公开(公告)号：US09486739B2

公开(公告)日：2016-11-08

申请号：US14278860

申请日：2014-05-15

申请人： IBIDEN CO., LTD.

发明人： Reo Uchimura ,  Hisashi Ando ,  Yasutaka Ito

IPC分类号： F01N3/28 ,  B01D53/88 ,  B32B5/26 ,  B32B27/12 ,  B32B7/12 ,  B32B15/14 ,  B32B27/32 ,  B32B27/36 ,  B32B1/08

CPC分类号： B01D53/885 ,  B32B1/08 ,  B32B5/26 ,  B32B7/12 ,  B32B15/14 ,  B32B27/12 ,  B32B27/32 ,  B32B27/36 ,  B32B2307/54 ,  F01N3/2853 ,  F01N3/2864 ,  F01N3/2871 ,  F01N2450/28 ,  Y10T29/494 ,  Y10T29/49826

摘要： A holding seal material made of a laminated mat configured by laminating a plurality of mats containing an inorganic fiber and having a rectangular planar shape so that longitudinal-direction lengths of the respective mats sequentially increase as the mats are laminated, in which the film is attached to a principal surface of the mat configuring the laminated mat and having a longest longitudinal-direction length on an opposite side to a side on which the mat having the longest longitudinal-direction length is in contact with other mats and longitudinal-direction side surfaces of the mat having the longest longitudinal-direction length, and the film is attached to a principal surface of the mat having the longest longitudinal-direction length on the side on which the mat having the longest longitudinal-direction length is in contact with other mats in a state in which a part of the principal surface is exposed.

摘要翻译： 一种由层压垫制成的保持密封材料，所述保持密封材料通过层叠多个包含无机纤维并且具有矩形平面形状的垫而构成，使得各个垫的长度方向长度随着所述垫被层压而依次增加，其中所述膜被附接 涉及构成层压垫的垫的主表面，并且在其长度方向长度最长的垫与其它垫和纵向侧表面接触的一侧的相反侧具有最长的纵向长度 具有最长纵向长度的垫，并且该膜附着到具有最长纵向长度的垫与其它垫子接触的一侧上具有最长纵向长度的垫的主表面 主表面的一部分露出的状态。

公开(公告)号：US09480170B2

公开(公告)日：2016-10-25

申请号：US13274897

申请日：2011-10-17

申请人： Katsuhiko Tanno ,  Youichirou Kawamura

发明人： Katsuhiko Tanno ,  Youichirou Kawamura

IPC分类号： H05K1/03 ,  H05K3/34 ,  H01L21/48 ,  H01L23/00

CPC分类号： H05K3/3457 ,  H01L21/4853 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/094 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/043 ,  Y10T29/49121 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49167 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 μm.

摘要翻译： 制造具有焊料凸块的印刷线路板的方法包括形成具有小的和大的孔的阻焊层，暴露印刷线路板的各自的导电焊盘，使用具有 与阻焊层的孔相对应的孔径区域，从小孔中的焊球形成具有第一高度的第一凸起，以及从大孔中的焊球形成具有第二高度的第二凸起， 第一高度大于第二高度，并且按压第一凸起的顶部，使得第一高度变得与第二高度基本相同。 多层印刷布线板包括具有不同尺寸的孔的阻焊层和具有基本相等体积但高度差不大于10μm的焊料凸块。

公开(公告)号：US09480156B2

公开(公告)日：2016-10-25

申请号：US13406915

申请日：2012-02-28

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： H05K3/20 ,  H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H05K3/10 ,  H05K3/34 ,  H05K3/46

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/3484 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的镀金属膜，蚀刻以减少从抗蚀剂暴露的镀金属膜的厚度，去除抗蚀剂，以及通过除去暴露的金属膜，形成具有焊盘和比焊盘更薄的导电电路的布线 通过去除电镀抗蚀剂，在基板和布线的表面上形成阻焊层，在该层中，露出焊盘的开口和与焊盘相邻的电路的一部分，焊盘上的焊料膜和 通过开口暴露的电路，以及通过焊料回流焊盘上的焊料凸块。

公开(公告)号：US20160295692A1

公开(公告)日：2016-10-06

申请号：US15084165

申请日：2016-03-29

申请人： IBIDEN CO., LTD.

