公开(公告)号：US20070007540A1

公开(公告)日：2007-01-11

申请号：US10558360

申请日：2004-05-26

申请人： Takuma Hashimoto ,  Masaru Sugimoto ,  Ryoji Yokotani ,  Koji Nishioka ,  Yutaka Iwahori ,  Shinya Ishizaki ,  Toshiyuki Suzuki ,  Yoshiyuki Uchinono ,  Masahide Muto ,  Satoshi Mori ,  Hideyoshi Kimura

发明人： Takuma Hashimoto ,  Masaru Sugimoto ,  Ryoji Yokotani ,  Koji Nishioka ,  Yutaka Iwahori ,  Shinya Ishizaki ,  Toshiyuki Suzuki ,  Yoshiyuki Uchinono ,  Masahide Muto ,  Satoshi Mori ,  Hideyoshi Kimura

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/01005 ,  H01L2924/01033

摘要： A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.

摘要翻译： 发光装置（200）具有底座（100）和具有金属板（30）的传热板（300）。 基座（100）具有安装基座（10），安装有至少一个发光二极管芯片（5）和形成在安装基座（10）上的电导线（12-17），以电连接到光 发光二极管芯片（5）。 底座（100）的安装座（10）的第一平面（11）被热接合到第一板（300）。 例如，板是具有金属板（30）的电路板，并且底座（100）热接合到至少一个板（300）中的一个的金属板（30）。 在一个示例中，用于传热的第二板也热粘合到安装基座（100）的第二平面，以提供多个传热路径。

公开(公告)号：US07495322B2

公开(公告)日：2009-02-24

申请号：US10558360

申请日：2004-05-26

申请人： Takuma Hashimoto ,  Masaru Sugimoto ,  Ryoji Yokotani ,  Koji Nishioka ,  Yutaka Iwahori ,  Shinya Ishizaki ,  Toshiyuki Suzuki ,  Yoshiyuki Uchinono ,  Masahide Muto ,  Satoshi Mori ,  Hideyoshi Kimura

发明人： Takuma Hashimoto ,  Masaru Sugimoto ,  Ryoji Yokotani ,  Koji Nishioka ,  Yutaka Iwahori ,  Shinya Ishizaki ,  Toshiyuki Suzuki ,  Yoshiyuki Uchinono ,  Masahide Muto ,  Satoshi Mori ,  Hideyoshi Kimura

IPC分类号： H01L21/00 ,  H01L23/495 ,  F21V29/00 ,  H05K1/11 ,  H05K5/02 ,  H05K7/18

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/01005 ,  H01L2924/01033

摘要： A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.

摘要翻译： 发光装置（200）具有底座（100）和具有金属板（30）的传热板（300）。 基座（100）具有安装基座（10），安装有至少一个发光二极管芯片（5）和形成在安装基座（10）上的电导线（12-17），以电连接到光 发光二极管芯片（5）。 底座（100）的安装座（10）的第一平面（11）被热接合到第一板（300）。 例如，板是具有金属板（30）的电路板，并且底座（100）热接合到至少一个板（300）中的一个的金属板（30）。 在一个示例中，用于传热的第二板也热粘合到安装基座（100）的第二平面，以提供多个传热路径。

公开(公告)号：US07717589B2

公开(公告)日：2010-05-18

申请号：US10596019

申请日：2004-11-25

申请人： Kouji Nishioka ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Ryoji Yokotani ,  Yutaka Iwahori ,  Takuma Hashmoto ,  Shinya Ishizaki ,  Satoshi Mori ,  Hiroyuki Sekii ,  Eiji Shiohama

发明人： Kouji Nishioka ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Ryoji Yokotani ,  Yutaka Iwahori ,  Takuma Hashmoto ,  Shinya Ishizaki ,  Satoshi Mori ,  Hiroyuki Sekii ,  Eiji Shiohama

IPC分类号： F21V9/00 ,  F21V9/16 ,  H01J1/62

CPC分类号： H01L33/507 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/3025 ,  Y10S362/80 ,  H01L2924/00 ,  H01L2924/00014

