CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
    4.
    发明申请
    CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME 有权
    芯片包装结构及其形成方法

    公开(公告)号:US20130020693A1

    公开(公告)日:2013-01-24

    申请号:US13548663

    申请日:2012-07-13

    IPC分类号: H01L29/02 H01L21/50 H01L21/02

    摘要: A chip package structure and a method for forming the chip package structure are disclosed. At least a block is formed on a surface of a cover, the cover is mounted on a substrate having a sensing device formed thereon for covering the sensing device, and the block is disposed between the cover and the sensing device. In the present invention, the block is mounted on the cover, there is no need to etch the cover to form a protruding portion, and thus the method of the present invention is simple and has low cost.

    摘要翻译: 公开了一种用于形成芯片封装结构的芯片封装结构和方法。 至少一个块形成在盖的表面上,盖安装在其上形成有感测装置的基板上,用于覆盖感测装置,并且该块设置在盖和感测装置之间。 在本发明中,该块安装在盖上,不需要蚀刻盖以形成突出部分,因此本发明的方法简单且成本低。

    Interposer and manufacturing method thereof
    9.
    发明授权
    Interposer and manufacturing method thereof 有权
    插件及其制造方法

    公开(公告)号:US08692284B2

    公开(公告)日:2014-04-08

    申请号:US13484140

    申请日:2012-05-30

    IPC分类号: H01L29/72

    摘要: An embodiment of the present invention provides a manufacturing method of an interposer including: providing a semiconductor substrate having a first surface, a second surface and at least a through hole connecting the first surface to the second surface; electrocoating a polymer layer on the first surface, the second surface and an inner wall of the through hole; and forming a wiring layer on the electrocoating polymer layer, wherein the wiring layer extends from the first surface to the second surface via the inner wall of the through hole. Another embodiment of the present invention provides an interposer.

    摘要翻译: 本发明的一个实施例提供了一种内插器的制造方法,包括:提供具有第一表面,第二表面和至少连接第一表面与第二表面的通孔的半导体衬底; 在第一表面,第二表面和通孔的内壁上电聚合聚合物层; 以及在所述电涂层聚合物层上形成布线层,其中所述布线层经由所述通孔的内壁从所述第一表面延伸到所述第二表面。 本发明的另一实施例提供一种插入器。