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    POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
    1.
    发明申请
    POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME 有权
    在电路基板中使用的电源芯及其制造方法

    公开(公告)号：US20110284273A1

    公开(公告)日：2011-11-24

    申请号：US12782187

    申请日：2010-05-18

    申请人： Robert M. Japp ,  Kostas Papathomas ,  John S. Kresge ,  Timothy Antesberger

    发明人： Robert M. Japp ,  Kostas Papathomas ,  John S. Kresge ,  Timothy Antesberger

    IPC分类号： H05K1/09 ,  H05K1/00 ,  H01R43/00 ,  H05K1/11

    CPC分类号： H05K3/4641 ,  H05K3/4617 ,  H05K2201/068 ,  Y10T29/49117

    摘要： A power core adapted for use as part of a circuitized substrate, e.g., a PCB or LCC. The core includes a first layer of low expansion dielectric and two added layers of a different low expansion dielectric bonded thereto, with two conductive layers positioned on the two added low expansion dielectric layers. At least one of the conductive layers serves as a power plane for the power core, which in turn is usable within a circuitized substrate, also provided. Methods of making the power core and circuitized substrate are also provided. The use of different low expansion dielectric materials for the power core enables the use of support enhancing fiberglass in one layer while such use is precluded in the other two dielectric layers, thus preventing CAF shorting problems in highly precisely defined thru holes formed within the power core.

    摘要翻译： 适于用作电路化基板（例如PCB或LCC）的一部分的电源核心。 芯包括第一层低膨胀电介质和两个相邻的不同的低膨胀电介质结合的层，其中两个导电层位于两个添加的低膨胀介电层上。 导电层中的至少一个用作功率芯的功率平面，而功率芯也可以在电路化的衬底内使用。 还提供了制造电源芯和电路化基板的方法。 使用不同的低膨胀电介质材料用于电源芯可以在一层中使用支撑增强玻璃纤维，而在其他两个电介质层中排除这种用途，从而防止形成在功率芯内的高度精确定义的通孔中的CAF短路问题 。

    Power core for use in circuitized substrate and method of making same
    2.
    发明授权
    Power core for use in circuitized substrate and method of making same 有权
    用于电路化基板的电源芯及其制造方法

    公开(公告)号：US08198551B2

    公开(公告)日：2012-06-12

    申请号：US12782187

    申请日：2010-05-18

    申请人： Robert M. Japp ,  Kostas Papathomas ,  John Steven Kresge ,  Timothy Antesberger

    发明人： Robert M. Japp ,  Kostas Papathomas ,  John Steven Kresge ,  Timothy Antesberger

    IPC分类号： H05K1/11

    CPC分类号： H05K3/4641 ,  H05K3/4617 ,  H05K2201/068 ,  Y10T29/49117

    摘要： A power core adapted for use as part of a circuitized substrate, e.g., a PCB or LCC. The core includes a first layer of low expansion dielectric and two added layers of a different low expansion dielectric bonded thereto, with two conductive layers positioned on the two added low expansion dielectric layers. At least one of the conductive layers serves as a power plane for the power core, which in turn is usable within a circuitized substrate, also provided. Methods of making the power core and circuitized substrate are also provided. The use of different low expansion dielectric materials for the power core enables the use of support enhancing fiberglass in one layer while such use is precluded in the other two dielectric layers, thus preventing CAF shorting problems in highly precisely defined thru holes formed within the power core.

    摘要翻译： 适于用作电路化基板（例如PCB或LCC）的一部分的电源核心。 芯包括第一层低膨胀电介质和两个相邻的不同的低膨胀电介质结合的层，其中两个导电层位于两个添加的低膨胀介电层上。 导电层中的至少一个用作功率芯的功率平面，而功率芯也可以在电路化的衬底内使用。 还提供了制造电源芯和电路化基板的方法。 使用不同的低膨胀电介质材料用于电源芯可以在一层中使用支撑增强玻璃纤维，而在其他两个电介质层中排除这种用途，从而防止形成在功率芯内的高度精确定义的通孔中的CAF短路问题 。

    Methods of selectively filling apertures
    7.
    发明授权
    Methods of selectively filling apertures 失效

    公开(公告)号：US06066889A

    公开(公告)日：2000-05-23

    申请号：US158811

    申请日：1998-09-22

    申请人： Gerald Walter Jones ,  Heike Marcello ,  Kostas Papathomas

    发明人： Gerald Walter Jones ,  Heike Marcello ,  Kostas Papathomas

    IPC分类号： H01L21/48 ,  H05K3/00 ,  H01L23/04

    CPC分类号： H01L21/486 ,  H05K3/0094 ,  H05K2201/0959 ,  H05K2203/0278 ,  H05K3/0082

    摘要： A novel method of filling apertures in substrates, such as through holes, is provided. The method utilizes a photoimageable film, and comprises the following steps: applying a photoimagable, hole fill film over the apertures; reflowing the hole fill film to flow into the apertures; exposing the hole fill film to actinic radiation, preferably ultraviolet light, through a phototool, which preferably has openings slightly larger than the diameter of the apertures; then at least partially curing the hole fill film; and developing the hole fill film to remove the unexposed hole fill film. An advantage of the present method is that the apertures may be selectively filled. After the apertures are filled, the hole fill film is cured, preferably by baking. Thereafter, the substrate is preferably subjected to further processing steps; for example, nubs of cured hole fill film are preferably removed. If desired, the substrate is circuitized. If desired, features are gold plated, such as for example, electrolessly gold plated. The hole fill film preferably has solids which comprise 0 to about 20% of a thixotrope and about 80% to about 100% parts of an epoxy resin system; the epoxy resin system comprises: from about 10% to about 80% of phenoxy polyol resin which is the condensation product of epichlorohydrin and bisphenol A, having a molecular weight of from about 40,000 to about 130,000; from about 20% to about 90% of an epoxidized multifunctional bisphenol A formaldehyde novolac resin having a molecular weight of from about 4,000 to about 10,000; from about 35% to about 50% of a diglycidyl ether of bisphenol A, preferably halogenated, and having a molecular weight of from about 600 to about 2,500; and from about 0.1 to about 15 parts by weight of the total resin weight, a cationic photoinitiator. The invention also relates to circuitized structures produced according to the method.