公开(公告)号：WO02058137A3

公开(公告)日：2003-01-16

申请号：PCT/US0149398

申请日：2001-12-19

Applicant: FORMFACTOR INC

Inventor： GRUBE GARY W ,  KHANDROS IGOR K ,  MATHIEU GAETAN L

IPC: B81B3/00 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01H1/00 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H05K3/20 ,  H05K3/34

CPC classification number: G01R1/06727 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  H01H1/0036 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/10 ,  H01L24/72 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K3/20 ,  H05K3/3421 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00

Abstract: An improved microelectronic spring structure, and method of making the same, are disclosed. The improvement comprises, in a spring contact of the type comprising a beam (104) attached to a post, of replacing the post with a plurality of column elements (102). The beam component (104) is thus provided with one or more column elements (102) which both structurally support and electrically connect one end of the beam to an electronic component. The column elements (102) are preferably comprised of relatively straight segments of wire elements that are ball-bonded to a substrate (114) and are over-coated with suitable structural and/or conducting materials. In the alternative, the improvement comprises a single column element comprised of a relatively straight segment of wire that is ball-bonded to a substrate and over-coated with suitable structural and conducting materials, wherein the column element is essentially rigid. The improved spring structures are especially useful for use as spring contacts on substrates such as probe cards, interposers, semiconductor devices, and other electronic components.

Abstract translation: 公开了一种改进的微电子弹簧结构及其制造方法。 该改进包括在包括附接到柱的梁（104）的类型的弹簧接触中，用多个柱元件（102）替换柱。 梁部件（104）因此设置有一个或多个列元件（102），其两个结构上支撑并将电子束的一端电连接到电子部件。 柱元件（102）优选地由相对直的线元件组成，其被球形结合到基底（114）并且被适当的结构和/或导电材料覆盖。 在替代方案中，改进包括单柱元件，其由相对直的导线段组成，其与球体结合到基底上并用适当的结构和导电材料涂覆，其中柱元件基本上是刚性的。 改进的弹簧结构特别适用于诸如探针卡，插入件，半导体器件和其它电子部件的基板上的弹簧触点。

公开(公告)号：WO0225825A3

公开(公告)日：2002-10-10

申请号：PCT/US0142252

申请日：2001-09-19

Applicant: NANOPIERCE TECHNOLOGIES INC

Inventor： NEUHAUS HERBERT J ,  WERNLE MICHAEL E ,  BLUM FREDERICK A ,  KOBAR MICHAEL

IPC: G06K19/07 ,  G06K19/077 ,  H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/40 ,  H01L21/66 ,  G06K19/06 ,  H01L23/48 ,  H01Q1/24 ,  H01Q1/36 ,  H04Q5/22

CPC classification number: H01L24/10 ,  G06K19/07752 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/29 ,  H01L24/31 ,  H01L24/48 ,  H01L24/83 ,  H01L24/95 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13609 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29409 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/325 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/7565 ,  H01L2224/81193 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/95085 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K3/325 ,  H05K3/4007 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/01046 ,  H01L2924/01082 ,  H01L2924/00012

Abstract: The invention provides a method for permanently physically and electrically attaching the electrically conductive contacts (220) of a first component (210) in a RFID device, such as a smart card or smart inlay, to the electrically conductive contacts (214) of a second component (212)of the device. Attachment is made between the first and second components of the device by co-depositing metal and electrically conductive hard particles (218) upon the conductive contacts of either the first (210) or second (212) components and using a non-conductive adhesive (224) to provide permanent bond between the components (210) (212) and their conductive contacts (220) (214). Components (210) (212) of an RFID device may include, for example, a memory chip, a microprocessor chip, a transceiver, or other discrete or integrated circuit device, a chip carrier, a chip module, and a conductive area, e.g., an antenna.

