公开(公告)号：US20150351256A1

公开(公告)日：2015-12-03

申请号：US14745526

申请日：2015-06-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： ANDREAS C. DOERING ,  RALPH HELLER ,  RONALD P. LUIJTEN ,  MARTIN L. SCHMATZ

IPC: H05K3/36 ,  H01R43/26

CPC classification number: H05K1/117 ,  H01R12/52 ,  H01R12/73 ,  H01R13/2414 ,  H01R43/26 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10954 ,  Y10T29/49128

Abstract: A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.

公开(公告)号：US09215809B2

公开(公告)日：2015-12-15

申请号：US14094714

申请日：2013-12-02

Applicant: SMARTRAC TECHNOLOGY GmbH

Inventor： Carsten Nieland ,  Frank Kriebel

IPC: H01L23/48 ,  H05K1/18 ,  H01L21/768 ,  H01L23/498 ,  H05K3/30 ,  H01L23/00

CPC classification number: H05K1/18 ,  G06K19/077 ,  H01L21/76885 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1161 ,  H01L2224/11622 ,  H01L2224/1182 ,  H01L2224/13006 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13599 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81206 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/814 ,  H01L2224/8149 ,  H01L2224/81898 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/00014 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/1059 ,  H05K2201/10674 ,  H05K2201/10954 ,  H05K2203/0278 ,  H05K2203/041 ,  Y10T29/49018 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05552 ,  H01L2924/014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2224/03

Abstract: Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.

Abstract translation: 接触焊盘和基板之间的接触凸块可以包括可与基板的材料配合的凹部和凸起。 接触凸块和接触垫之间的不规则配合表面可以增强接触件的接合强度，例如抗剪切力和张力，特别是对于柔性系统如智能卡。

公开(公告)号：US20150062834A1

公开(公告)日：2015-03-05

申请号：US14469675

申请日：2014-08-27

Applicant: YAZAKI CORPORATION

Inventor： Takanori KITAJO ,  Masaki SUGIYAMA ,  Masayuki NAOHARA

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/111 ,  H01R12/526 ,  H01R29/00 ,  H05K1/029 ,  H05K1/14 ,  H05K1/182 ,  H05K3/222 ,  H05K2201/042 ,  H05K2201/09209 ,  H05K2201/10363 ,  H05K2201/10954

Abstract: A jumper module mounting circuit board includes: a circuit board; and a jumper module having an insulator main body provided with conductive electrical connection parts for connecting between connection patterns so as to provide electrical continuity therebetween by connecting each of contact parts on both ends of the conductive electrical connection parts to the connection patterns which are formed to be spaced apart from each other on the circuit board. The jumper module is mounted onto the circuit board so as to connect between the contact parts and the connection patterns that are formed to be spaced apart from each other. The circuit board includes a connection pattern concentrated section that is formed by concentrating the connection patterns depending on a plurality of wiring specifications at a mount position of the jumper module.

Abstract translation: 跳线模块安装电路板包括：电路板; 以及跳线模块，其具有绝缘体主体，该绝缘体主体设置有用于连接连接图案之间的导电电连接部件，以便通过将导电电连接部件的两端上的每个接触部分连接到形成为 在电路板上彼此间隔开。 跳线模块安装在电路板上，以便在接触部分和形成为彼此间隔开的连接图案之间连接。 电路板包括通过在跳线模块的安装位置根据多个布线规格聚集连接图案形成的连接图案集中部分。

公开(公告)号：US11975547B2

公开(公告)日：2024-05-07

申请号：US17608078

申请日：2019-07-01

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Vignesh Kannan ,  Dennis R. Esterberg ,  Christie Dudenhoefer ,  Kenneth Ward ,  Matthew David Smith ,  Daniel Fradl

IPC: B41J29/13

CPC classification number: B41J29/13 ,  B01L2200/025 ,  B01L2200/0642 ,  B01L2300/0609 ,  H05K2201/10424 ,  H05K2201/10954

Abstract: In one example in accordance with the present disclosure, a fluid ejection controller is described. The fluid ejection controller includes a firing board to pass control signals to a fluid ejection device to eject fluid from the fluid ejection device. A mount pivotally holds the firing board between a disengaged position where electrical pins of the firing board are not in contact with electrical pads of the fluid ejection device and an engaged position where the electrical pins are in contact with the electrical pads. The mount includes a slot to receive the fluid ejection device and at least one biasing spring to bias the firing board away from the fluid ejection device during insertion of the fluid ejection device. The fluid ejection controller also includes a handle coupled to a cam shaft to move the firing board between the disengaged position and the engaged position.

