公开(公告)号：JP2009027144A

公开(公告)日：2009-02-05

申请号：JP2008135691

申请日：2008-05-23

Applicant: Canon Inc ,  キヤノン株式会社

Inventor： TSUNODA TAKAYUKI

IPC: H05K1/11 ,  H01L23/12 ,  H05K3/40

CPC classification number: H05K3/245 ,  H01L21/4857 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/16 ,  H05K3/06 ,  H05K3/12 ,  H05K7/06 ,  H05K2201/0391 ,  H05K2201/0969 ,  H05K2201/2072 ,  H05K2203/0108 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board on which micro wires are connected to each other. SOLUTION: The wiring board includes a substrate 5 having an adhesive surface 8, first wiring 1, and second wiring 4. The adhesive surface 8 of the substrate 5 is in contact with the first wiring 1 and the second wiring 4, and the first wiring 1 has a through hole 3, and the second wiring 4 has a first region, a second region, and a third region, which are adjacent in this order. The first region is inside the through hole 3 of the first wiring 1 and is in contact with a portion 9 being in contact with the through hole 3, of the adhesive surface 8 of the substrate 5, and the second region is in contact with the first wiring 1 and faces the first wiring 1 and the substrate 5, and the third region is in contact with a portion 10 other than a portion being in contact with the through hole 3, of the adhesive surface 8 of the substrate 5. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种其上连接有微细线的布线板。 解决方案：布线基板包括具有粘合面8，第一布线1和第二布线4的基板5.基板5的粘合面8与第一布线1和第二布线4接触， 第一布线1具有通孔3，第二布线4具有依次相邻的第一区域，第二区域和第三区域。 第一区域位于第一布线1的通孔3的内部，与基板5的粘合面8与通孔3接触的部分9接触，第二区域与第二区域 第一布线1并且面对第一布线1和基板5，并且第三区域与除基板5的粘合表面8的与通孔3接触的部分以外的部分10接触。

版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP4181778B2

公开(公告)日：2008-11-19

申请号：JP2002028235

申请日：2002-02-05

Applicant: ソニー株式会社 ,  三菱樹脂株式会社

Inventor： 茂康 伊藤 ,  真浩 和泉 ,  稔 小川 ,  紳月 山田 ,  秀次 鈴木 ,  礼郎 黒崎

IPC: C08J5/18 ,  H05K3/20 ,  C08L71/10 ,  C08L79/08 ,  H01L23/12 ,  H01L23/14 ,  H05K1/03 ,  H05K1/09 ,  H05K3/04 ,  H05K3/10 ,  H05K3/22 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4632 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/09701 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/095 ,  H05K3/041 ,  H05K3/045 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2203/0108 ,  H05K2203/065 ,  Y02P20/582 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T428/24917 ,  Y10T428/249994

公开(公告)号：JPWO2006046510A1

公开(公告)日：2008-05-22

申请号：JP2006543131

申请日：2005-10-24

Applicant: イビデン株式会社

Inventor： 泰裕 渡辺 ,  泰裕 渡辺 ,  通昌 高橋 ,  通昌 高橋 ,  雅一 青山 ,  雅一 青山 ,  武信 中村 ,  武信 中村 ,  裕行 柳沢 ,  裕行 柳沢

IPC: H05K3/34 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/113 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/114 ,  H05K3/243 ,  H05K3/28 ,  H05K3/282 ,  H05K3/4614 ,  H05K2201/0391 ,  H05K2201/10674 ,  H05K2203/0574 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  H01L2224/0401

Abstract: 【課題】信頼性を向上させて、電気的接続性や機能性を確保させ、特に、落下試験に対する信頼性をより向上させることができる多層プリント配線板を提供する。【解決手段】部品が実装される半田パッド60Bには、耐食層が形成されておらず柔軟性がある。このため、落下の際に衝撃を受けた際でも、衝撃を緩衝することができ、実装部品の脱落が起こり難くなる。他方、耐食層が形成されたランド60Aは、操作キーを構成する炭素柱が繰り返し接触しても接触不良を引き起こし難い。【選択図】図9

公开(公告)号：JP3952129B2

公开(公告)日：2007-08-01

申请号：JP2000600305

申请日：2000-02-17

Applicant: セイコーエプソン株式会社

Inventor： 伸晃 橋元

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H05K1/11 ,  H05K3/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/42

CPC classification number: H01L24/86 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0393 ,  H05K1/112 ,  H05K3/242 ,  H05K3/243 ,  H05K3/323 ,  H05K3/422 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/0394 ,  H05K2203/049 ,  H05K2203/072 ,  H05K2203/0733 ,  H05K2203/1476 ,  H05K2203/1545 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671

Abstract: There is provided a semiconductor device comprising: a first plating layer formed on one surface of an interconnect pattern; a second plating layer formed within through holes in the interconnect pattern; a semiconductor chip electrically connected to the first plating layer; an anisotropic conductive material provided on the first plating layer; and a conductive material provided on the second plating layer, wherein the first plating layer has appropriate adhesion properties with the anisotropic conductive material, and the second plating layer has appropriate adhesion properties with the conductive material.