Abstract translation: 本发明提供了一种用于将第一部件（210）的导电触头（220）永久物理地和电连接到诸如智能卡或智能嵌体的RFID装置中的方法， 组件（212）。 通过将金属和导电硬颗粒（218）共同沉积在第一（210）或第二（212）部件的导电接触件上并使用非导电粘合剂（ 224）以在部件（210）（212）和它们的导电触头（220）（214）之间提供永久性接合。 RFID设备的组件（210）（212）可以包括例如存储器芯片，微处理器芯片，收发器或其它分立或集成电路设备，芯片载体，芯片模块和导电区域，例如 ，天线。

公开(公告)号：WO0198793A3

公开(公告)日：2002-07-25

申请号：PCT/US0119792

申请日：2001-06-20

Applicant: NANONEXUS INC ,  MOK SAMMY ,  CHONG FU CHIUNG

Inventor： MOK SAMMY ,  CHONG FU CHIUNG

IPC: G01R31/26 ,  G01R1/067 ,  G01R1/073 ,  H01L21/66 ,  H01L23/12 ,  H01L23/31 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  G01R3/00

CPC classification number: H01L23/3114 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/07307 ,  H01L24/10 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/274 ,  H01L2224/75251 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00

Abstract: Several embodiments of stress metal springs are disclosed, which typically comprise a plurality of stress metal layers that are established on a substrate, which are then controllably patterned and partially released from the substrate. An effective rotation angle is typically created in the formed stress metal springs, defining a looped spring structure. The formed springs provide high pitch compliant electrical contacts for a wide variety of interconnection systems, including chip scale semiconductor packages, high density interposer connectors, and probe contactors. Several embodiments of massively parallel interface integrated circuit test assemblies are also disclosed, comprising one or more substrates having stress metal spring contacts, to establish connections between one or more separated integrated circuits on a compliant wafer carrier.

Abstract translation: 公开了应力金属弹簧的几个实施例，其通常包括建立在衬底上的多个应力金属层，然后可控制地构图并从衬底部分地释放衬底。 通常在形成的应力金属弹簧中产生有效的旋转角度，从而限定环形弹簧结构。 形成的弹簧为各种各样的互连系统提供高音调兼容的电触点，包括芯片级半导体封装，高密度插入器连接器和探针接触器。 还公开了大规模并行接口集成电路测试组件的几个实施例，其包括具有应力金属弹簧触点的一个或多个衬底，以在柔性晶片载体上建立一个或多个分离的集成电路之间的连接。

公开(公告)号：WO02033750A1

公开(公告)日：2002-04-25

申请号：PCT/US2001/002385

申请日：2001-01-25

IPC: H01L21/60 ,  H01L21/56 ,  H01L23/485

CPC classification number: H01L24/10 ,  H01L21/563 ,  H01L24/13 ,  H01L24/29 ,  H01L2224/1184 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/2784 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/13111 ,  H01L2224/0401

Abstract: The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.

Abstract translation: 本发明涉及将集成电路芯片连接到电路基板的方法。 该方法包括将粘合剂预先施加到集成电路芯片的凸起侧的步骤。 该方法还包括以下步骤：从焊料凸起的尖端去除粘合剂的部分以暴露接触表面，并将先前已经涂覆有粘合剂的集成电路芯片的凸起侧压在电路基板上，使得 所述凸块提供所述集成电路芯片和所述电路基板之间的电连接。 使用溶剂辅助擦拭动作从粘合剂凸块的尖端去除粘合剂。 芯片上的预先施加的粘合剂在集成电路芯片和电路基板之间形成结合。

公开(公告)号：WO02025825A2

公开(公告)日：2002-03-28

申请号：PCT/US2001/042252

申请日：2001-09-19

IPC: G06K19/07 ,  G06K19/077 ,  H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/40 ,  H04B

CPC classification number: H01L24/10 ,  G06K19/07752 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/29 ,  H01L24/31 ,  H01L24/48 ,  H01L24/83 ,  H01L24/95 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13609 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29409 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/325 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/7565 ,  H01L2224/81193 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/95085 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K3/325 ,  H05K3/4007 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/01046 ,  H01L2924/01082 ,  H01L2924/00012

Abstract: The invention provides a method for permanently physically and electrically attaching the electrically conductive contacts (220) of a first component (210) in a RFID device, such as a smart card or smart inlay, to the electrically conductive contacts (214) of a second component (212)of the device. Attachment is made between the first and second components of the device by co-depositing metal and electrically conductive hard particles (218) upon the conductive contacts of either the first (210) or second (212) components and using a non-conductive adhesive (224) to provide permanent bond between the components (210) (212) and their conductive contacts (220) (214). Components (210) (212) of an RFID device may include, for example, a memory chip, a microprocessor chip, a transceiver, or other discrete or integrated circuit device, a chip carrier, a chip module, and a conductive area, e.g., an antenna.

