公开(公告)号：US06856017B2

公开(公告)日：2005-02-15

申请号：US09442038

申请日：1999-11-17

Applicant: Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

Inventor： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

IPC: H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L21/683 ,  H01L23/31 ,  H01L25/10 ,  H01L29/06 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L23/04

CPC classification number: H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67138 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85664 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.

Abstract translation: 一种包括芯片的装置和密封芯片的树脂封装，树脂封装具有位于树脂封装的安装侧表面上的树脂突起。 金属膜分别设置在树脂突起上。 连接部件电连接芯片的电极焊盘和金属膜。

公开(公告)号：US5804468A

公开(公告)日：1998-09-08

申请号：US561421

申请日：1995-11-21

Applicant: Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Michio Sono ,  Ichiro Yamaguchi ,  Toshio Hamano ,  Yoshihiro Kubota ,  Michio Hayakawa ,  Yoshihiko Ikemoto ,  Yukio Saigo ,  Naomi Miyaji

Inventor： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Michio Sono ,  Ichiro Yamaguchi ,  Toshio Hamano ,  Yoshihiro Kubota ,  Michio Hayakawa ,  Yoshihiko Ikemoto ,  Yukio Saigo ,  Naomi Miyaji

IPC: H01L23/057 ,  H01L23/10 ,  H01L23/433 ,  H01L23/495 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60

CPC classification number: H01L23/057 ,  H01L23/10 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/49 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011

Abstract: A process for manufacturing semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.

Abstract translation: 一种半导体装置的半导体器件的制造方法，其中半导体器件被封装在其中，包括基底，并且在基底的表面上形成金属膜。 半导体芯片形成在金属膜上。 形成在半导体芯片上的焊盘通过导线连接到金属膜。 在金属膜上形成密封层。 导线形成在玻璃层上。 在金属膜上形成连接层，并含有导电粒子。 连接层与用于电源系统的引线接触并将金属膜连接到引线。

公开(公告)号：US06777250B1

公开(公告)日：2004-08-17

申请号：US09686958

申请日：2000-10-12

Applicant: Shinsuke Nakajyo ,  Yoshiyuki Yoneda ,  Hideharu Sakoda

Inventor： Shinsuke Nakajyo ,  Yoshiyuki Yoneda ,  Hideharu Sakoda

IPC: H01L2166

CPC classification number: H01L22/20 ,  H01L2223/5448 ,  H01L2224/274

Abstract: A method of manufacturing semiconductor device in the method of manufacturing wafer level semiconductor device that can search the defective products from the marking information even when sealing resin is formed on the wafer and a semiconductor device manufactured with the same method. A method of manufacturing wafer level semiconductor comprises a process to seal with a resin material the surface of wafer having the front surface and rear surface and forming a plurality of semiconductor chips on the front surface, a first marking process for marking the position information corresponding to each chip to the region of each chip at the rear surface of the wafer, a process for performing the electrical test to each chip, a second marking process for marking the result of the electrical test to the region of each chip at the rear surface of the wafer and a dicing process for dicing the wafer to each chip.

公开(公告)号：US06573121B2

公开(公告)日：2003-06-03

申请号：US09809105

申请日：2001-03-16

Applicant: Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

Inventor： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

IPC: H01L2144

CPC classification number: H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/01004 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts. Outer circumference surfaces of the resin package are upright surfaces defined by cutting.

公开(公告)号：US06376921B1

公开(公告)日：2002-04-23

申请号：US09192201

申请日：1998-11-16

Applicant: Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

Inventor： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

IPC: H01L2328

CPC classification number: H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/01004 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts.

