公开(公告)号：US20050239300A1

公开(公告)日：2005-10-27

申请号：US11055579

申请日：2005-02-09

Applicant: Gary Yasumura ,  Joseph Fjelstad ,  William Wiedemann ,  Para Segaram ,  Kevin Grundy

Inventor： Gary Yasumura ,  Joseph Fjelstad ,  William Wiedemann ,  Para Segaram ,  Kevin Grundy

IPC: H01R12/00 ,  H01R12/16

CPC classification number: H05K1/117 ,  H01R12/523 ,  H01R12/62 ,  H01R12/716 ,  H01R13/24 ,  H01R13/6587 ,  H05K1/142 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/09063 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/09709 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2203/167

Abstract: An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.

Abstract translation: 一种电连接器，包括布置成阶梯式结构的多个电触点，其设计成与具有以阶梯状构造布置的电触点的电气部件配合。 一种直接连接信号系统，包括与台阶式印刷电路板，其他楼梯电气部件或其组合配合的楼梯级电连接器。

公开(公告)号：US20050189640A1

公开(公告)日：2005-09-01

申请号：US11055578

申请日：2005-02-09

Applicant: Kevin Grundy ,  Joseph Fjelstad ,  Gary Yasumura ,  William Wiedemann ,  Para Segaram

Inventor： Kevin Grundy ,  Joseph Fjelstad ,  Gary Yasumura ,  William Wiedemann ,  Para Segaram

IPC: H01L23/02 ,  H01L23/13 ,  H01L23/31 ,  H01L25/10 ,  H05K1/18 ,  H05K3/40

CPC classification number: H01L23/13 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16235 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/182 ,  H05K1/183 ,  H05K3/308 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0919 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10727 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.

Abstract translation: 由多个封装，印刷电路板，连接器和插入件采用的结构，以产生减少与使用通孔相关联的有害信号质量问题的信号路径。 公开的结构可以与通孔实现共存。

公开(公告)号：US20070236901A1

公开(公告)日：2007-10-11

申请号：US11748045

申请日：2007-05-14

Applicant: Kevin Grundy ,  Gary Yasumura ,  Joseph Fjelstad ,  William Wiedemann ,  Para Segaram

Inventor： Kevin Grundy ,  Gary Yasumura ,  Joseph Fjelstad ,  William Wiedemann ,  Para Segaram

IPC: H01R12/16

CPC classification number: H01R12/52 ,  H01R12/7011 ,  H01R12/7082 ,  H01R12/714 ,  H01R12/716 ,  H01R12/721 ,  H01R13/24 ,  H01R31/06 ,  H05K1/0237 ,  H05K1/14 ,  H05K1/147 ,  H05K3/222 ,  H05K7/1441 ,  H05K2201/044 ,  H05K2201/10189 ,  H05K2201/10356

Abstract: A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.

Abstract translation: 一种用于具有印刷电路板，第一电气结构和第二电气结构的系统中的信号分离连接器。 连接器包括用于在第一电气结构和印刷电路板之间传送信号的第一组导电元件和用于在第一电结构和第二电结构之间传送信号的第二组导电元件。

公开(公告)号：US20060157846A1

公开(公告)日：2006-07-20

申请号：US11353564

申请日：2006-02-13

Applicant: Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Kevin Grundy ,  Inessa Obenhuber

Inventor： Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Kevin Grundy ,  Inessa Obenhuber

IPC: H01L23/52

CPC classification number: H01L24/85 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49537 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/32245

Abstract: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.

公开(公告)号：US20060035482A1

公开(公告)日：2006-02-16

申请号：US11123863

申请日：2005-05-06

Applicant: Gary Yasumura ,  William Wiedemann ,  Joseph Fjelstad ,  Para Segaram ,  Kevin Grundy

Inventor： Gary Yasumura ,  William Wiedemann ,  Joseph Fjelstad ,  Para Segaram ,  Kevin Grundy

IPC: H05K1/00

CPC classification number: H01R12/714 ,  H01R12/52 ,  H01R12/7082 ,  H01R13/24 ,  H01R13/6599

Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.

Abstract translation: 电连接器。 一种电连接器，包括具有第一通道的连接器主体和在第一末端部分中延伸穿过第一通道的第一导电元件。 第一末端部分具有第一力矩臂，当被迫与第一导电表面接触时，扭转第一导电元件以产生扭转力。 扭转力保持第一末端部分与第一导电表面接触。

公开(公告)号：US20050133922A1

公开(公告)日：2005-06-23

申请号：US10987187

申请日：2004-11-12

Applicant: Joseph Fjelstad ,  Kevin Grundy ,  Para Segaram ,  Gary Yasumura

Inventor： Joseph Fjelstad ,  Kevin Grundy ,  Para Segaram ,  Gary Yasumura

IPC: G01R31/28 ,  H01L20060101 ,  H01L23/13 ,  H01L23/498 ,  H01L23/66 ,  H01P3/08 ,  H01P5/02 ,  H04J1/16 ,  H04L1/00 ,  H05K1/02

CPC classification number: H05K1/0243 ,  G01R31/2822 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/1903 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P3/08 ,  H01P5/028 ,  H05K1/024 ,  H05K2201/0191 ,  H05K2201/09154 ,  H05K2201/09727 ,  Y10S438/981 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.