发明人： Koji ASANO ,  Takema Adachi

IPC分类号： H05K1/02 ,  H05K3/40 ,  H05K3/46 ,  H05K3/02 ,  H05K1/03 ,  H05K1/11

CPC分类号： H05K3/4688 ,  H05K1/113 ,  H05K3/4652 ,  H05K2201/09045 ,  H05K2201/09127 ,  H05K2203/308

摘要： A printed wiring board includes a core substrate, and a first build-up wiring layer formed on the core substrate and including a wiring layer such that the wiring layer includes a resin insulating layer and a conductor layer laminated on the resin insulating layer. The first build-up wiring layer is formed on a first surface of the core substrate such that the first build-up wiring layer forms a high-rise region and a low-rise region with respect to a lamination direction, the first build-up wiring layer includes electrodes positioned to connect an electronic component to the first build-up wiring layer, and the first build-up wiring layer is formed such that the low-rise region is extending in two or more directions from the high-rise region to edges of the core substrate.

摘要翻译： 印刷电路板包括芯基板和形成在芯基板上并且包括布线层的第一堆叠布线层，使得布线层包括层压在树脂绝缘层上的树脂绝缘层和导体层。 第一积层布线层形成在芯基板的第一表面上，使得第一堆积布线层相对于层叠方向形成高层区域和低层区域，第一堆积层 布线层包括定位成将电子部件连接到第一叠层布线层的电极，并且形成第一堆积布线层，使得低层区域从高层区域向两个或更多个方向延伸， 芯基板的边缘。

公开(公告)号：US20160268188A1

公开(公告)日：2016-09-15

申请号：US15055921

申请日：2016-02-29

申请人： IBIDEN CO., LTD.

发明人： Takashi KARIYA ,  Shigeru YAMADA ,  Masatoshi KUNIEDA

IPC分类号： H01L23/498 ,  H01L23/31

CPC分类号： H01L23/3121 ,  H01L23/49811 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2924/00012

摘要： A printed wiring board for package-on-package includes a first insulating layer, a wiring layer including a conductor pattern and formed on first surface of the first insulating layer, a second insulating layer formed on first surface side of the first insulating layer, electrodes formed in through holes of the first insulating layer respectively such that the electrodes electrically connect to the conductor pattern and have exposed surfaces exposed from second surface of the first insulating layer, first pads formed on the second insulating layer and positioned to connect an IC chip in center portion of the second insulating layer, second pads formed on the second insulating layer and positioned in outer edge portion of the second insulating layer to connect a second printed wiring board, and via conductors formed in the second insulating layer such that the via conductors electrically connect the first and second pads to the conductor pattern.

摘要翻译： 一种用于封装封装的印刷线路板包括：第一绝缘层，包括导体图案的布线层，并形成在第一绝缘层的第一表面上;第二绝缘层，形成在第一绝缘层的第一表面侧;电极 分别形成在第一绝缘层的通孔中，使得电极电连接到导体图案，并且具有从第一绝缘层的第二表面露出的暴露表面，形成在第二绝缘层上的第一焊盘并且定位成将IC芯片 所述第二绝缘层的中心部分，形成在所述第二绝缘层上并位于所述第二绝缘层的外边缘部分中以连接第二印刷线路板的第二焊盘，以及形成在所述第二绝缘层中的通孔导体， 将第一和第二焊盘连接到导体图案。

公开(公告)号：US20160255717A1

公开(公告)日：2016-09-01

申请号：US15052009

申请日：2016-02-24

申请人： IBIDEN CO., LTD.