公开(公告)号：JP2006080493A

公开(公告)日：2006-03-23

申请号：JP2005215800

申请日：2005-07-26

Applicant: Ricoh Microelectronics Co Ltd ,  リコーマイクロエレクトロニクス株式会社

Inventor： MORIYAMA EIJI

IPC: H05K1/09 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K3/243 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49894 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48799 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81024 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0268 ,  H05K3/282 ,  H05K3/328 ,  H05K3/341 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/10674 ,  H05K2203/162 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/43 ,  H01L2924/01006

Abstract: PROBLEM TO BE SOLVED: To provide a PWB which can prevent solder from becoming brittle, when a large amount of gold on a surface of an electrode is deposited into the solder, and cause some of two or more electrodes to function properly as contact electrodes. SOLUTION: In a PWB 150, where a plurality of electrodes are formed on a surface of a substrate 153 made of glass epoxy with copper wires, non-Au electrodes 151 that does not have provided Au surface layers made of gold and Au electrodes 152, including Au surface layers are both formed as the electrodes. An oxidation suppressing film 154 is formed on the surface of the non-Au electrode 151. The oxidation suppressing film 154 is made of flux which is a material different from gold. The oxidation suppressing films 154 suppress oxidation of the non-Au electrodes 151, so that the PWB 150 can be prepared in advance. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供可以防止焊料变脆的PWB，当电极表面上的大量金沉积到焊料中时，并且使得两个或更多个电极中的一些可以正常地起作用 接触电极。 解决方案：在PWB 150中，在由铜线制成的玻璃环氧树脂制的基片153的表面上形成多个电极，不具有由金制成的Au表面层的金Au和Au 包括Au表面层的电极152均形成为电极。 在非Au电极151的表面上形成氧化抑制膜154.氧化抑制膜154由与金不同的材料的焊剂制成。 氧化抑制膜154抑制非Au电极151的氧化，从而可以预先制备PWB 150。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005268353A

公开(公告)日：2005-09-29

申请号：JP2004075561

申请日：2004-03-17

Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

Inventor： TAMATATE YUKA

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/34 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K3/24 ,  H05K3/34

CPC classification number: H01L25/0657 ,  H01L21/4846 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/243 ,  H05K3/3484 ,  H05K2201/0391 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/0425 ,  H05K2203/0485 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method capable of easily mass-producing wiring boards on each of which connection pads for flip chip connection and bonding pads for wire bonding connection are mounted. SOLUTION: Pads 16a, 18a for connection pads and bonding pads are formed on the surface of a substrate 30 for a batch process as a work, the pads 16a for the connection pads are shielded and then bonding plating 36 is applied to the surfaces of the pads 18a for the bonding pads. Then a masking tape 42 is stuck to an area on which the bonding pads 18 are formed to shield the bonding pads 18 and then an adhesive layer 50 is stuck to the surface of the pads 16a for the connection pads. Then solder powder 52 is stuck to the surface of the pads 16a, and after peeling off the tape 42, the solder powder 52 is melted by reflow to stick solder 52a to the pads 16a. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种能够容易地批量生产用于倒装芯片连接的连接焊盘和用于引线接合连接的焊盘的线路板的制造方法。 解决方案：用于连接焊盘和接合焊盘的焊盘16a，18a形成在作为工件的批处理的基板30的表面上，用于连接焊盘的焊盘16a被屏蔽，然后将焊接电镀36施加到 用于焊盘的焊盘18a的表面。 然后，将胶带42粘贴到其上形成有焊盘18的区域以屏蔽接合焊盘18，然后将粘合剂层50粘附到用于连接焊盘的焊盘16a的表面。 然后将焊料粉末52粘贴在焊盘16a的表面上，剥离带42后，焊料粉末52通过回流熔化，将焊料52a焊接到焊盘16a上。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2004282909A

公开(公告)日：2004-10-07

申请号：JP2003071337

申请日：2003-03-17

Applicant: Yazaki Corp ,  矢崎総業株式会社

Inventor： UESONO KOICHI

IPC: H02G3/16 ,  B60R16/02 ,  B60R16/023 ,  H05K1/02 ,  H05K3/10 ,  H05K7/02

CPC classification number: B60R16/0238 ,  H05K1/0263 ,  H05K3/103 ,  H05K7/026 ,  H05K2201/0391 ,  H05K2201/09845 ,  H05K2201/09972 ,  H05K2201/10272 ,  H05K2201/10287