Abstract translation: 本发明涉及一种方法，用于组装永久的物理和电的射频识别装置，的第一部件（210）的导电触点（220），如智能卡或智能插入， 装置（212）的第二部件的导电触点（214）。 通过在第一部件（210）或第二部件（212）的导电触点上共同沉积金属和导电固体颗粒（218），在装置的第一和第二部件之间形成组件，并且使用 绝缘粘合剂（224），用于永久地粘合组件（210,212）及其导电触点（220,214）。 射频识别装置的组件（210,212）例如可以采用存储器芯片，微处理器芯片，收发器或其他集成电路器件的形式。 或分立的芯片载体，芯片模块和诸如天线的导电区域。

公开(公告)号：WO00079590A1

公开(公告)日：2000-12-28

申请号：PCT/DE2000/001983

申请日：2000-06-16

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H01R12/04 ,  H01R13/03 ,  H01R13/24 ,  H05K3/32

CPC classification number: H01L24/10 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/96 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/19 ,  H01L2224/81193 ,  H01L2224/81899 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H01R13/03 ,  H01R13/2414 ,  H05K3/325 ,  H01L2924/00

Abstract: The invention relates to an electronic device which has electrical contacts (1) at least on a first surface (2), for contacting the electronic device. At least one flexible projection (3) consisting of an insulating material is provided on the first surface (2). Said flexible projection (3) has at least one recess (5, 6) and the surface (10, 11) of the flexible projection (3) is at least partially covered with an electroconductive material (8) in order to form an electrical contact (1).

Abstract translation: 公开的是具有电触点（1）至少一个柔性突出部（3）的绝缘材料被设置在至少在第一表面上的电子器件（2），用于电子装置接触所述的电子设备，其中，所述第一表面（2）上和 柔性仰角（3）具有至少一个凹部（5,6）和所述柔性突出部（3）的表面（10，11），以形成电接触件（1）至少部分地覆盖有导电材料（8）。

公开(公告)号：WO00055912A1

公开(公告)日：2000-09-21

申请号：PCT/US1999/020191

申请日：1999-09-02

IPC: H01L21/60 ,  H01L21/98 ,  H01L23/485 ,  H01L23/48 ,  H01L23/40 ,  H01L23/52

CPC classification number: H01L25/50 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/81122 ,  H01L2224/81801 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A unique integrated circuit device and method for using same is disclosed. The integrated circuit includes a plurality of bonding pads (12a-12L). Coupled to each bonding pads is a ferromagnetic material and an external connector, such as a solder bump. The ferromagnetic material (22) is isolated to an area associated with each bonding pad. When the ferromagnetic material (22) is magnetized, it is capable of aligning the solder bump (30) to a connection point of another device, as long as the connection point is magnetically attracted. The other device may be a second integrated circuit device or a circuit device or a circuit board. As a result, the bonding pad aligns with and connects to the connection point.

Abstract translation: 公开了一种独特的集成电路装置及其使用方法。 集成电路包括多个接合焊盘（12a-12L）。 耦合到每个接合焊盘是铁磁材料和外部连接器，例如焊料凸块。 铁磁材料（22）被隔离到与每个接合焊盘相关联的区域。 当铁磁材料（22）被磁化时，只要连接点被磁吸引就可以将焊料凸点（30）对准另一个装置的连接点。 另一个装置可以是第二集成电路装置或电路装置或电路板。 结果，接合焊盘与连接点对准并连接到连接点。

公开(公告)号：WO00030171A1

公开(公告)日：2000-05-25

申请号：PCT/US1999/020143

申请日：1999-09-02

IPC: B23K35/26 ,  H01L21/60 ,  H01L23/485 ,  H01L23/556 ,  H05K3/34

CPC classification number: H01L24/10 ,  H01L23/556 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/11502 ,  H01L2224/11849 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01092 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/3463 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05671 ,  H01L2224/05099

Abstract: An improved solder bump composition and method advantageously employs a thin low-alpha layer (310) of lead (Pb) deposited in close proximity to alpha particle sensitive devices, while ordinary (i.e., low cost) Pb is used for the bulk (302) of the solder bump (320). This approach allows for reduced overall cost while still providing protection from alpha-particle induced soft errors. The low-alpha layer reduces the flux of alpha particle into devices in two ways. First, the low-alpha layer is itself essentially Pb free and therefore alpha particle emissions from the low-alpha layer are negligable. Second, the low alpha layer is substantially opaque to alpha particles emitted by the ordinary Pb which include Pb . As a result, sensitive circuits on a semiconductor chip employing the improved solder bump are shielded from alpha particle emissions of the low-cost Pb -containing portion of a solder bump.