发明人： Toshiki FURUTANI ,  Yasushi INAGAKI ,  Shunsuke SAKAI

IPC分类号： H05K1/02 ,  H05K1/18

CPC分类号： H05K1/0271 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49838 ,  H05K1/113 ,  H05K3/007 ,  H05K3/4658 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/10734

摘要： A multilayer wiring board includes wiring bodies each including an insulating layer, a conductor layer embedded in the insulating layer and having exposed surface on first surface of the insulating layer, and a conductor post formed on embedded surface of the conductor layer on the opposite side and having end surface on second surface of the insulating layer. The bodies include first and second bodies forming outermost layers on the opposite sides, the exposed surface is recessed from the first surface of the insulating layer in the first body, the end surface is recessed from the second surface in the second body in recess amount greater than that of the exposed surface in the first body, the post of the first body has the exposed surface bonded to the conductor layer of an adjacent body, the second body has the conductor layer bonded to the post of an adjacent body.

摘要翻译： 多层布线基板包括布线体，每个布线体包括绝缘层，埋在绝缘层中的导体层，并且在绝缘层的第一表面上具有暴露表面;导体柱，形成在导体层的相对侧的嵌入表面上， 在绝缘层的第二表面上具有端面。 这些主体包括在相对侧上形成最外层的第一和第二主体，暴露的表面从第一主体中的绝缘层的第一表面凹陷，端面从第二主体中的第二表面凹入更大的凹陷量 比第一主体中的暴露表面的第一主体的柱具有暴露的表面结合到相邻体的导体层，第二主体具有结合到相邻体的柱的导体层。

公开(公告)号：US09433097B2

公开(公告)日：2016-08-30

申请号：US14791735

申请日：2015-07-06

申请人： IBIDEN CO., LTD.

发明人： Mitsuhiro Tomikawa ,  Koji Asano

IPC分类号： H05K1/18 ,  H05K3/40 ,  H05K1/11 ,  H05K3/00

CPC分类号： H05K1/183 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/4046 ,  H05K3/4084 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/10416 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A circuit substrate includes a core substrate having cavity, metal blocks in the cavity, first and second build-up layers including insulating layers and laminated on first and second sides of the core substrate such that the insulating layers are covering the cavity, and a filling resin filling gap formed between the cavity and metal blocks in the cavity. The cavity is penetrating through the core substrate, the core substrate has an intracavity projection structure projecting from one or more side surfaces of the cavity such that the projection structure is positioned between the metal blocks and separating the metal blocks from contacting each other in the cavity, the first build-up layer has first conductors connected to the metal blocks such that each first conductor conducts electricity or heat, and the second build-up layer has second conductors connected to the metal blocks such that each second conductor conducts electricity or heat.

摘要翻译： 电路基板包括具有空腔的芯基板，空腔中的金属块，第一和第二堆积层包括绝缘层，并且层叠在芯基板的第一和第二侧上，使得绝缘层覆盖空腔，并且填充 空腔中的空腔和金属块之间形成树脂填充间隙。 空腔穿透芯基板，芯基板具有从空腔的一个或多个侧表面突出的腔内投影结构，使得突出结构位于金属块之间并且分离金属块以在空腔中彼此接触 第一累积层具有连接到金属块的第一导体，使得每个第一导体传导电或热，并且第二堆积层具有连接到金属块的第二导体，使得每个第二导体导电或加热。

公开(公告)号：US09410463B2

公开(公告)日：2016-08-09

申请号：US14128556

申请日：2011-08-18

申请人： Yoshitoyo Nishio ,  Takunari Murakami

发明人： Yoshitoyo Nishio ,  Takunari Murakami

IPC分类号： B01D50/00 ,  F01N3/28 ,  B01J29/85 ,  B01J35/04 ,  C01B37/08 ,  C01B39/54 ,  B01J35/10 ,  B01D53/94

CPC分类号： F01N3/2828 ,  B01D53/9418 ,  B01D2279/30 ,  B01J29/85 ,  B01J35/04 ,  B01J35/1019 ,  B01J2229/186 ,  B01J2229/42 ,  C01B37/08 ,  C01B39/54

摘要： An object of the invention is to provide composite particles that have excellent NOx purification performance and can suppress water adsorption-caused contraction and water desorption-caused expansion and to provide a honeycomb structure that has excellent NOx purification performance and can suppress the breakage of the honeycomb unit due to the adsorption or desorption of water, a method for manufacturing the honeycomb structure, and an exhaust gas purifying apparatus including the honeycomb structure. The composite particles of the invention are composite particles having a metallic oxide attached to silicoaluminophosphate particles with a ratio of an amount of Si to a sum of amounts of Al and P in a range of 0.16 to 0.33, in which a specific surface area is in a range of 250 m2/g to 450 m2/g, and an external surface area is in a range of 30 m2/g to 90 m2/g.

