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公开(公告)号：TW201724302A
公开(公告)日：2017-07-01
申请号：TW106107747
申请日：2014-02-11
Inventor： 林俊成 , LIN, JING CHENG , 黃震麟 , HUANG, CHENG LIN , 曹瑋安 , TSAO, WEI AN
IPC: H01L21/60 , H01L23/488
CPC classification number: H01L24/16 , H01L23/291 , H01L24/11 , H01L24/12 , H01L24/13 , H01L24/14 , H01L24/15 , H01L25/0657 , H01L2224/03831 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/05147 , H01L2224/05166 , H01L2224/05557 , H01L2224/05567 , H01L2224/05572 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/13018 , H01L2224/13022 , H01L2224/13083 , H01L2224/13084 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16507 , H01L2224/81193 , H01L2924/1461 , H01L2924/35121 , H01L2924/00 , H01L2924/00014 , H01L2924/01013 , H01L2924/00012 , H01L2924/014
Abstract: 本發明揭露一種凸塊結構及其製造方法。凸塊結構包括一鈍化保護層，形成於一金屬墊上，且鈍化保護層具有一凹口，暴露出金屬墊的一部分。一金屬凸塊形成於金屬墊上，且金屬凸塊具有一唇緣結構，延伸於鈍化保護層下方，唇緣結構將金屬凸塊錨定於鈍化保護層。本發明亦揭露一種凸塊接點。
Abstract in simplified Chinese: 本发明揭露一种凸块结构及其制造方法。凸块结构包括一钝化保护层，形成于一金属垫上，且钝化保护层具有一凹口，暴露出金属垫的一部分。一金属凸块形成于金属垫上，且金属凸块具有一唇缘结构，延伸于钝化保护层下方，唇缘结构将金属凸块锚定于钝化保护层。本发明亦揭露一种凸块接点。
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公开(公告)号：TW201705393A
公开(公告)日：2017-02-01
申请号：TW104139199
申请日：2015-11-25
Inventor： 林俊成 , LIN, JING CHENG , 張智堯 , CHANG, JEFFREY , 蘇峻興 , SU, CHUN HSING , 符策忠 , FU, TSEI CHUNG , 茅一超 , MAO, YI CHAO
CPC classification number: H01L23/3114 , H01L21/565 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/12105 , H01L2224/94 , H01L2924/18162 , H01L2224/214
Abstract: 一裝置構裝之實施例包含半導體晶粒、鑄模化合物沿著半導體晶粒之側壁延伸、及平坦化聚合物層於鑄模化合物上且沿著半導體晶粒之側壁延伸。鑄模化合物包含第一填料，而平坦化聚合物層包含小於第一填料之第二填料。裝置構裝進一步包含一或多個扇出型(fan-out)重新佈線層(RDL)電性連接至半導體晶粒，其中一或多個扇出型重新佈線層(RDL)延伸過半導體晶粒之邊緣而至平坦化聚合物層之上表面上。
Abstract in simplified Chinese: 一设备构装之实施例包含半导体晶粒、铸模化合物沿着半导体晶粒之侧壁延伸、及平坦化聚合物层于铸模化合物上且沿着半导体晶粒之侧壁延伸。铸模化合物包含第一填料，而平坦化聚合物层包含小于第一填料之第二填料。设备构装进一步包含一或多个扇出型(fan-out)重新布线层(RDL)电性连接至半导体晶粒，其中一或多个扇出型重新布线层(RDL)延伸过半导体晶粒之边缘而至平坦化聚合物层之上表面上。
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公开(公告)号：TWI567916B
公开(公告)日：2017-01-21
申请号：TW103101924
申请日：2014-01-20
Inventor： 張進傳 , CHANG, CHIN CHUAN , 林俊成 , LIN, JING CHENG , 余振華 , YU, CHEN HUA
CPC classification number: H01L25/0655 , H01L21/486 , H01L21/561 , H01L21/563 , H01L21/76898 , H01L21/78 , H01L23/147 , H01L23/3114 , H01L23/3128 , H01L23/367 , H01L23/481 , H01L23/49541 , H01L23/498 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/49872 , H01L23/5226 , H01L23/5384 , H01L23/5389 , H01L24/06 , H01L24/16 , H01L24/81 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/06137 , H01L2224/12105 , H01L2224/24137 , H01L2224/73204 , H01L2224/73259 , H01L2224/92224 , H01L2225/06513 , H01L2225/06541 , H01L2225/06544 , H01L2225/06555 , H01L2225/06582 , H01L2924/12042 , H01L2924/15788 , H01L2924/181 , H01L2924/00
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公开(公告)号：TWI548319B
公开(公告)日：2016-09-01
申请号：TW102140426
申请日：2013-11-07
Inventor： 余振華 , YU, CHEN HUA , 林士庭 , LIN, SHIH TING , 林俊成 , LIN, JING CHENG , 侯上勇 , HOU, SHANG YUN , 盧思維 , LU, SZU WEI
IPC: H05K3/46