摘要： A light emitting device comprises: an LED chip mounted in a recess formed in a mounting substrate; a wavelength converting member that is disposed so as to cover the recess and the edge area around the recess and that is excited by light emitted from the LED chip to emit light of a wavelength different from an excitation wavelength; and an emission control member disposed at a light output side of the wavelength converting member so as to allow emission of light coming from an area of the wavelength converting member that corresponds to the recess and to prevent emission of light coming from an area of the wavelength converting member that corresponds to the edge area around the recess. This can prevent variations in color between light emitted from the central part of the wavelength converting member and light emitted from the part of the wavelength converting member that is located on the edge area around the recess of the mounting substrate, thereby reducing unevenness of color on the irradiation surface.

摘要翻译： 发光装置包括：安装在形成于安装基板上的凹部中的LED芯片; 波长转换部件被设置为覆盖凹部和围绕凹部的边缘区域并被从LED芯片发射的光激发以发射与激发波长不同的波长的光; 以及发射控制部件，其设置在所述波长转换部件的光输出侧，以便发射来自与所述凹部对应的所述波长转换部件的区域的光，并且防止来自所述波长的区域的光的发射 转换构件对应于凹部周围的边缘区域。 这可以防止从波长转换构件的中心部分发出的光和位于安装基板的凹部周围的边缘区域上的波长转换构件的部分发射的光的颜色变化，从而减少颜色的不均匀性 照射面。

公开(公告)号：US20070085103A1

公开(公告)日：2007-04-19

申请号：US10596019

申请日：2004-11-25

申请人： Kouji Nishioka ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Ryoji Yokotani ,  Yutaka Iwahori ,  Takuma Hashmoto ,  Shinya Ishizaki ,  Satoshi Mori ,  Hiroyuki Sekii ,  Eiji Shiohama

发明人： Kouji Nishioka ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Ryoji Yokotani ,  Yutaka Iwahori ,  Takuma Hashmoto ,  Shinya Ishizaki ,  Satoshi Mori ,  Hiroyuki Sekii ,  Eiji Shiohama

IPC分类号： H01L33/00

CPC分类号： H01L33/507 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/3025 ,  Y10S362/80 ,  H01L2924/00 ,  H01L2924/00014

摘要： A light emitting device comprises: an LED chip mounted in a recess formed in a mounting substrate; a wavelength converting member that is disposed so as to cover the recess and the edge area around the recess and that is excited by light emitted from the LED chip to emit light of a wavelength different from an excitation wavelength; and an emission control member disposed at a light output side of the wavelength converting member so as to allow emission of light coming from an area of the wavelength converting member that corresponds to the recess and to prevent emission of light coming from an area of the wavelength converting member that corresponds to the edge area around the recess. This can prevent variations in color between light emitted from the central part of the wavelength converting member and light emitted from the part of the wavelength converting member that is located on the edge area around the recess of the mounting substrate, thereby reducing unevenness of color on the irradiation surface.

摘要翻译： 发光装置包括：安装在形成于安装基板上的凹部中的LED芯片; 波长转换部件被设置为覆盖凹部和围绕凹部的边缘区域并被从LED芯片发射的光激发以发射与激发波长不同的波长的光; 以及发射控制部件，其设置在所述波长转换部件的光输出侧，以便发射来自与所述凹部对应的所述波长转换部件的区域的光，并且防止来自所述波长的区域的光的发射 转换构件对应于凹部周围的边缘区域。 这可以防止从波长转换构件的中心部分发射的光和位于安装基板的凹部周围的边缘区域上的波长转换构件的部分发射的光之间的颜色变化，从而减少颜色的不均匀性 照射面。

公开(公告)号：US07084435B2

公开(公告)日：2006-08-01

申请号：US10483995

申请日：2003-01-06

申请人： Masaru Sugimoto ,  Masao Yamaguchi ,  Takuma Hashimoto ,  Koji Nishioka ,  Ryoji Yokotani ,  Hideyoshi Kimura ,  Tadashi Murakami ,  Eiji Shiohama

