公开(公告)号：US20090190134A1

公开(公告)日：2009-07-30

申请号：US11658671

申请日：2005-07-22

申请人： Toru Shirai ,  Yasuhiro Kohara ,  Morihide Ohsaki ,  Kenji Takii

发明人： Toru Shirai ,  Yasuhiro Kohara ,  Morihide Ohsaki ,  Kenji Takii

IPC分类号： G01N21/25

CPC分类号： G01N21/958 ,  G01N21/59 ,  G01N2021/9513 ,  G02B5/201

摘要： A method for inspecting a color filter includes a first step of disposing the color filter so that the color filter is opposed to a light source, a second step of outputting, from the light source, monochromatic light of a color corresponding to one of the colors of color layers of the color filter and entering the light into the plurality of color layers, and a third step of inspecting for display unevenness in each of the color layers with light transmitted through the color layers.

摘要翻译： 检查滤色器的方法包括：第一步骤，设置滤色器使得滤色器与光源相对;第二步骤，从光源输出与其中一种颜色相对应的颜色的单色光 的彩色滤光片的彩色层，并将光进入多个彩色层;以及第三步骤，通过透过彩色层的光来检查每个彩色层中的显示不均匀。

公开(公告)号：US07643141B2

公开(公告)日：2010-01-05

申请号：US11658671

申请日：2005-07-22

申请人： Toru Shirai ,  Yasuhiro Kohara ,  Morihide Ohsaki ,  Kenji Takii

发明人： Toru Shirai ,  Yasuhiro Kohara ,  Morihide Ohsaki ,  Kenji Takii

IPC分类号： G01N21/00 ,  G01N21/25

CPC分类号： G01N21/958 ,  G01N21/59 ,  G01N2021/9513 ,  G02B5/201

摘要： A method for inspecting a color filter includes a first step of disposing the color filter so that the color filter is opposed to a light source, a second step of outputting, from the light source, monochromatic light of a color corresponding to one of the colors of color layers of the color filter and entering the light into the plurality of color layers, and a third step of inspecting for display unevenness in each of the color layers with light transmitted through the color layers.

摘要翻译： 检查滤色器的方法包括：第一步骤，设置滤色器使得滤色器与光源相对;第二步骤，从光源输出与其中一种颜色相对应的颜色的单色光 的彩色滤光片的彩色层，并将光进入多个彩色层;以及第三步骤，通过透过彩色层的光来检查每个彩色层中的显示不均匀。

公开(公告)号：US20120098137A1

公开(公告)日：2012-04-26

申请号：US13381299

申请日：2010-06-30

申请人： Ryosuke Usui ,  Yusuke Igarashi ,  Yasunori Inoue ,  Mayumi Nakasato ,  Masayuki Nagamatsu ,  Yasuhiro Kohara

发明人： Ryosuke Usui ,  Yusuke Igarashi ,  Yasunori Inoue ,  Mayumi Nakasato ,  Masayuki Nagamatsu ,  Yasuhiro Kohara

IPC分类号： H01L29/43 ,  H01L23/48 ,  H05K7/20

CPC分类号： H05K3/445 ,  H01L23/3735 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H05K1/05 ,  H05K1/053 ,  H05K1/056 ,  H05K1/185 ,  H05K2201/0195 ,  H05K2201/068 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics.

摘要翻译： 传统的印刷电路板具有热辐射特性差的问题，并且用于改善热辐射特性的金属芯印刷电路板具有刚性低和弯曲倾向的问题。 金属的延展性可能受到阻碍，金属受到保护; 通过覆盖由金属作为主要材料构成的金属芯的正面和背面的大部分整个面积与第一陶瓷膜和阻碍上述金属芯的延展性的第二陶瓷膜; 并用绝缘树脂膜覆盖每个陶瓷膜，以覆盖这些陶瓷的脆性。

公开(公告)号：US07737368B2

公开(公告)日：2010-06-15

申请号：US11536317

申请日：2006-09-28

申请人： Yasuhiro Kohara ,  Ryosuke Usui ,  Noriaki Kojima

发明人： Yasuhiro Kohara ,  Ryosuke Usui ,  Noriaki Kojima

IPC分类号： H05K1/11

CPC分类号： H05K3/42 ,  H05K1/0366 ,  H05K3/002 ,  H05K3/0055 ,  H05K3/4602 ,  H05K2201/029 ,  H05K2201/0959 ,  Y10S428/901 ,  Y10T428/24917

摘要： A circuit board includes: a plurality of wiring layers; an insulating layer which insulates the plurality of wiring layers, the insulating layer containing a fibrous filler and a resin; and a conductor part formed on a sidewall of a via piercing through the insulating layer. The fibrous filler protrudes from the sidewall and is covered with the conductor part, with a length greater than the thickness of the conductor layer.

