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公开(公告)号：US20130256856A1
公开(公告)日：2013-10-03
申请号：US13431125
申请日：2012-03-27
申请人： Joachim Mahler , Thomas Bemmerl , Anton Prueckl
发明人： Joachim Mahler , Thomas Bemmerl , Anton Prueckl
IPC分类号： H01L23/495 , H01L21/50 , H01L23/48
CPC分类号： H01L21/76877 , H01L21/76816 , H01L23/13 , H01L23/3107 , H01L23/4334 , H01L23/49513 , H01L23/49517 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/49833 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/82 , H01L24/92 , H01L25/072 , H01L25/50 , H01L2224/04026 , H01L2224/04034 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/224 , H01L2224/24011 , H01L2224/2402 , H01L2224/24105 , H01L2224/24155 , H01L2224/24175 , H01L2224/244 , H01L2224/291 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29294 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32225 , H01L2224/32245 , H01L2224/35 , H01L2224/352 , H01L2224/3701 , H01L2224/37113 , H01L2224/37118 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/3716 , H01L2224/37164 , H01L2224/37169 , H01L2224/40095 , H01L2224/40155 , H01L2224/40175 , H01L2224/40245 , H01L2224/40499 , H01L2224/41171 , H01L2224/48155 , H01L2224/48175 , H01L2224/49171 , H01L2224/73263 , H01L2224/73265 , H01L2224/73267 , H01L2224/82104 , H01L2224/82105 , H01L2224/82106 , H01L2224/83447 , H01L2224/83801 , H01L2224/8385 , H01L2224/83851 , H01L2224/84447 , H01L2224/92244 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/07811 , H01L2924/01028 , H01L2924/00012 , H01L2924/01023 , H01L2224/45099
摘要： An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the first chip carrier. A second power semiconductor chip is mounted on and electrically connected to the second chip carrier. An electrically insulating material is configured to at least partially surround the first power semiconductor chip and the second power semiconductor chip. An electrical interconnect is configured to electrically connect the first power semiconductor chip to the second power semiconductor chip, wherein the electrical interconnect has at least one of a contact clip and a galvanically deposited conductor.
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公开(公告)号：US08916968B2
公开(公告)日：2014-12-23
申请号：US13431125
申请日：2012-03-27
申请人： Joachim Mahler , Thomas Bemmerl , Anton Prueckl
发明人： Joachim Mahler , Thomas Bemmerl , Anton Prueckl
IPC分类号： H01L23/34
CPC分类号： H01L21/76877 , H01L21/76816 , H01L23/13 , H01L23/3107 , H01L23/4334 , H01L23/49513 , H01L23/49517 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/49833 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/82 , H01L24/92 , H01L25/072 , H01L25/50 , H01L2224/04026 , H01L2224/04034 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/224 , H01L2224/24011 , H01L2224/2402 , H01L2224/24105 , H01L2224/24155 , H01L2224/24175 , H01L2224/244 , H01L2224/291 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29294 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32225 , H01L2224/32245 , H01L2224/35 , H01L2224/352 , H01L2224/3701 , H01L2224/37113 , H01L2224/37118 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/3716 , H01L2224/37164 , H01L2224/37169 , H01L2224/40095 , H01L2224/40155 , H01L2224/40175 , H01L2224/40245 , H01L2224/40499 , H01L2224/41171 , H01L2224/48155 , H01L2224/48175 , H01L2224/49171 , H01L2224/73263 , H01L2224/73265 , H01L2224/73267 , H01L2224/82104 , H01L2224/82105 , H01L2224/82106 , H01L2224/83447 , H01L2224/83801 , H01L2224/8385 , H01L2224/83851 , H01L2224/84447 , H01L2224/92244 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/07811 , H01L2924/01028 , H01L2924/00012 , H01L2924/01023 , H01L2224/45099
摘要： An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the first chip carrier. A second power semiconductor chip is mounted on and electrically connected to the second chip carrier. An electrically insulating material is configured to at least partially surround the first power semiconductor chip and the second power semiconductor chip. An electrical interconnect is configured to electrically connect the first power semiconductor chip to the second power semiconductor chip, wherein the electrical interconnect has at least one of a contact clip and a galvanically deposited conductor.