发明人： Masaru Sugimoto ,  Masao Yamaguchi ,  Takuma Hashimoto ,  Koji Nishioka ,  Ryoji Yokotani ,  Hideyoshi Kimura ,  Tadashi Murakami ,  Eiji Shiohama

IPC分类号： H01L29/22 ,  H01L29/24

CPC分类号： H01L33/507 ,  F21K9/64 ,  F21V29/677 ,  F21V29/83 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/16225

摘要： A light-emitting device which uses and LED having a light-emitting element being placed on a package substrate. The light-emitting element has a light-extracting surface. A fluorescent element which is formed by dispersing a fluorescent material in a transparent substance and is placed face to face with the light-extracting surface of the light emitting element and comprises a clearance gap in between. The light-emitting element generates light of a certain wavelength that emanates through the light-extracting surface into the fluorescent element where the wavelength is changed. The device further comprises an optical element which receives light from the light-emitting element through the fluorescent element and directs the light to the outside of the device.

摘要翻译： 一种发光装置，其使用具有发光元件的LED，该发光元件放置在封装基板上。 发光元件具有光提取面。 荧光元件，其通过将荧光材料分散在透明物质中并且与发光元件的光提取表面面对面并且在其间包括间隙而形成。 发光元件产生通过光提取表面发射到波长变化的荧光元件的一定波长的光。 该装置还包括光学元件，其通过荧光元件接收来自发光元件的光并将光引导到装置的外部。

公开(公告)号：US06874910B2

公开(公告)日：2005-04-05

申请号：US10398660

申请日：2001-12-03

申请人： Masaru Sugimoto ,  Eiji Shiohama ,  Hideyoshi Kimura ,  Takuma Hashimoto ,  Toshiyuki Suzuki ,  Kazuya Nakagawa ,  Mitsuru Kobayashi ,  Jiro Hashizume

发明人： Masaru Sugimoto ,  Eiji Shiohama ,  Hideyoshi Kimura ,  Takuma Hashimoto ,  Toshiyuki Suzuki ,  Kazuya Nakagawa ,  Mitsuru Kobayashi ,  Jiro Hashizume

IPC分类号： H01L25/075 ,  H01L33/64 ,  F21V29/00 ,  H01L33/00

CPC分类号： H01L33/642 ,  H01L24/45 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20752

摘要： A light source apparatus having a radiator plate having thermally conductive properties and an insulating member coupled to at least one side of the radiator plate having a through hole provided in a side thereof facing the radiator plate. The light source apparatus further including a LED chip installed and thermally coupled to an exposed portion of the radiator plate facing the through hole, an extension inwardly projecting at the through hole from the radiator plate end of the insulating member, and a wiring pattern provided on the insulating member electrically isolated by the insulating member from the radiator plate. The light source apparatus also including bonding wires electrically connecting portions of the wiring pattern on the extension and the electrodes of the LED chip, and a light-transmissive sealing material filling the through hole for entirely encapsulating the LED chip and the bonding wires.

摘要翻译： 一种具有导热性的散热板的光源装置和与散热板的至少一侧连接的绝缘构件，其具有设置在其面向散热板的一侧的通孔。 所述光源装置还包括LED芯片，所述LED芯片安装并热耦合到所述辐射板的面向所述通孔的暴露部分，从所述绝缘构件的散热板端部在所述通孔向内突出的延伸部，以及布置在 所述绝缘构件通过所述绝缘构件与所述散热板电隔离。 光源装置还包括电连接延伸部上的布线图案和LED芯片的电极的接合线，以及填充用于完全封装LED芯片和接合线的通孔的透光密封材料。

公开(公告)号：US06796027B2

公开(公告)日：2004-09-28

申请号：US10146800

申请日：2002-05-17

申请人： Toshiyuki Suzuki ,  Kazuya Nakagawa ,  Mitsuru Kobayashi ,  Eiji Shiohama ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Takuma Hashimoto

发明人： Toshiyuki Suzuki ,  Kazuya Nakagawa ,  Mitsuru Kobayashi ,  Eiji Shiohama ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Takuma Hashimoto