Abstract translation: 半导体器件包括半导体元件，密封半导体元件的树脂封装，从树脂封装的安装表面向下突出的树脂突起，设置在树脂突起上的金属膜部分和将半导体元件电连接到金属膜的连接构件 部分。

公开(公告)号：US5656550A

公开(公告)日：1997-08-12

申请号：US611007

申请日：1996-03-05

Applicant: Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Eiji Watanabe ,  Seiichi Orimo ,  Masanori Onodera ,  Masaki Waki

Inventor： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Eiji Watanabe ,  Seiichi Orimo ,  Masanori Onodera ,  Masaki Waki

IPC: H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495 ,  H01L21/60

CPC classification number: H01L24/49 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  Y10T29/49121

Abstract: This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device has a semiconductor chip, a lead member having a lead portion and an outer connecting terminal connected integrally to the lead portion, the lead portion electrically connected to the semiconductor chip, the lead portion extending outwardly from the semiconductor chip, the outer connecting terminal extending downwardly from the lead portion, a sealing resin sealing the semiconductor chip and the lead portion, a bottom face of the semiconductor chip and a bottom face of the lead portion being exposed from the sealing resin, and an insulating member covering the bottom face of the semiconductor chip and the bottom face of the lead portion. Also, the semiconductor device has a semiconductor chip having a predetermined number of electrode pads, a predetermined number of leads electrically connected to the electrode pads, each of the leads having a projecting terminal portion formed by bending the lead, and a resin portion sealing the semiconductor chip and the leads, wherein the terminal portions are exposed from one face of the resin portion.

Abstract translation: 本发明涉及一种半导体器件，其中多个外部端子以平坦表面的格子状排列。 半导体器件具有半导体芯片，具有引线部分的引线部分和与引线部分整体连接的外部连接端子，引线部分电连接到半导体芯片，引线部分从半导体芯片向外延伸，外部连接 从所述引线部分向下延伸的端子，密封所述半导体芯片和所述引线部分的密封树脂，所述半导体芯片的底面和所述引线部分的底面从所述密封树脂露出;以及绝缘构件， 和半导体芯片的底面。 此外，半导体器件具有预定数量的电极焊盘的半导体芯片，与电极焊盘电连接的预定数量的引线，每个引线具有通过弯曲引线形成的突出端子部分和密封 半导体芯片和引线，其中端子部分从树脂部分的一个面露出。

公开(公告)号：US07192798B2

公开(公告)日：2007-03-20

申请号：US10289268

申请日：2002-11-07

Applicant: Akira Okada ,  Hideharu Sakoda ,  Michio Hayakawa ,  Fumihiko Taniguchi

Inventor： Akira Okada ,  Hideharu Sakoda ,  Michio Hayakawa ,  Fumihiko Taniguchi

IPC: H01L21/00

CPC classification number: G06K9/0002 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A fingerprint sensor apparatus can provide a normal fingerprint sensor function even when a mold flash is formed. The fingerprint sensor apparatus recognizes a pattern of a fingerprint by being contacted by a finger. A semiconductor chip has a surface on which a sensor part is formed. The semiconductor chip is encapsulated by a seal resin. The sensor part is exposed in a bottom of an opening formed in the seal resin part. A distance between an edge of the bottom of the opening and an edge of the sensor part is 0.3 mm to 0.1 mm.

Abstract translation: 即使形成模具闪光，指纹传感器装置也能够提供正常的指纹传感器功能。 指纹传感器装置通过手指接触来识别指纹图案。 半导体芯片具有形成传感器部分的表面。 半导体芯片由密封树脂封装。 传感器部分露出在形成在密封树脂部分中的开口的底部。 开口底部的边缘与传感器部分的边缘之间的距离为0.3mm至0.1mm。

公开(公告)号：US06348416B1

公开(公告)日：2002-02-19

申请号：US09455374

申请日：1999-12-06

Applicant: Hideki Toya ,  Mitsuyoshi Imai ,  Masaki Sakaguchi ,  Naoki Yamabe ,  Mamoru Suwa ,  Toshiyuki Motooka ,  Hideharu Sakoda ,  Muneharu Morioka