摘要翻译： 电子设备包括与第一芯片载体隔离的第一芯片载体和第二芯片载体。 第一功率半导体芯片安装在电连接到第一芯片载体上。 第二功率半导体芯片安装在第二芯片载体上并电连接到第二芯片载体。 电绝缘材料被配置为至少部分地围绕第一功率半导体芯片和第二功率半导体芯片。 电互连被配置为将第一功率半导体芯片电连接到第二功率半导体芯片，其中电互连具有接触夹和电沉积导体中的至少一个。
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公开(公告)号：US08866274B2
公开(公告)日：2014-10-21
申请号：US13431251
申请日：2012-03-27
申请人： Hermann Gruber , Joachim Mahler , Uwe Hoeckele , Anton Prueckl , Thomas Fischer , Matthias Schmidt
发明人： Hermann Gruber , Joachim Mahler , Uwe Hoeckele , Anton Prueckl , Thomas Fischer , Matthias Schmidt
IPC分类号： H01L23/495 , H01L21/00 , H01L23/31
CPC分类号： H01L23/3114 , H01L21/561 , H01L23/291 , H01L23/3107 , H01L23/3135 , H01L23/3185 , H01L23/49513 , H01L23/49524 , H01L23/49541 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48464 , H01L2224/49171 , H01L2224/73265 , H01L2224/83191 , H01L2224/85203 , H01L2224/85207 , H01L2224/92247 , H01L2224/97 , H01L2924/01047 , H01L2924/07802 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： In one embodiment, a method of forming a semiconductor package comprises providing a first die having contact regions on a top surface but not on an opposite bottom surface. A dielectric liner layer is deposited under the bottom surface of the first die. The first die is attached with the deposited dielectric liner layer to a die paddle of a substrate. A bond layer is disposed between the substrate and the dielectric liner layer.
摘要翻译： 在一个实施例中，形成半导体封装的方法包括提供在顶表面上但不在相对的底表面上具有接触区域的第一裸片。 介电衬垫层沉积在第一管芯的底表面下方。 第一裸片与沉积的介电衬垫层连接到衬底的裸片上。 接合层设置在基板和电介质衬垫层之间。
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公开(公告)号：US08698298B2
公开(公告)日：2014-04-15
申请号：US13346766
申请日：2012-01-10
申请人： Ewe Henrik , Joachim Mahler , Anton Prueckl , Ivan Nikitin
发明人： Ewe Henrik , Joachim Mahler , Anton Prueckl , Ivan Nikitin
IPC分类号： H01L23/02
CPC分类号： H01L21/56 , H01L23/3121 , H01L23/3677 , H01L23/492 , H01L23/49844 , H01L23/5389 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/82 , H01L24/83 , H01L25/071 , H01L25/074 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/24226 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/32245 , H01L2224/32507 , H01L2224/48227 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/83191 , H01L2224/83801 , H01L2224/83805 , H01L2224/83825 , H01L2224/8384 , H01L2224/83855 , H01L2224/92 , H01L2224/92244 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , H05K1/185 , H05K1/186 , H05K3/4644 , H05K2201/10674 , H05K2201/10969 , H01L2224/83 , H01L2224/82 , H01L2924/01014 , H01L2924/00 , H01L2924/01049 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A laminate electronic device comprises a first semiconductor chip, the first semiconductor chip defining a first main face and a second main face opposite to the first main face, and having at least one electrode pad on the first main face. The laminate electronic device further comprises a carrier having a first structured metal layer arranged at a first main surface of the carrier. The first structured metal layer is bonded to the electrode pad via a first bond layer of a conductive material, wherein the first bond layer has a thickness of less than 10 μm. A first insulating layer overlies the first main surface of the carrier and the first semiconductor chip.