Abstract translation: 公开了锥形电介质和导体结构，其提供受控的阻抗互连，同时信号导体线从更细的间距转换到较粗的间距，从而消除通常与电路接触间距的变化相关的电中断。 还公开了用于构造装置和应用的方法。

公开(公告)号：US5410188A

公开(公告)日：1995-04-25

申请号：US133405

申请日：1993-10-07

Applicant: Para Segaram

Inventor： Para Segaram

IPC: H03M5/12 ,  H03M1/74 ,  H04L25/02 ,  H04L25/03 ,  H04L25/04 ,  H03K17/28 ,  H03K5/01 ,  H03K5/19

CPC classification number: H04L25/0286 ,  H03M1/745 ,  H04L25/03853 ,  H04L25/0272 ,  H04L25/0282

Abstract: The waveshaping functions provided by a summing resistor network and filter are performed by a waveshaping circuit that can be integrated with transceiving functions within a single integrated circuit. The waveshaping circuit utilizes the edges of an oscillator signal to generate a series of pairs of logic signals which have a defined timing relationship with respect to an input data signal. Each pair of logic signals is then utilized by a corresponding number of current stages to provide both an incremental portion of an output waveform and an incremental portion of a complementary output waveform. The pair of output waveforms can then be produced by summing together all of the incremental portions of the pair of waveforms.

Abstract translation: 由一个求和电阻网络和滤波器提供的波形整形功能是通过一个波形整形电路进行的，该电路可以与单个集成电路中的收发功能相集成。 波形整形电路利用振荡器信号的边缘产生一系列相对于输入数据信号具有定义的时序关系的逻辑信号对。 然后，每对逻辑信号被相应数目的当前级用来提供输出波形的增量部分和互补输出波形的增量部分。 然后可以通过将所述一对波形的所有增量部分相加来产生一对输出波形。

公开(公告)号：US20060165186A1

公开(公告)日：2006-07-27

申请号：US11279350

申请日：2006-04-11

Applicant: Para Segaram

Inventor： Para Segaram

IPC: H04L25/00

CPC classification number: H04L25/028 ,  H04L7/0008 ,  H04L7/0025 ,  H04L7/0337 ,  H04L25/0272 ,  H04L25/0292 ,  H04L25/14

Abstract: In a communications device having a physical layer device and a processing device connected to the physical layer device, the number of input/output (I/O) ports required for communication between the devices in the gigabit range is substantially reduced by utilizing millivolt differential I/O drivers and receivers. In addition, a calibration feedback loop synchronizes the data and clock signals on the processing device, thereby eliminating the need to recover the clock on the processing device.

Abstract translation: 在具有连接到物理层设备的物理层设备和处理设备的通信设备中，在千兆比特范围内的设备之间进行通信所需的输入/输出（I / O）端口的数量通过利用毫伏差分I / O驱动程序和接收器。 此外，校准反馈环路在处理设备上同步数据和时钟信号，从而消除了在处理设备上恢复时钟的需要。

公开(公告)号：US20050093152A1

公开(公告)日：2005-05-05

申请号：US10964578

申请日：2004-10-12

Applicant: Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Inessa Obenhuber ,  Kevin Grundy ,  William Wiedemann

Inventor： Joseph Fjelstad ,  Para Segaram ,  Thomas Obenhuber ,  Inessa Obenhuber ,  Kevin Grundy ,  William Wiedemann

IPC: H01L20060101 ,  H01L23/13 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/13 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A cost effective, high performance, IC package assembly of the present invention comprises stair-stepped layers of redistribution circuits from at least one chip to terminals on any of multiple surfaces and levels of the IC package assembly. Critical path circuits of the assembly have no plated vias and are directly routed from interconnection terminals which are used to interconnect the package to the IC chip terminals by flip chip or wire bond methods.

Abstract translation: 本发明的成本有效，高性能的IC封装组件包括从IC封装组件的多个表面和电平中的任一个上的至少一个芯片到端子的阶梯层的再分配电路。 组件的关键路径电路没有电镀通孔，并且通过倒装芯片或引线键合方法将互连封装与IC芯片端子互连的互连端直接布线。

公开(公告)号：US20050091205A1

公开(公告)日：2005-04-28

申请号：US10934872

申请日：2004-09-03

Applicant: Jeffrey Alan Sidlosky ,  Creighton Chong ,  Thomas Obenhuber ,  Inessa Obenhuber ,  Para Segaram

Inventor： Jeffrey Alan Sidlosky ,  Creighton Chong ,  Thomas Obenhuber ,  Inessa Obenhuber ,  Para Segaram

IPC: G06F7/00 ,  G06F17/30

CPC classification number: G06F17/30693 ,  G06F17/30867 ,  Y10S707/99933

Abstract: The generation a search query based on information stored on a storage medium is described. According to one embodiment of the invention, search criteria is entered to perform a search of a storage medium of a client computer. The search of the storage medium determines a web search criteria. The client computer provides search results based on the web search criteria.

Abstract translation: 描述基于存储在存储介质上的信息的生成搜索查询。 根据本发明的一个实施例，输入搜索标准以执行对客户计算机的存储介质的搜索。 存储介质的搜索决定了网络搜索标准。 客户端计算机根据网络搜索条件提供搜索结果。