公开(公告)号：US20180063970A1

公开(公告)日：2018-03-01

申请号：US15676332

申请日：2017-08-14

Applicant: Samsung Display Co., Ltd.

Inventor： Seung-Hwa HA ,  Jeong Do YANG ,  Jung Yun JO ,  Jeong Ho HWANG

IPC: H05K5/00 ,  G01R31/28 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K5/0017 ,  G01R31/2818 ,  G02F1/1309 ,  G02F1/13452 ,  G02F1/13458 ,  H05K1/0268 ,  H05K1/11 ,  H05K1/111 ,  H05K1/118 ,  H05K1/181 ,  H05K3/361 ,  H05K2201/09481 ,  H05K2201/09709 ,  H05K2201/10128 ,  H05K2201/10954

Abstract: A display device includes a display substrate and a printed circuit board (PCB). The display substrate includes a display area to display an image, and includes a pad area outside the display area. The PCB is bonded to a surface of the display substrate in the pad area. The PCB includes a base film, first terminal wires positioned at the base film, second terminal wires positioned at the base film, first sub-pad terminals electrically connected to the first terminal wires through contact holes formed in the base film, and second sub-pad terminals directly and electrically connected to the second terminal wires without contact holes. The first sub-pad terminals and the second sub-pad terminals are alternately arranged. The first terminal wires and the second terminal wires are, in a view normal to the surface, spaced apart from one another.

公开(公告)号：US20140084460A1

公开(公告)日：2014-03-27

申请号：US14094714

申请日：2013-12-02

Applicant: SMARTRAC TECHNOLOGY GmbH

Inventor： Carsten Nieland ,  Frank Kriebel

IPC: H01L21/768 ,  H01L23/498

CPC classification number: H05K1/18 ,  G06K19/077 ,  H01L21/76885 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1161 ,  H01L2224/11622 ,  H01L2224/1182 ,  H01L2224/13006 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13599 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81206 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/814 ,  H01L2224/8149 ,  H01L2224/81898 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/00014 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/1059 ,  H05K2201/10674 ,  H05K2201/10954 ,  H05K2203/0278 ,  H05K2203/041 ,  Y10T29/49018 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05552 ,  H01L2924/014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2224/03

Abstract: Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.

Abstract translation: 接触焊盘和基板之间的接触凸块可以包括可与基板的材料配合的凹部和凸起。 接触凸块和接触垫之间的不规则配合表面可以增强接触件的接合强度，例如抗剪切力和张力，特别是对于柔性系统如智能卡。

公开(公告)号：US20230240011A1

公开(公告)日：2023-07-27

申请号：US17581824

申请日：2022-01-21

Applicant: Analog Devices, Inc.

Inventor： Hien Minh Pham

IPC: H05K1/18 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K3/303 ,  H05K1/115 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10954

Abstract: In one embodiment, an electronic assembly can include: a first electronic device package configured to be mounted on and electrically connected with a system substrate; a second electronic device package electrically connected to the system substrate; and an electrical pathway configured to extend from the system substrate through the first electronic device package and connected to an input terminal of the second electronic device package, the electrical pathway bypassing processing circuitry of the first electronic device package.

公开(公告)号：US09728868B1

公开(公告)日：2017-08-08

申请号：US14176494

申请日：2014-02-10

Applicant: CREE FAYETTEVILLE, INC.