Abstract: PROBLEM TO BE SOLVED: To make thin a circuit board assembly including a bus bar circuit board. SOLUTION: A circuit board 1 for wiring a wire 12 is provided with level difference parts 3 and 4 continuously to a plate part 9 thinner than the wiring circuit board, and bus bar circuit boards 5 and 6 are arranged at the plate part 9. The level difference parts 3 and 4 are provided on the surface and rear of the wiring circuit board 1, the plate part 9 is located in the center of the wiring circuit board in the thickness direction, and the bus bar circuit boards 5 and 6 are arranged on the surface and rear of the plate part. The bus bar circuit boards 5 and 6 have a thickness equal to or smaller than the thickness of the level difference parts 3 and 4. A bus bar 21 is contained in the wiring groove 22 of the bus bar circuit boards 5 and 6. Terminal 25 of the bus bar 21 on the bus bar circuit board 5 is connected with the wire 12 on the wiring circuit board 1. The first bus bar circuit board 5 engages with one level difference part 3 of the first layer wiring circuit board 1 and the second bus bar circuit board 6 secured to a second layer wiring circuit board 2 engages with the other level difference part 4 of the wiring circuit board 1. COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2004274967A

公开(公告)日：2004-09-30

申请号：JP2003066253

申请日：2003-03-12

Applicant: Auto Network Gijutsu Kenkyusho:Kk ,  Sumitomo Electric Ind Ltd ,  Sumitomo Wiring Syst Ltd ,  住友電気工業株式会社 ,  住友電装株式会社 ,  株式会社オートネットワーク技術研究所

Inventor： TAKAGI KOICHI

IPC: B60R16/02 ,  H02G3/16 ,  H05K1/00 ,  H05K3/20

CPC classification number: H05K3/202 ,  H05K1/029 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/094 ,  H05K2201/10166 ,  H05K2203/175

Abstract: PROBLEM TO BE SOLVED: To efficiently manufacture two or more kinds of circuit structures that build up power circuits different from each other. SOLUTION: This bus bar structuring board 10 is constituted by arraying two or more pieces of bus bars on roughly the same plane in an arrangement that builds up the power circuits and by integrating them. The structuring board is manufactured that has an entire shape in which two or more kinds of power circuits are built up by selecting positions where bus bars are separated from each other. The structuring board 10 is adhered to a control circuit board, for instance. Then, of joint portions 15, 15A, 15B, 15C, the joint portions of the bus bars that are required to be separated to build up desired power circuits are selected and such joint portions are separated. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2004253759A

公开(公告)日：2004-09-09

申请号：JP2003174298

申请日：2003-06-19

Applicant: Auto Network Gijutsu Kenkyusho:Kk ,  Sumitomo Electric Ind Ltd ,  Sumitomo Wiring Syst Ltd ,  住友電気工業株式会社 ,  住友電装株式会社 ,  株式会社オートネットワーク技術研究所

Inventor： TAKAGI KOICHI ,  MIZUNO FUMIAKI

IPC: H01R13/66 ,  H02G3/16 ,  H05K1/11 ,  H05K1/14 ,  H05K3/20 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42 ,  H05K5/00 ,  H05K7/06 ,  H05K7/20 ,  H01R12/06

CPC classification number: H05K7/20854 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/09181 ,  Y10T29/49133 ,  Y10T29/49144

Abstract: PROBLEM TO BE SOLVED: To stabilize the quality and to improve the reliability of the joint between a control circuit board 20 and an external circuit. SOLUTION: When the conductor of a bus bar 14 or the like is connected to the control circuit board 20, a notch section 20a having a shape opened toward a side is formed at the edge of the control circuit board 20 and a conductor layer 24 is deposited to the edge of the control circuit board 20. Soldering 26 is performed so that the solder spreads over the conductor layer 24 and the busbar 14 while they are overlapped. COPYRIGHT: (C)2004,JPO&NCIPI

Abstract translation: 要解决的问题：为了稳定质量并提高控制电路板20和外部电路之间的接头的可靠性。 解决方案：当母线14等的导体连接到控制电路板20时，在控制电路板20的边缘处形成具有向侧面开口的形状的切口部分20a， 层24沉积到控制电路板20的边缘。进行焊接26，使得焊料在重叠时扩散在导体层24和母线14上。 版权所有（C）2004，JPO＆NCIPI

公开(公告)号：JP2003068501A

公开(公告)日：2003-03-07

申请号：JP2002141592

申请日：2002-05-16

Applicant: Shipley Co Llc ,  シップレーカンパニー エル エル シー

Inventor： SENK DAVID D ,  SCHEMENAUR JOHN

IPC: H01C8/00 ,  H01C7/00 ,  H01C7/18 ,  H01C17/08 ,  H05K1/16

CPC classification number: H01C17/08 ,  H01C7/006 ,  H01C7/18 ,  H05K1/167 ,  H05K2201/0373 ,  H05K2201/0391

Abstract: PROBLEM TO BE SOLVED: To provide a resistive material having resistivities which are different depending on the directions in which it is embedded in a printed wiring board. SOLUTION: The resistive material has a resistivity in a first direction and a different resistivity in a second direction which is essentially orthogonal to the first direction, with the first resistivity being twice or larger than the second resistivity. The resistivities of the resistive material are axis dependent.

Abstract translation: 要解决的问题：提供具有根据嵌入印刷电路板的方向不同的电阻的电阻材料。 解决方案：电阻材料在第一方向具有电阻率，并且在基本上与第一方向正交的第二方向上具有不同的电阻率，第一电阻率是第二电阻率的两倍或更大。 电阻材料的电阻率是轴依赖的。