利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

33 条记录 (耗时 0.079 秒)

    Semi-aqueous solvent cleaning of paste processing residue from substrates
    5.
    发明授权
    Semi-aqueous solvent cleaning of paste processing residue from substrates 失效
    半水溶剂清洗膏从底物处理残留物

    公开(公告)号：US06742530B2

    公开(公告)日：2004-06-01

    申请号：US10294236

    申请日：2002-11-14

    申请人： Krishna G. Sachdev ,  James N. Humenik ,  Chon Cheong Lei ,  Glenn A. Pomerantz

    发明人： Krishna G. Sachdev ,  James N. Humenik ,  Chon Cheong Lei ,  Glenn A. Pomerantz

    IPC分类号： B08B308

    CPC分类号： H01L21/02063 ,  B23K35/025 ,  C11D7/263 ,  C11D11/0047 ,  C11D11/007 ,  C23G5/032 ,  H05K3/1233 ,  H05K3/26 ,  Y10S134/902

    摘要： A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.

    摘要翻译： 清洁与半导体制造工艺有关的物体的过程，例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。 具体地说，该方法在半导体封装衬底的制造中，将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。 该工艺还可以将陶瓷芯片载体上用于SMT离散，焊料柱附件和BGA（球栅阵列）附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。 更具体地，通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法，从金属，陶瓷和塑料基材中清除糊状残余物。

    Semi-aqueous solvent cleaning of paste processing residue from substrates
    6.
    发明授权
    Semi-aqueous solvent cleaning of paste processing residue from substrates 失效
    半水溶剂清洗膏从底物处理残留物

    公开(公告)号：US06569252B1

    公开(公告)日：2003-05-27

    申请号：US09609283

    申请日：2000-06-30

    申请人： Krishna G. Sachdev ,  James N. Humenik ,  Chon Cheong Lei ,  Glenn A. Pomerantz

    发明人： Krishna G. Sachdev ,  James N. Humenik ,  Chon Cheong Lei ,  Glenn A. Pomerantz

    IPC分类号： C23G502

    CPC分类号： H01L21/02063 ,  B23K35/025 ,  C11D7/263 ,  C11D11/0047 ,  C11D11/007 ,  C23G5/032 ,  H05K3/1233 ,  H05K3/26 ,  Y10S134/902

    摘要： A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.

    摘要翻译： 清洁与半导体制造工艺有关的物体的过程，例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。 具体地说，该方法在半导体封装衬底的制造中，将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。 该工艺还可以将陶瓷芯片载体上用于SMT离散，焊料柱附件和BGA（球栅阵列）附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。 更具体地，通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法，从金属，陶瓷和塑料基材中清除糊状残余物。

    Aqueous cleaning of paste residue
    8.
    发明授权
    Aqueous cleaning of paste residue 失效
    糊状残留物的水性清洗

    公开(公告)号：US06277799B1

    公开(公告)日：2001-08-21

    申请号：US09344886

    申请日：1999-06-25

    申请人： Krishna G. Sachdev ,  James N. Humenik ,  John U. Knickerbocker ,  Glenn A. Pomerantz

    发明人： Krishna G. Sachdev ,  James N. Humenik ,  John U. Knickerbocker ,  Glenn A. Pomerantz

    IPC分类号： C11D172

    CPC分类号： C11D11/0047 ,  C11D1/008 ,  C11D1/02 ,  C11D1/24 ,  C11D1/29 ,  C11D1/66 ,  C11D1/662 ,  C11D1/72 ,  C11D1/88 ,  C11D1/90 ,  C11D3/2086 ,  H05K3/1216 ,  H05K3/26

    摘要： This invention relates to an aqueous cleaning method for removal of metal-organic composite paste residue from the surface of components, such as, screening masks, associated paste screening equipment, substrates, to name a few. The invention is particularly concerned with aqueous alkaline cleaning solutions comprising alkali metal salt and/or quaternary ammonium salt of an organic acid preferably &agr;-hydroxy carboxylic acid in the presence of excess alkali and optionally a surface active agent for use in cleaning components, such as, screening masks, associated screening equipment, substrates, etc., which are used in the production of electronic components.

    摘要翻译： 本发明涉及从组分表面除去金属 - 有机复合糊状残留物的水性清洗方法，例如筛选掩模，相关的糊状物筛选设备，底物等等。 本发明特别涉及含有碱金属盐和/或季铵盐的含水碱性清洗溶液，所述碱性金属盐和/或有机酸优选为α-羟基羧酸的季铵盐，所述碱性金属盐和/或季铵盐在过量碱和任选的表面活性剂存在下用于清洁组分，例如 ，筛选掩模，相关筛选设备，基材等，用于生产电子元件。

    Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate
    10.
    发明授权
    Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate 失效
    用于将互连针钎焊到位于脆性电介质基底上的金属化图案的方法

    公开(公告)号：US4672739A

    公开(公告)日：1987-06-16

    申请号：US721885

    申请日：1985-04-11

    申请人： Robert W. Churchwell ,  Philip L. Flaitz ,  James N. Humenik

    发明人： Robert W. Churchwell ,  Philip L. Flaitz ,  James N. Humenik

    IPC分类号： H01L23/50 ,  H01L21/48 ,  H01R12/04 ,  H05K3/34 ,  H01L21/88

    CPC分类号： H01L21/4853 ,  Y10T29/49149 ,  Y10T428/12542

    摘要： A method for use in brazing an interconnect pin to a portion of metallization pattern (e.g. a pad) existing on a brittle dielectric substrate, such as a multi-layered ceramic (MLC) substrate, is disclosed. A dielectric layer is formed with appropriate annular openings. Each opening provides a closed containment wall, which extends around and above the pad, to hold the brazing alloy. Each circular containment wall is concentrically aligned with its associated pad and exposes an area, of each pad, having a smaller diameter than that of the entire pad. The containment walls serve to prevent the brazing alloy from coming into contact with any edge of the pads.

    摘要翻译： 公开了一种用于将互连销钎焊到存在于脆性电介质基板（例如多层陶瓷（MLC）基板）上的金属化图案（例如，焊盘）的一部分的方法。 电介质层由合适的环形开口形成。 每个开口提供封闭的容纳壁，其围绕和移动焊盘延伸以保持钎焊合金。 每个圆形容纳壁与其相关联的垫同心地对齐，并且暴露每个垫的面积小于整个垫的直径的区域。 容纳壁用于防止钎焊合金与焊盘的任何边缘接触。