摘要翻译： 层压电子器件包括第一半导体芯片，第一半导体芯片限定第一主面和与第一主面相对的第二主面，并且在第一主面上具有至少一个电极焊盘。 层压电子器件还包括具有布置在载体的第一主表面上的第一结构金属层的载体。 第一结构化金属层经由导电材料的第一接合层接合到电极焊盘，其中第一接合层的厚度小于10μm。 第一绝缘层覆盖在载体的第一主表面和第一半导体芯片上。
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公开(公告)号：US08686569B2
公开(公告)日：2014-04-01
申请号：US12967281
申请日：2010-12-14
申请人： Frank Daeche , Joachim Mahler , Anton Prueckl , Stefan Landau , Josef Hoeglauer
发明人： Frank Daeche , Joachim Mahler , Anton Prueckl , Stefan Landau , Josef Hoeglauer
CPC分类号： H01L24/19 , H01L23/3107 , H01L23/49517 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/20 , H01L2224/04105 , H01L2224/06181 , H01L2224/19 , H01L2224/2105 , H01L2224/215 , H01L2224/221 , H01L2224/24145 , H01L2224/24245 , H01L2224/24246 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2224/73217 , H01L2224/73267 , H01L2224/83801 , H01L2224/92244 , H01L2924/00011 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H01L2924/1815 , H01L2924/00014 , H01L2224/83851 , H01L2224/29075 , H01L2924/00
摘要： A die arrangement includes a carrier having a first side and a second side opposite the first side, the carrier including an opening leading from the first side of the carrier to the second side of the carrier; a first die disposed over the first side of the carrier and electrically contacting the carrier; a second die disposed over the second side of the carrier and electrically contacting the carrier; and an electrical contact structure leading through the opening in the carrier and electrically contacting the second die.
摘要翻译： 模具装置包括具有第一侧和与第一侧相对的第二侧的载体，载体包括从载体的第一侧引导到载体的第二侧的开口; 第一管芯，设置在载体的第一侧上并电接触载体; 设置在所述载体的第二侧上并与所述载体电接触的第二管芯; 以及引导通过载体中的开口并电接触第二管芯的电接触结构。
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公开(公告)号：US20110108971A1
公开(公告)日：2011-05-12
申请号：US12615648
申请日：2009-11-10
申请人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Ivan Nikitin
发明人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Ivan Nikitin
IPC分类号： H01L23/522 , H01L21/822
CPC分类号： H01L21/56 , H01L23/3121 , H01L23/3677 , H01L23/492 , H01L23/49844 , H01L23/5389 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/82 , H01L24/83 , H01L25/071 , H01L25/074 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/24226 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/32245 , H01L2224/32507 , H01L2224/48227 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/83191 , H01L2224/83801 , H01L2224/83805 , H01L2224/83825 , H01L2224/8384 , H01L2224/83855 , H01L2224/92 , H01L2224/92244 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , H05K1/185 , H05K1/186 , H05K3/4644 , H05K2201/10674 , H05K2201/10969 , H01L2224/83 , H01L2224/82 , H01L2924/01014 , H01L2924/00 , H01L2924/01049 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A laminate electronic device comprises a first semiconductor chip, the first semiconductor chip defining a first main face and a second main face opposite to the first main face, and having at least one electrode pad on the first main face. The laminate electronic device further comprises a carrier having a first structured metal layer arranged at a first main surface of the carrier. The first structured metal layer is bonded to the electrode pad via a first bond layer of a conductive material, wherein the first bond layer has a thickness of less than 10 μm. A first insulating layer overlies the first main surface of the carrier and the first semiconductor chip.
