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143 条记录 (耗时 0.029 秒)

    Process for preparing purified active monomer of bone-derived factor
    93.
    发明授权
    Process for preparing purified active monomer of bone-derived factor 失效
    骨源性因子纯化活性单体的制备方法

    公开(公告)号：US07811793B2

    公开(公告)日：2010-10-12

    申请号：US10734583

    申请日：2003-12-15

    申请人： Hidetoshi Andou ,  Jun Honda ,  Shunjiro Sugimoto ,  Gertrud Hötten ,  Rolf Bechtold ,  Jens Pohl

    发明人： Hidetoshi Andou ,  Jun Honda ,  Shunjiro Sugimoto ,  Gertrud Hötten ,  Rolf Bechtold ,  Jens Pohl

    IPC分类号： C12P21/04 ,  C12P21/06 ,  C12N1/20 ,  C07K14/51

    CPC分类号： C07K14/51 ,  A61K38/00 ,  C07K14/475 ,  C07K14/575

    摘要： A process for preparing a purified refolded monomer or dimer of a bone-derived factor, which comprises subjecting an inclusion body of a bone-derived factor produced by genetic engineering to the following steps a) to c) in sequence: a) introducing a polynucleotide encoding a bone morphogenetic factor into a bacterium, expressing said bone morphogenetic factor in the form of an inclusion body, recovering said inclusion body and treating it with a denaturing agent to obtain a solubilized monomer, b) treating the solubilized monomer without purification directly with a refolding solution to obtain a refolded monomeric bone morphogenetic factor, c) subjecting the refolded monomeric bone morphogenetic factor to purification.

    摘要翻译： 一种制备骨源性因子的纯化的重折叠单体或二聚体的方法，其包括使基因工程产生的骨衍生因子的内含体按顺序步骤a）至c）：a）将多核苷酸 将骨形态发生因子编码成细菌，以包涵体的形式表达所述骨形态发生因子，回收所述包涵体并用变性剂处理以获得溶解的单体，b）直接用 重折叠溶液以获得重折叠的单体骨形态发生因子，c）使重折叠的单体骨形态发生因子进行纯化。

    On-Chip RF Shields with Backside Redistribution Lines
    95.
    发明申请
    On-Chip RF Shields with Backside Redistribution Lines 有权
    带背面再分配线的片上RF屏蔽

    公开(公告)号：US20100078776A1

    公开(公告)日：2010-04-01

    申请号：US12242487

    申请日：2008-09-30

    申请人： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

    发明人： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

    IPC分类号： H01L23/552 ,  H01L21/44

    CPC分类号： H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/552 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05569 ,  H01L2924/0002 ,  H01L2224/05552

    摘要： Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes forming a through substrate opening from a back surface of a substrate, the through substrate opening disposed between a first and a second region, the first region comprising devices for RF circuitry and the second region comprising devices for other circuitry. The method further includes forming patterns for redistribution lines on a photo resist layer, the photo resist layer disposed under the back surface, and filling the through substrate opening and the patterns for redistribution lines with a conductive material.

    摘要翻译： 公开了一种片上系统的结构以及片上系统的形成方法。 在一个实施例中，一种制造片上系统的方法包括从衬底的背面形成穿透衬底开口，穿过衬底开口设置在第一和第二区域之间，第一区域包括用于RF电路的装置，第二区域包括第二 区域包括用于其他电路的装置。 该方法还包括在光致抗蚀剂层上形成用于再分配线的图案，设置在背面下方的光致抗蚀剂层，以及用导电材料填充贯通基板开口和再分配线图案。

    USE OF GDF-5 FOR THE IMPROVEMENT OR MAINTENANCE OF DERMAL APPEARANCE
    96.
    发明申请
    USE OF GDF-5 FOR THE IMPROVEMENT OR MAINTENANCE OF DERMAL APPEARANCE 审中-公开
    使用GDF-5改善或维持皮肤外观

    公开(公告)号：US20100047299A1

    公开(公告)日：2010-02-25

    申请号：US12524229

    申请日：2008-01-24

    申请人： Jens Pohl

    发明人： Jens Pohl

    IPC分类号： A61K8/02 ,  A61K38/39 ,  A61K31/7088 ,  A61K31/715 ,  A61Q19/08

    CPC分类号： C07K14/51 ,  A61K8/606 ,  A61K8/64 ,  A61Q19/08

    摘要： The present invention is directed to novel methods and compositions containing growth factor proteins. Said compositions are specifically designed to optimize the amount of crucial structural elements of mammalian tissues. The invention is especially useful for the preservation and improvement of dermal tissue appearance.

    摘要翻译： 本发明涉及含有生长因子蛋白质的新方法和组合物。 所述组合物被特别设计用于优化哺乳动物组织的关键结构元件的量。 本发明对皮肤组织外观的保存和改善特别有用。

    Method for coating a structure comprising semiconductor chips
    99.
    发明授权
    Method for coating a structure comprising semiconductor chips 有权
    涂覆包含半导体芯片的结构的方法

    公开(公告)号：US07547645B2

    公开(公告)日：2009-06-16

    申请号：US11504782

    申请日：2006-08-16

    申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

    发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

    IPC分类号： H01L21/20

    CPC分类号： H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method for coating a structure that includes at least one semiconductor chip involves electrostatically depositing coating particles on the areas of the structure to be coated. The coating particles are first applied to a carrier and the latter is electrostatically charged with the coating particles. The structure including at least one semiconductor chip is charged electrostatically to a polarity opposite to the carrier. The carrier and/or the structure are then moved towards one another in the direction of an area of the structure to be coated until the coating particles jump to the areas of the structure to be coated and adhere there. The coating particles are liquefied by heating the area with coating particles to form a coating.

    摘要翻译： 涂覆包括至少一个半导体芯片的结构的方法包括在待涂覆结构的区域上静电沉积涂层颗粒。 首先将涂层颗粒施加到载体上，然后将涂层颗粒带电涂覆颗粒。 包括至少一个半导体芯片的结构被静电充电到与载体相反的极性。 然后将载体和/或结构沿待涂覆结构的区域的方向彼此移动，直到涂层颗粒跳到要涂覆的结构的区域并粘附在那里。 涂覆颗粒通过用涂覆颗粒加热该区域而液化以形成涂层。