Abstract translation: 改进的焊料凸块组合物和方法有利地使用沉积在α粒子敏感器件附近的铅（Pb）的薄的低α层（310），而普通（即，低成本）Pb用于块体（302） 的焊料凸块（320）。 这种方法允许降低总体成本，同时仍然提供对α粒子诱导的软错误的保护。 低α层以两种方式将α粒子的通量降低到器件中。 首先，低α层本身本质上是Pb <210>，因此来自低α层的α粒子发射是可以忽略的。 第二，低α层对于包括Pb <210>的普通Pb发射的α粒子基本上是不透明的。 结果，使用改进的焊料凸块的半导体芯片上的敏感电路被屏蔽了焊料凸块的低成本含Pb <210>的部分的α粒子发射。

公开(公告)号：WO00004584A2

公开(公告)日：2000-01-27

申请号：PCT/DE1999/002118

申请日：1999-07-06

IPC: H01L23/485 ,  H05K3/32 ,  H05K3/34 ,  H01L23/48 ,  H01L21/60 ,  H01L23/482

CPC classification number: H01L24/10 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49798 ,  Y10T156/1089 ,  H01L2924/00

Abstract: The invention relates to a semiconductor component in a chip format, comprising a chip with at least one first insulating layer (3) and electric contact surfaces (2) devoid of said insulating layer. Conductors (5) run from the electric contact surfaces (2) to the foot areas (10) of external connection elements (12) along the insulating layer (3). Another insulating layer (8) is also provided with through openings (9) leading from the outside to the foot areas (10) of the external connection elements (12). A conductive adhesive (11) is placed in said openings (9) and metallic globules (12) are placed at least on the outside thereon. The semiconductor element can also contain a solder paste instead of the conductive adhesive in the through openings (9), whereby the metallized synthetic globules are placed thereon. The invention also relates to a method for producing the semiconductor element thus described.

Abstract translation: 本发明涉及一种半导体器件，芯片格式具有芯片，所述至少一个第一绝缘层（3），并且其自由电连接焊盘（2）。 在第一绝缘层（3）延伸的印制导线（5）的电连接表面（2），通过外部连接元件（12）的支脚部分（10）的。 另一个施加绝缘层（8）设置有通道开口（9），其从所述外端部件的脚部区域（10）根据（12）的外侧引导。 在通道开口（9）上的至少金属珠（12）安装在外部的导电性粘接剂（11）。 半导体元件也可包含一个焊膏代替导电性粘接剂的被放置在金属化的塑料球到通道开口（9）。 本发明还涉及一种用于所述的半导体装置的制造方法。

公开(公告)号：WO99050906A1

公开(公告)日：1999-10-07

申请号：PCT/JP1999/001408

申请日：1999-03-19

IPC: H01L23/12 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L24/10 ,  H01L21/486 ,  H01L21/563 ,  H01L23/13 ,  H01L23/16 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15183 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/112 ,  H05K3/3457 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/0394 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05647 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor device whose external electrodes do not crack, a method for manufacturing the same, circuit substrate, and an electronic device are disclosed. The semiconductor device comprises an insulating film (14) through which through holes (14a) are made, a semiconductor chip (12) having electrodes (13), a wiring pattern (18) attached to an area of one of the sides of the insulating film (14), including the portions over the through holes (14a), with adhesive (17) and electrically connected to the electrodes (13), and external electrodes (16) provided to the wiring pattern (18) through the through holes (14a) and projecting from the side opposite to the side where the wiring pattern (18) is provided, the applied adhesive (17) being partly drawn and interposed between the through holes (14a) and the external electrodes (16).

Abstract translation: 公开了一种其外部电极不破裂的半导体器件，其制造方法，电路基板和电子器件。 该半导体器件包括：绝缘膜（14），通过该绝缘膜形成通孔（14a）;半导体芯片（12），具有电极（13）;布线图案（18），其安装在绝缘层 包括通孔（14a）上的部分，具有粘合剂（17）并电连接到电极（13）的薄膜（14）和通过通孔（...）设置到布线图案（18）的外部电极 14a）并且从设置有布线图案（18）的一侧的相反侧突出，所施加的粘合剂（17）被部分地拉伸并介于通孔（14a）和外部电极（16）之间。