Inventor： Alexander Lostetter

IPC: H05K7/00 ,  H01R12/52 ,  H05K1/02 ,  H05K1/18 ,  H05K13/00

CPC classification number: H05K1/181 ,  H01L23/057 ,  H01L23/24 ,  H01L23/4275 ,  H01L2224/16245 ,  H01L2924/13091 ,  H05K1/0271 ,  H05K2201/068 ,  H05K2201/10954

Abstract: The present invention is directed to a liquid and solid phase power connect for packaging of an electrical device using a using a phase changing metal. The phase changing metal transitions back and forth between a liquid phase and a solid phase while constantly maintaining connection to the electrical device. The packaging uses a substrate, a restraining housing, and a lid to encase an electrical contact on the electrical device and restrain the phase changing metal. In one embodiment, the entire electrical device is encased and a voltage isolator is utilized to limit the contact areas between the phase changing metal and the electrical device. A method for relieving contact stress by transitioning the phase changing metal from a solid to a liquid is also taught.

公开(公告)号：US09414491B2

公开(公告)日：2016-08-09

申请号：US14469675

申请日：2014-08-27

Applicant: YAZAKI CORPORATION

Inventor： Takanori Kitajo ,  Masaki Sugiyama ,  Masayuki Naohara

IPC: H05K7/00 ,  H05K1/11 ,  H01R12/52 ,  H01R29/00 ,  H05K3/22 ,  H05K1/14 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/111 ,  H01R12/526 ,  H01R29/00 ,  H05K1/029 ,  H05K1/14 ,  H05K1/182 ,  H05K3/222 ,  H05K2201/042 ,  H05K2201/09209 ,  H05K2201/10363 ,  H05K2201/10954

Abstract: A jumper module mounting circuit board includes: a circuit board; and a jumper module having an insulator main body provided with conductive electrical connection parts for connecting between connection patterns so as to provide electrical continuity therebetween by connecting each of contact parts on both ends of the conductive electrical connection parts to the connection patterns which are formed to be spaced apart from each other on the circuit board. The jumper module is mounted onto the circuit board so as to connect between the contact parts and the connection patterns that are formed to be spaced apart from each other. The circuit board includes a connection pattern concentrated section that is formed by concentrating the connection patterns depending on a plurality of wiring specifications at a mount position of the jumper module.

Abstract translation: 跳线模块安装电路板包括：电路板; 以及跳线模块，其具有绝缘体主体，该绝缘体主体设置有用于连接连接图案之间的导电电连接部件，以便通过将导电电连接部件的两端上的每个接触部分连接到形成为 在电路板上彼此间隔开。 跳线模块安装在电路板上，以便在接触部分和形成为彼此间隔开的连接图案之间连接。 电路板包括通过在跳线模块的安装位置根据多个布线规格聚集连接图案形成的连接图案集中部分。

公开(公告)号：US09237650B2

公开(公告)日：2016-01-12

申请号：US14365535

申请日：2012-12-13

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT

Inventor： Roland Gers

IPC: H05K1/11 ,  H01L21/768 ,  H01L23/48 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  H01L23/498

CPC classification number: H05K1/115 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/06181 ,  H01L2224/11462 ,  H01L2224/13009 ,  H01L2224/13021 ,  H01L2224/13025 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/16146 ,  H01L2224/16147 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2924/00014 ,  H01L2924/1461 ,  H05K2201/10954 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A method and an electronic component including: a substrate including at least a hole at least partially going through a thickness of the substrate; an electrically conducting element positioned in the hole and configured to form an electric connection through the hole, wherein the electrically conducting element includes an electrically conducting and self-supporting pillar with a height oriented according to the thickness of the substrate; and a space between at least a part of the wall of the hole and a part of a peripheral wall of the pillar.

Abstract translation: 一种方法和电子部件，包括：至少包括至少部分穿过所述基板的厚度的孔的基板; 定位在所述孔中并被构造成通过所述孔形成电连接的导电元件，其中所述导电元件包括​​导电和自支撑柱，所述导电和自支撑柱的高度根据所述基板的厚度取向; 以及孔的壁的至少一部分与柱的周壁的一部分之间的空间。