Inventor： Hideki Toya ,  Mitsuyoshi Imai ,  Masaki Sakaguchi ,  Naoki Yamabe ,  Mamoru Suwa ,  Toshiyuki Motooka ,  Hideharu Sakoda ,  Muneharu Morioka

IPC: H01L21311

CPC classification number: H01L24/85 ,  H01L21/4832 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/85001 ,  H01L2224/85005 ,  H01L2224/85051 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85664 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate 12 which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess 16 formed at a position of the metal substrate 12 corresponding to the resin protuberance and having a rugged bottom surface 16a and/or a rugged side surface, and a plated film 14 formed on the inner surface of the recess 16.

Abstract translation: 为了提高作为半导体装置的外部连接端子的电镀膜与树脂突起的表面之间的粘附性并提高可靠性，载体基板包括成形为片状的金属基板12， 半导体芯片被固定，并且在半导体器件完成之前被去除，形成在与树脂突起相对应的金属基板12的位置处并具有粗糙的底表面16a和/或粗糙的侧表面的凹部16，以及 形成在凹部16的内表面上的镀膜14。

公开(公告)号：US5808357A

公开(公告)日：1998-09-15

申请号：US487539

申请日：1995-06-07

Applicant: Hideharu Sakoda ,  Yoshiyuki Yoneda ,  Kazuto Tsuji

Inventor： Hideharu Sakoda ,  Yoshiyuki Yoneda ,  Kazuto Tsuji

IPC: H01L23/31 ,  H01L23/433 ,  H05K1/02 ,  H01L23/48

CPC classification number: H05K1/0243 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4334 ,  H01L24/49 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K2201/10287 ,  H05K2201/10477 ,  H05K2201/10659 ,  H05K2201/10689

Abstract: A semiconductor device includes a substrate having a first surface, a second surface and at least one conductor parts which are exposed at both the first and second surfaces of the substrate, a semiconductor chip provided on the first surface of the substrate and having a plurality of electrode pads, a plurality of leads, a plurality of bonding-wires electrically connecting the leads and the conductor parts to corresponding ones of the electrode ads of the semiconductor chip, and a resin package encapsulating the semiconductor chip, part of the leads, and the substrate so that the conductor parts are exposed at the second surface of the substrate.

Abstract translation: 半导体器件包括具有第一表面，第二表面和暴露于基板的第一和第二表面的至少一个导体部分的基板，设置在基板的第一表面上的半导体芯片， 电极焊盘，多个引线，将引线和导体部分电连接到半导体芯片的对应的电极焊盘中的多个接合线，以及封装半导体芯片，部分引线的树脂封装，以及 基板，使得导体部分在基板的第二表面处露出。

公开(公告)号：US5497032A

公开(公告)日：1996-03-05

申请号：US213720

申请日：1994-03-16

Applicant: Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Michio Sono ,  Ichiro Yamaguchi ,  Toshio Hamano ,  Yoshihiro Kubota ,  Michio Hayakawa ,  Yoshihiko Ikemoto ,  Yukio Saigo ,  Naomi Miyaji

Inventor： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Michio Sono ,  Ichiro Yamaguchi ,  Toshio Hamano ,  Yoshihiro Kubota ,  Michio Hayakawa ,  Yoshihiko Ikemoto ,  Yukio Saigo ,  Naomi Miyaji

IPC: H01L23/057 ,  H01L23/10 ,  H01L23/433 ,  H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L23/057 ,  H01L23/10 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/49 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011

Abstract: A semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.

Abstract translation: 具有密封半导体器件的封装的半导体器件包括基底，并且在基底的表面上形成金属膜。 半导体芯片形成在金属膜上。 形成在半导体芯片上的焊盘通过导线连接到金属膜。 在金属膜上形成密封层。 导线形成在玻璃层上。 在金属膜上形成连接层，并含有导电粒子。 连接层与用于电源系统的引线接触并将金属膜连接到引线。