摘要翻译： 电路板包括：多个布线层; 绝缘层，其使所述多个布线层绝缘，所述绝缘层包含纤维填料和树脂; 以及形成在穿过绝缘层的通孔的侧壁上的导体部分。 纤维填料从侧壁突出并被导体部分覆盖，其长度大于导体层的厚度。

公开(公告)号：US20070252249A1

公开(公告)日：2007-11-01

申请号：US11740669

申请日：2007-04-26

申请人： Makoto Murai ,  Yasuhiro Kohara ,  Ryosuke Usui

发明人： Makoto Murai ,  Yasuhiro Kohara ,  Ryosuke Usui

IPC分类号： H01L23/495

CPC分类号： H05K3/243 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/49171 ,  H01L2224/81801 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/284 ,  H05K3/3452 ,  H05K3/382 ,  H05K2201/0989 ,  H05K2203/049 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49222 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.

摘要翻译： 密封树脂层在焊盘电极部分的剥离的可能性降低，从而提高了电路设备的可靠性。 电路装置包括布线层，镀金层，绝缘树脂层，电路元件，导电构件和密封树脂层。 金电镀层形成在焊盘电极的布线层区域中。 该地区外面的表面粗糙。 绝缘树脂层形成为覆盖布线层，并且在形成焊盘电极的区域中具有开口。 电路元件安装在绝缘树脂层上的预定区域上。 密封树脂层形成在绝缘树脂层上，以完全覆盖电路元件和焊盘电极的开口。 用于焊盘电极的区域中的密封树脂层与镀金层和布线层接触。

公开(公告)号：US20120086901A1

公开(公告)日：2012-04-12

申请号：US13378945

申请日：2010-01-25

申请人： Akira Nakagawa ,  Yasuhiro Kohara

发明人： Akira Nakagawa ,  Yasuhiro Kohara

IPC分类号： G02F1/1339

CPC分类号： G02F1/13394 ,  B41P2200/12 ,  B41P2215/50 ,  G02F2001/13396 ,  G02F2001/13398 ,  G02F2202/023

摘要： A liquid crystal display device includes a plurality of columnar spacers configured to maintain a constant gap between substrates on a color filter substrate of the liquid crystal display device. At a tip end of each of the columnar spacers contacting an array substrate, a height adjusting portion which is easily deformed as compared to a portion of the columnar spacer other than the tip end portion when the pair of substrates are bonded together is provided.

摘要翻译： 液晶显示装置包括多个柱状间隔件，其构造成在液晶显示装置的滤色器基板上保持基板之间的恒定的间隙。 在与阵列基板接触的每个柱状间隔件的顶端设置有一对高度调节部，该高度调节部在一对基板接合在一起时，与顶端部以外的柱状隔离物的一部分相比容易变形。

公开(公告)号：US07612445B2

公开(公告)日：2009-11-03

申请号：US11740669

申请日：2007-04-26

申请人： Makoto Murai ,  Yasuhiro Kohara ,  Ryosuke Usui

发明人： Makoto Murai ,  Yasuhiro Kohara ,  Ryosuke Usui

IPC分类号： H01L23/48 ,  H01L23/06 ,  H01R43/00

CPC分类号： H05K3/243 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/49171 ,  H01L2224/81801 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/284 ,  H05K3/3452 ,  H05K3/382 ,  H05K2201/0989 ,  H05K2203/049 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49222 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.

摘要翻译： 密封树脂层在焊盘电极部分的剥离的可能性降低，从而提高了电路设备的可靠性。 电路装置包括布线层，镀金层，绝缘树脂层，电路元件，导电构件和密封树脂层。 金电镀层形成在焊盘电极的布线层区域中。 该地区外面的表面粗糙。 绝缘树脂层形成为覆盖布线层，并且在形成焊盘电极的区域中具有开口。 电路元件安装在绝缘树脂层上的预定区域上。 密封树脂层形成在绝缘树脂层上，以完全覆盖电路元件和焊盘电极的开口。 用于焊盘电极的区域中的密封树脂层与镀金层和布线层接触。