IPC分类号： H05K310

CPC分类号： H05K3/242 ,  H05K1/0284 ,  H05K1/0293 ,  H05K3/045 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09127 ,  H05K2203/175 ,  H05K2203/308 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

摘要： A method of efficiently manufacturing a printed wiring board is provided. In this method, a metal thin film is formed on a substrate having a projection. Then, an initial circuit pattern is formed on the substrate by patterning the metal thin film. The initial circuit pattern comprises first and second circuit patterns isolated from each other and a conductive layer formed on the projection to make a temporary electrical connection between the first and second circuit patterns. Electroplating is performed by the passage of electric current through the initial circuit pattern to form an additional metal film on the initial circuit pattern. After the electroplating, the conductive layer on the projection is removed to provide electrical insulation between the first and second circuit patterns.

摘要翻译： 提供一种有效地制造印刷电路板的方法。 在该方法中，在具有突起的基板上形成金属薄膜。 然后，通过图案化金属薄膜，在基板上形成初始电路图案。 初始电路图案包括彼此隔离的第一和第二电路图案，以及形成在突起上的导电层，以在第一和第二电路图案之间进行临时电连接。 通过电流通过初始电路图案进行电镀，以在初始电路图案上形成附加的金属膜。 在电镀之后，去除突起上的导电层以在第一和第二电路图案之间提供电绝缘。

公开(公告)号：US06930332B2

公开(公告)日：2005-08-16

申请号：US10466114

申请日：2002-08-28

申请人： Takuma Hashimoto ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Eiji Shiohama

发明人： Takuma Hashimoto ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Eiji Shiohama

IPC分类号： H01L33/64 ,  H01L25/075 ,  H01L33/32 ,  H01L33/54 ,  H01L33/60 ,  H01L33/00

CPC分类号： H01L33/642 ,  H01L25/0753 ,  H01L25/167 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light emitting device that can provide enhanced heat radiation as well as allowing light from a light emitting diode (LED) chip to be efficiently extracted out of the device. This light emitting device includes a metal plate (11) that is made of aluminum. The metal plate (11) has a projection (11a) projecting forward. The projection (11a) has a front side provided with a housing recess (11b). An LED chip (1) is mounted on the bottom of the housing recess (11b) so that it is thermally coupled to the metal plate (11), thus allowing heat to be radiated efficiently. A printed circuit board (12), having a grass epoxy substrate to be joined to the front surface of the metal plate (11), is provided with an insertion hole (13) into which the projection (11a) is inserted. The LED chip (1) and a bonding wire (W) are encapsulated in a transparent resin seal portion (50). The side wall of the housing recess (11b) that is part of the metal plate (11) functions as a reflector for reflecting forward light emitted from the LED chip (1). Thus, light from the LED chip (1) can be extracted efficiently.

摘要翻译： 可以提供增强的热辐射以及允许来自发光二极管（LED）芯片的光被有效地从设备中提取的发光器件。 该发光器件包括由铝制成的金属板（11）。 金属板（11）具有向前突出的突起（11a）。 突起（11a）具有设置有壳体凹部（11b）的前侧。 LED芯片（1）安装在壳体凹部（11b）的底部，使得其与金属板（11）热耦合，从而有效地辐射热量。 具有要连接到金属板（11）的前表面的草环氧树脂基板的印刷电路板（12）设置有插入孔（11），插入孔（11a）。 LED芯片（1）和接合线（W）被封装在透明树脂密封部分（50）中。 作为金属板（11）的一部分的壳体凹部（11b）的侧壁用作反射从LED芯片（1）发射的向前的光的反射器。 因此，可以有效地提取来自LED芯片（1）的光。

公开(公告)号：US06331063B1

公开(公告)日：2001-12-18

申请号：US09199893

申请日：1998-11-25

申请人： Kazuo Kamada ,  Shoichi Koyama ,  Nobuyuki Asahi ,  Toshiyuki Suzuki ,  Eiji Shiohama ,  Masaru Sugimoto ,  Shohei Yamamoto ,  Jiro Hashizume ,  Taishi Akiniwa ,  Takashi Tanaka