CPC classification number: H01L21/561 , H01L21/56 , H01L21/563 , H01L23/4985 , H01L23/5387 , H01L23/562 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05609 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05794 , H01L2224/058 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13294 , H01L2224/133 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2224/81007 , H01L2224/81192 , H01L2224/81193 , H01L2224/81409 , H01L2224/81411 , H01L2224/81424 , H01L2224/81444 , H01L2224/81447 , H01L2224/81815 , H01L2224/83007 , H01L2224/831 , H01L2224/92125 , H01L2924/01322 , H01L2924/3511 , H01L2924/014 , H01L2924/01029 , H01L2924/01032 , H01L2924/00014 , H01L2924/00
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公开(公告)号：TWI540694B
公开(公告)日：2016-07-01
申请号：TW101122587
申请日：2012-06-25
Inventor： 林俊成 , LIN, JING CHENG , 蔡柏豪 , TSAI, PO HAO
CPC classification number: H01L24/11 , H01L21/486 , H01L21/563 , H01L23/147 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L24/13 , H01L24/14 , H01L24/16 , H01L25/0655 , H01L2224/0401 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05572 , H01L2224/05582 , H01L2224/05647 , H01L2224/1146 , H01L2224/1147 , H01L2224/1184 , H01L2224/119 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13147 , H01L2224/13155 , H01L2224/1401 , H01L2224/1403 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/351 , H01L2924/014 , H01L2924/01047 , H01L2224/05552 , H01L2924/00
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Patent Agency Ranking
公开(公告)号：TWI536537B
公开(公告)日：2016-06-01
申请号：TW103128046
申请日：2014-08-15
Inventor： 吳志偉 , WU, CHIH WEI , 施應慶 , SHIH, YING CHING , 盧思維 , LU, SZU WEI , 林俊成 , LIN, JING CHENG
CPC classification number: H01L23/562 , H01L23/145 , H01L23/147 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/10135 , H01L2224/11464 , H01L2224/13012 , H01L2224/13017 , H01L2224/13022 , H01L2224/13025 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/13562 , H01L2224/13582 , H01L2224/13644 , H01L2224/13664 , H01L2224/1403 , H01L2224/14181 , H01L2224/16146 , H01L2224/16235 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81007 , H01L2224/81139 , H01L2224/81203 , H01L2224/81815 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06555 , H01L2225/06572 , H01L2225/06582 , H01L2924/10253 , H01L2924/10271 , H01L2924/1305 , H01L2924/13091 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1437 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/3511 , H01L2924/3512 , H01L2924/37001 , H01L2924/014 , H01L2924/00012
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公开(公告)号：TW201608653A
公开(公告)日：2016-03-01
申请号：TW104114915
申请日：2015-05-11
Inventor： 黃文濬 , HUANG, WENCHUN , 李建成 , LI, CHIENCHEN , 劉國洲 , LIU, KUOCHIO , 薛瑞雲 , SHIUE, RUEYYUN , 鄭錫圭 , CHENG, HSIKUEI , 林志賢 , LIN, CHIHHSIEN , 林俊成 , LIN, JINGCHENG , 陸湘台 , LU, HSIANGTAI , 謝子逸 , SHIEH, TZIYI