摘要翻译： 层压电子器件包括第一半导体芯片，第一半导体芯片限定第一主面和与第一主面相对的第二主面，并且在第一主面上具有至少一个电极焊盘。 层压电子器件还包括具有布置在载体的第一主表面上的第一结构金属层的载体。 第一结构化金属层经由导电材料的第一接合层接合到电极焊盘，其中第一接合层的厚度小于10μm。 第一绝缘层覆盖在载体的第一主表面和第一半导体芯片上。
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公开(公告)号：US08598694B2
公开(公告)日：2013-12-03
申请号：US13301823
申请日：2011-11-22
申请人： Khalil Hosseini , Joachim Mahler , Anton Prueckl
发明人： Khalil Hosseini , Joachim Mahler , Anton Prueckl
IPC分类号： H01L23/495 , H01L21/768
CPC分类号： H01L23/49503 , H01L23/13 , H01L23/492 , H01L23/49513 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/83 , H01L25/072 , H01L25/50 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/32257 , H01L2224/83192 , H01L2924/07802 , H01L2924/0781 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/00 , H01L2924/01028 , H01L2924/014 , H01L2924/00014
摘要： Various embodiments provide a chip-carrier including, a chip-carrier surface configured to carry a first chip from a first chip bottom side, wherein a first chip top side of the first chip is configured above the chip-carrier surface; and at least one cavity extending into the chip-carrier from the chip-carrier surface; wherein the at least one cavity is configured to carry a second chip from a second chip bottom side, wherein a second chip top side of the second chip is substantially level with the first chip top side. The second chip is electrically insulated from the chip-carrier by an electrical insulation material inside the cavity.
摘要翻译： 各种实施例提供一种芯片载体，其包括：芯片载体表面，被配置为从第一芯片底侧承载第一芯片，其中第一芯片的第一芯片顶侧配置在芯片载体表面之上; 以及从所述芯片载体表面延伸到所述芯片载体中的至少一个空腔; 其中所述至少一个腔被配置为从第二芯片底侧承载第二芯片，其中所述第二芯片的第二芯片顶侧基本上与所述第一芯片顶侧平齐。 第二芯片通过腔内的电绝缘材料与芯片载体电绝缘。
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公开(公告)号：US20130010446A1
公开(公告)日：2013-01-10
申请号：US13346766
申请日：2012-01-10
申请人： Ewe Henrik , Joachim Mahler , Anton Prueckl , Ivan Nikitin
发明人： Ewe Henrik , Joachim Mahler , Anton Prueckl , Ivan Nikitin
CPC分类号： H01L21/56 , H01L23/3121 , H01L23/3677 , H01L23/492 , H01L23/49844 , H01L23/5389 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/82 , H01L24/83 , H01L25/071 , H01L25/074 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/24226 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/32245 , H01L2224/32507 , H01L2224/48227 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/83191 , H01L2224/83801 , H01L2224/83805 , H01L2224/83825 , H01L2224/8384 , H01L2224/83855 , H01L2224/92 , H01L2224/92244 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , H05K1/185 , H05K1/186 , H05K3/4644 , H05K2201/10674 , H05K2201/10969 , H01L2224/83 , H01L2224/82 , H01L2924/01014 , H01L2924/00 , H01L2924/01049 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A laminate electronic device comprises a first semiconductor chip, the first semiconductor chip defining a first main face and a second main face opposite to the first main face, and having at least one electrode pad on the first main face. The laminate electronic device further comprises a carrier having a first structured metal layer arranged at a first main surface of the carrier. The first structured metal layer is bonded to the electrode pad via a first bond layer of a conductive material, wherein the first bond layer has a thickness of less than 10 μm. A first insulating layer overlies the first main surface of the carrier and the first semiconductor chip.