发明人： Kazuo Kamada ,  Shoichi Koyama ,  Nobuyuki Asahi ,  Toshiyuki Suzuki ,  Eiji Shiohama ,  Masaru Sugimoto ,  Shohei Yamamoto ,  Jiro Hashizume ,  Taishi Akiniwa ,  Takashi Tanaka

IPC分类号： F21V704

CPC分类号： F21V5/02 ,  F21Y2105/00 ,  F21Y2107/00 ,  F21Y2107/10 ,  F21Y2107/50 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L25/167 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K1/182 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED luminaire is formed such that a plurality of LED chips are disposed three-dimensionally on an MID (molded interconnection device) substrate in a rectangular plate shape, by mounting three LED chips on bottom face of respective dents provided lengthwise and crosswise in one surface of the MID substrate, the LED chips including at least two types mutually diffferent in luminous color, desirably three types of red, blue and green colors. Any optional light distribution characteristic is made thereby easily obtainable depending on a configuration of the substrate, luminaire module can be thinned, and such delicate color difference as white color and day-light color of luminescent lamps is enabled by mixing the luminous colors of the respective LED chips.

摘要翻译： 形成LED灯具，使得多个LED芯片以三维方式设置在矩形板状的MID（模制互连装置）基板上，通过在一个表面纵向和横向设置各个凹槽的底面上安装三个LED芯片 的MID基板，包括至少两种相互不同的发光颜色的LED芯片，期望为红色，蓝色和绿色三种类型。 由此可以根据基板的结构容易地获得任何可选的光分布特性，可以使灯具组件变薄，通过混合各个发光体的发光颜色，能够实现发光灯的白色和日光颜色的微妙色差 LED芯片

公开(公告)号：US08137471B2

公开(公告)日：2012-03-20

申请号：US12696323

申请日：2010-01-29

申请人： Akira Koshiishi ,  Masaru Sugimoto ,  Kunihiko Hinata ,  Noriyuki Kobayashi ,  Chishio Koshimizu ,  Ryuji Ohtani ,  Kazuo Kibi ,  Masashi Saito ,  Naoki Matsumoto ,  Manabu Iwata ,  Daisuke Yano ,  Yohei Yamazawa

发明人： Akira Koshiishi ,  Masaru Sugimoto ,  Kunihiko Hinata ,  Noriyuki Kobayashi ,  Chishio Koshimizu ,  Ryuji Ohtani ,  Kazuo Kibi ,  Masashi Saito ,  Naoki Matsumoto ,  Manabu Iwata ,  Daisuke Yano ,  Yohei Yamazawa

IPC分类号： C23C16/00

CPC分类号： H01J37/32091 ,  H01J37/32082 ,  H01J37/32174 ,  H01J37/32348 ,  H01J37/3244 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32642 ,  H01J37/32706 ,  H01J37/32834 ,  H01J2237/3344 ,  H01L21/02126 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/31144 ,  H01L21/67069

摘要： An apparatus includes an upper electrode and a lower electrode for supporting a wafer disposed opposite each other within a process chamber. A first RF power supply configured to apply a first RF power having a relatively higher frequency is connected to the upper electrode. A second RF power supply configured to apply a second RF power having a relatively lower frequency is connected to the lower electrode. A variable DC power supply is connected to the upper electrode. A process gas is supplied into the process chamber while any one of application voltage, application current, and application power from the variable DC power supply to the upper electrode is controlled, to generate plasma of the process gas so as to perform plasma etching.

摘要翻译： 一种装置包括用于支撑在处理室内相对设置的晶片的上电极和下电极。 被配置为施加具有相对较高频率的第一RF功率的第一RF电源连接到上电极。 配置为施加具有相对较低频率的第二RF功率的第二RF电源连接到下电极。 可变直流电源连接到上电极。 将处理气体供给到处理室中，同时控制来自可变直流电源到上部电极的施加电压，施加电流和施加电力中的任何一个，以产生处理气体的等离子体，以进行等离子体蚀刻。