suppelsa

    IPC分类号： H01Q1/24 ,  H01Q7/00 ,  H05K1/00 ,  H05K1/16

    CPC分类号： H01Q7/00 ,  H01Q1/243 ,  H05K1/0284 ,  H05K1/16

    摘要： The preferred housing includes an integrally molded thermoplastic base (102) and cover (104) assembly. The cover is joined to the base by a living hinge (106) and a peripheral wall (108) extends around the perimeter of the base. In one embodiment, the antenna is a wire loop (204), the wire being wound in an external circumferential groove (202A) in the peripheral wall or, alternatively, integrally molded into the peripheral wall. Other embodiments use printed circuit loop antenna patterns that are preferably vacuum deposited directly onto the thermoplastic base and/or cover. When the antenna pattern is disposed on both the cover and the base, a portion of the antenna (e.g., 1002K) is also disposed on the hinge to join the main portions of the antenna on the base and cover. In one embodiment of the printed circuit loop antenna, the plane of the loop lies parallel to the base and may include one or more turns or loops (e.g., 402C, E, G and J). In another embodiment, the loop includes a 90 degree bend (e.g., 504) and both planes of the loop lie perpendicular to the base. In still another embodiment, the loop includes three 90 degree bends, a crossover at one of the bends (e.g., at 704), and all four planes of the loop lie perpendicular to the base.

    摘要翻译： 优选的壳体包括整体模制的热塑性基座（102）和盖（104）组件。 盖通过活动铰链（106）连接到基部，并且周壁（108）围绕基部的周边延伸。 在一个实施例中，天线是线环（204），线缠绕在周壁中的外周凹槽（202A）中，或者整体模制成周壁。 其他实施例使用优选地真空地直接沉积到热塑性基底和/或盖上的印刷电路环形天线图案。 当天线图案设置在盖和底座上时，天线的一部分（例如，1002K）也设置在铰链上，以将天线的主要部分连接在基座和盖上。 在印刷电路环形天线的一个实施例中，环的平面平行于基部并且可以包括一个或多个匝或环（例如，402C，E，G和J）。 在另一个实施例中，环包括90度弯曲（例如504），并且环的两个平面垂直于基部。 在另一个实施例中，环路包括三个90度弯曲部，在一个弯曲处（例如，在704处）的交叉，并且环的所有四个平面垂直于基部。