摘要翻译： 本发明的目的是提供具有优异的NOx净化性能并且可以抑制吸水引起的收缩和脱水引起的膨胀的复合颗粒，并且提供具有优异的NOx净化性能并能够抑制蜂窝体的破裂的蜂窝结构体 由于水的吸附或脱附而产生的单元，蜂窝结构体的制造方法以及包括蜂窝结构体的废气净化装置。 本发明的复合颗粒是具有附着到硅铝磷酸盐颗粒的金属氧化物的复合颗粒，其中Si的量与Al和P的量之和在0.16至0.33的范围内，比表面积为 250m 2 / g〜450m 2 / g的范围，外表面积为30m 2 / g〜90m 2 / g的范围。

公开(公告)号：US20160212854A1

公开(公告)日：2016-07-21

申请号：US14996298

申请日：2016-01-15

申请人： IBIDEN CO., LTD.

发明人： Nobuhisa KURODA ,  Hirofumi FUTAMURA

IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K3/30 ,  H05K3/00 ,  H05K3/46 ,  H05K1/03 ,  H05K1/11

CPC分类号： H05K1/0271 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5389 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2924/3511 ,  H05K2201/09227 ,  H05K2201/10674

摘要： A printed wiring board for mounting a semiconductor element includes an insulating substrate, a first conductor structure on first side of the substrate, and a second conductor structure on second side of the substrate. The substrate has a first area and a second area outside the first area such that when a semiconductor element is mounted on the first side, the first area is directly below the element, the first structure has a first area conductor structure in the first area and a second area conductor structure in the second area, and the first structure is formed such that first ratio is set greater than second ratio, where the first ratio is obtained by dividing volume of the first area structure by area of the first area structure, and the second ratio is obtained by dividing volume of the second area structure by area of the second area structure.

摘要翻译： 用于安装半导体元件的印刷线路板包括绝缘基板，在基板的第一侧上的第一导体结构和在基板的第二面上的第二导体结构。 基板在第一区域之外具有第一区域和第二区域，使得当半导体元件安装在第一侧上时，第一区域正好在元件下方，第一结构在第一区域中具有第一区域导体结构， 第二区域导体结构，并且第一结构形成为使得第一比例被设定为大于第二比例，其中通过将第一区域结构的体积除以第一区域结构的面积获得第一比例，以及 通过将第二区域结构的体积除以第二区域结构的面积来获得第二比例。

公开(公告)号：US09394814B2

公开(公告)日：2016-07-19

申请号：US14448921

申请日：2014-07-31

申请人： IBIDEN CO., LTD.

发明人： Toshiaki Shibata ,  Yuki Miwa

IPC分类号： B01D50/00 ,  F01N3/022 ,  B01D53/94 ,  B01D46/24

CPC分类号： F01N3/0222 ,  B01D46/247 ,  B01D53/94

摘要： A honeycomb filter includes a plurality of cells and porous cell walls. The plurality of cells include exhaust gas introduction cells and exhaust gas emission cells. The porous cell walls supports an SCR catalyst. The exhaust gas introduction cells include first exhaust gas introduction cells and second exhaust gas introduction cells. The second exhaust gas introduction cells each have a cross sectional area larger than a cross sectional area of each of the first exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality of cells. Each of the exhaust gas emission cells has a cross sectional area equal to or larger than the cross sectional area of each of the second exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality of cells.

摘要翻译： 蜂窝过滤器包括多个单元和多孔单元壁。 多个电池包括废气引入单元和废气排放单元。 多孔细胞壁支持SCR催化剂。 废气引入单元包括第一排气导入单元和第二排气导入单元。 第二排气导入单元的横截面积大于与多个单元的长度方向垂直的截面的第一排气导入单元的截面积。 废气排放单元中的每一个在垂直于多个单元的纵向的截面中的横截面积等于或大于每个第二排气导入单元的横截面面积。