公开(公告)号：US07439614B2

公开(公告)日：2008-10-21

申请号：US11139238

申请日：2005-05-26

申请人： Yasunori Inoue ,  Ryosuke Usul ,  Yasuhiro Kohara ,  Nobuhisa Takakusaki ,  Takeshi Nakamura

发明人： Yasunori Inoue ,  Ryosuke Usul ,  Yasuhiro Kohara ,  Nobuhisa Takakusaki ,  Takeshi Nakamura

IPC分类号： H01L23/12 ,  H01L23/053 ,  H01L23/34

CPC分类号： H01L23/3735 ,  H01L21/4857 ,  H01L21/4871 ,  H01L23/49822 ,  H01L23/5383 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0035 ,  H05K3/284 ,  H05K3/421 ,  H05K3/423 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/09772 ,  H05K2201/09781 ,  H05K2203/0369 ,  H05K2203/0554 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00015

摘要： In a manufacturing method of a hybrid integrated circuit device 10 according to the present invention, a first dummy pattern D1 is provided on a first wiring layer 18A. Furthermore, a second dummy pattern D2 is provided on a second wiring layer 18B. The first dummy pattern D1 and the second dummy pattern D2 are connected through a connection part 25 which penetrates an insulation layer 17. Hence, heat dissipation through a dummy pattern can be actively performed. In addition, even in the cases where a multi-layered wiring is formed, it is possible to provide a circuit device which can secure a heat dissipation property.

摘要翻译： 在根据本发明的混合集成电路装置10的制造方法中，在第一布线层18A上设置第一虚设图案D 1。此外，第二布线层18B设置第二虚设图案D 2 第一虚设图案D 1和第二虚设图案D 2通过贯穿绝缘层17的连接部25连接。 因此，可以主动地执行通过虚拟图案的散热。 此外，即使在形成多层布线的情况下，也可以提供能够确保散热性的电路装置。

公开(公告)号：US20080236879A1

公开(公告)日：2008-10-02

申请号：US12058040

申请日：2008-03-28

申请人： Yasuhiro Kohara ,  Kiyoshi Shibata ,  Masayuki Nagamatsu ,  Ryosuke Usui ,  Toshiya Shimizu

发明人： Yasuhiro Kohara ,  Kiyoshi Shibata ,  Masayuki Nagamatsu ,  Ryosuke Usui ,  Toshiya Shimizu

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K3/383 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/564 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/056 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K3/243 ,  H05K3/3452 ,  H05K2201/09727 ,  H05K2201/09772 ,  H05K2201/0989 ,  H05K2203/0307 ,  H05K2203/0361 ,  H05K2203/049 ,  H05K2203/0542 ,  H05K2203/0723 ,  H05K2203/1152 ,  H05K2203/1476 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.

摘要翻译： 提供了一种具有增强的抗湿性的电路板和制造该电路板的方法，以及电路装置和该电路装置的制造方法。 本发明的电路板包括：基板; 在基板的主表面上形成的布线; 覆盖除了作为连接器的区域的布线的覆盖层; 形成在基板的底面上的背面电极; 以及形成为穿透基板的通孔电极，从而连接布线和背面电极。 在该电路基板的各配线的表面上，基板周边的凸部的宽度比基板的中央部的凸部的宽度大。 利用这种结构，可以提高热循环负载下的布线与覆盖层之间的粘附可靠性。

公开(公告)号：US20080061437A1

公开(公告)日：2008-03-13

申请号：US11847933

申请日：2007-08-30

申请人： Yasuhiro Kohara ,  Ryosuke Usui ,  Takeshi Nakamura ,  Yusuke Igarashi

发明人： Yasuhiro Kohara ,  Ryosuke Usui ,  Takeshi Nakamura ,  Yusuke Igarashi

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A technology is provided for a packaging board adapted to mount a device capable of improving handleability and securing connection reliability. The packaging board includes: a pad electrode formed on a substrate; an insulating layer covering the substrate, having an opening at least in part in an area over the pad electrode; and a joint layer formed on the pad electrode inside the opening. The surface of the joint layer is lower than the top lip of the opening.

摘要翻译： 提供了一种用于适于安装能够改善可操作性并确保连接可靠性的装置的包装板的技术。 包装板包括：形成在基板上的焊盘电极; 覆盖所述基板的绝缘层，至少部分地具有在所述焊盘电极上的区域中的开口; 以及形成在开口内的焊盘电极上的接合层。 接合层的表面低于开口的上唇。