摘要翻译： 层压电子器件包括第一半导体芯片，第一半导体芯片限定第一主面和与第一主面相对的第二主面，并且在第一主面上具有至少一个电极焊盘。 层压电子器件还包括具有布置在载体的第一主表面上的第一结构金属层的载体。 第一结构化金属层经由导电材料的第一接合层接合到电极焊盘，其中第一接合层的厚度小于10μm。 第一绝缘层覆盖在载体的第一主表面和第一半导体芯片上。
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公开(公告)号：US08120158B2
公开(公告)日：2012-02-21
申请号：US12615648
申请日：2009-11-10
申请人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Ivan Nikitin
发明人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Ivan Nikitin
IPC分类号： H01L23/02
CPC分类号： H01L21/56 , H01L23/3121 , H01L23/3677 , H01L23/492 , H01L23/49844 , H01L23/5389 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/82 , H01L24/83 , H01L25/071 , H01L25/074 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/24226 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/32245 , H01L2224/32507 , H01L2224/48227 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/83191 , H01L2224/83801 , H01L2224/83805 , H01L2224/83825 , H01L2224/8384 , H01L2224/83855 , H01L2224/92 , H01L2224/92244 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , H05K1/185 , H05K1/186 , H05K3/4644 , H05K2201/10674 , H05K2201/10969 , H01L2224/83 , H01L2224/82 , H01L2924/01014 , H01L2924/00 , H01L2924/01049 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A laminate electronic device comprises a first semiconductor chip, the first semiconductor chip defining a first main face and a second main face opposite to the first main face, and having at least one electrode pad on the first main face. The laminate electronic device further comprises a carrier having a first structured metal layer arranged at a first main surface of the carrier. The first structured metal layer is bonded to the electrode pad via a first bond layer of a conductive material, wherein the first bond layer has a thickness of less than 10 μm. A first insulating layer overlies the first main surface of the carrier and the first semiconductor chip.
摘要翻译： 层压电子器件包括第一半导体芯片，第一半导体芯片限定第一主面和与第一主面相对的第二主面，并且在第一主面上具有至少一个电极焊盘。 层压电子器件还包括具有布置在载体的第一主表面上的第一结构金属层的载体。 第一结构化金属层经由导电材料的第一接合层接合到电极焊盘，其中第一接合层的厚度小于10μm。 第一绝缘层覆盖在载体的第一主表面和第一半导体芯片上。
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公开(公告)号：US20110127675A1
公开(公告)日：2011-06-02
申请号：US12628428
申请日：2009-12-01
申请人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
发明人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
IPC分类号： H01L23/538 , H01L21/50 , H01L21/56
CPC分类号： H01L23/481 , H01L21/56 , H01L21/6835 , H01L23/3107 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L25/18 , H01L2221/68372 , H01L2221/68377 , H01L2224/0557 , H01L2224/24137 , H01L2224/2518 , H01L2224/32245 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01072 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/15192 , H01L2924/15787 , H01L2924/19041 , H01L2924/19105 , H05K1/05 , H05K1/185 , H05K1/188 , H05K3/4644 , H05K2201/09745 , H05K2201/09972 , H05K2203/0353 , H05K2203/1469 , H01L2924/00 , H01L2224/05552
摘要： A method of manufacturing a laminate electronic device is disclosed. One embodiment provides a carrier, the carrier defining a first main surface and a second main surface opposite to the first main surface. The carrier has a recess pattern formed in the first main surface. A first semiconductor chip is attached on one of the first and second main surface. A first insulating layer overlying the main surface of the carrier on which the first semiconductor chip is attached and the first semiconductor chip is formed. The carrier is then separated into a plurality of parts along the recess pattern.
摘要翻译： 公开了一种制造层压电子装置的方法。 一个实施例提供载体，载体限定第一主表面和与第一主表面相对的第二主表面。 载体具有形成在第一主表面中的凹陷图案。 第一半导体芯片附接在第一和第二主表面之一上。 覆盖在其上附着有第一半导体芯片的载体的主表面上的第一绝缘层和形成第一半导体芯片。 然后沿着凹槽图案将载体分离成多个部分。
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