CPC classification number: H01L21/565 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L23/145 , H01L23/147 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/3135 , H01L23/36 , H01L23/49816 , H01L23/49827 , H01L23/5329 , H01L23/5384 , H01L23/60 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/0345 , H01L2224/03452 , H01L2224/0401 , H01L2224/0557 , H01L2224/05573 , H01L2224/05583 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/06181 , H01L2224/11002 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/81815 , H01L2224/81895 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/10252 , H01L2924/10253 , H01L2924/10254 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/10333 , H01L2924/10335 , H01L2924/10342 , H01L2924/12042 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2224/11 , H01L2224/03 , H01L2924/00012
Abstract: 本揭露的實施例包含半導體封裝體及其製造方法。一實施例為方法，包含安裝一晶粒至一基板的頂表面，以形成一元件，密封晶粒及基板的頂表面於一模塑化合物內，此模塑化合物於晶粒上具有一第一厚度，以及移除模塑化合物於晶粒上的厚度的一部分，而非全部。此方法更包含對元件進行進一步的處理，以及移除模塑化合物於晶粒上的剩餘厚度。
Abstract in simplified Chinese: 本揭露的实施例包含半导体封装体及其制造方法。一实施例为方法，包含安装一晶粒至一基板的顶表面，以形成一组件，密封晶粒及基板的顶表面于一模塑化合物内，此模塑化合物于晶粒上具有一第一厚度，以及移除模塑化合物于晶粒上的厚度的一部分，而非全部。此方法更包含对组件进行进一步的处理，以及移除模塑化合物于晶粒上的剩余厚度。
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公开(公告)号：TWI520292B
公开(公告)日：2016-02-01
申请号：TW102126601
申请日：2013-07-25
Inventor： 蔡再宗 , TSAI, TSAI TSUNG , 林俊成 , LIN, CHUN CHENG , 洪 艾蒂 , ANG, AI-TEE , 蔡易達 , TSAI, YI DA , 鄭明達 , CHENG, MING DA , 劉重希 , LIU, CHUNG SHI
IPC: H01L23/488
CPC classification number: H01L23/49838 , H01L23/49816 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/15321 , H05K3/3436 , H05K3/4015 , H05K2201/0367 , H01L2224/0401
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公开(公告)号：TWI517276B
公开(公告)日：2016-01-11
申请号：TW102128800
申请日：2013-08-12
Inventor： 林俊成 , LIN, JING CHENG , 蔡柏豪 , TSAI, PO HAO
IPC: H01L21/60
CPC classification number: H01L24/11 , H01L21/563 , H01L23/3192 , H01L23/49811 , H01L23/49827 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/81 , H01L24/94 , H01L2224/03912 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05187 , H01L2224/05611 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/06102 , H01L2224/1146 , H01L2224/1147 , H01L2224/11612 , H01L2224/11614 , H01L2224/1182 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/1403 , H01L2224/1411 , H01L2224/14155 , H01L2224/14156 , H01L2224/14177 , H01L2224/14515 , H01L2224/16113 , H01L2224/16145 , H01L2224/16148 , H01L2224/16168 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/1703 , H01L2224/17517 , H01L2224/73204 , H01L2224/81193 , H01L2224/81801 , H01L2224/81815 , H01L2224/831 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2924/1305 , H01L2924/13091 , H01L2924/15311 , H01L2924/381 , H01L2924/3841 , H01L2924/00014 , H01L2924/01047 , H01L2924/014 , H01L2924/01108 , H01L2224/11 , H01L2924/04941 , H01L2924/04953 , H01L2924/01082 , H01L2924/01046 , H01L2924/01079 , H01L2924/01029 , H01L2924/0103 , H01L2924/01083 , H01L2924/01049 , H01L2924/01051 , H01L2924/00
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公开(公告)号：TWI512812B
公开(公告)日：2015-12-11
申请号：TW101113415
申请日：2012-04-16
Inventor： 茅一超 , MAO, YI CHAO , 洪瑞斌 , HUNG, JUI PIN , 林俊成 , LIN, JING CHENG , 鄭心圃 , JENG, SHIN PUU , 余振華 , YU, CHEN HUA
IPC: H01L21/304
CPC classification number: H01L22/26 , B24B7/228 , B24B37/013 , B24B49/10 , H01L22/12 , H01L23/3114 , H01L2924/0002 , H01L2924/00
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