公开(公告)号：US20140378597A1

公开(公告)日：2014-12-25

申请号：US14375295

申请日：2012-07-24

Applicant: Guy Buytaert ,  Dieter Wemel ,  Patricia Reis

Inventor： Guy Buytaert ,  Dieter Wemel ,  Patricia Reis

IPC: D02G3/48 ,  B21C1/02 ,  C08J5/04 ,  C08K3/08 ,  C08K3/04 ,  D02G3/12 ,  B60C9/00

CPC classification number: D02G3/48 ,  B21C1/02 ,  B32B15/015 ,  B60C9/0007 ,  B60C2009/0014 ,  C08K3/08 ,  C09D5/38 ,  C09D7/61 ,  C22C9/04 ,  C22C38/00 ,  C22C38/001 ,  C22C38/02 ,  C22C38/04 ,  C22C38/42 ,  C22C38/44 ,  C25D3/12 ,  C25D3/22 ,  C25D3/38 ,  C25D5/10 ,  C25D5/48 ,  C25D5/50 ,  D07B1/066 ,  D07B1/0666 ,  D07B2201/2011 ,  D07B2201/2043 ,  D07B2205/3089 ,  D07B2501/2046 ,  D07B2801/18

Abstract: An elongated steel element adapted for the reinforcement of rubber products is covered with a ternary or quaternary alloy coating of copper-M-zinc. M is one or two metals selected from the group consisting of cobalt, nickel, tin, indium, manganese, iron, bismuth and molybdenum. The copper content inside the coating ranges from 58 weight percent to 75 weight percent, the content of said one or two metals inside the coating ranges from 0.5 weight percent to 10 weight percent, the remainder is zinc and unavoidable impurities. The one or two metals are present throughout the coating. The phosphorus is present on and/or in the coating in an amount ranging from 0.3 milligram per square meter to 1 milligram per square meter of the coating. The coating further lacks triazole residues. Good results for under cure adhesion have been obtained. Furthermore, a corresponding method for manufacturing such an elongated steel element is disclosed.

Abstract translation: 用于加强橡胶制品的细长钢元件用铜-M-锌的三元或四元合金涂层覆盖。 M是选自钴，镍，锡，铟，锰，铁，铋和钼中的一种或两种金属。 涂层中的铜含量为58重量％至75重量％，涂层内的一种或两种金属的含量为0.5重量％至10重量％，其余为锌和不可避免的杂质。 一个或两个金属存在于整个涂层中。 磷存在于涂层上和/或涂层中，其含量范围为每平方米0.3毫克至1毫克涂层。 该涂层还缺乏三唑残基。 已经获得了良好的固化粘合性能。 此外，公开了用于制造这种细长钢件的相应方法。

公开(公告)号：US08908274B2

公开(公告)日：2014-12-09

申请号：US13023454

申请日：2011-02-08

Applicant: Takayuki Teshima ,  Shinan Wang ,  Yutaka Setomoto ,  Takashi Nakamura

Inventor： Takayuki Teshima ,  Shinan Wang ,  Yutaka Setomoto ,  Takashi Nakamura

IPC: G02B5/18 ,  C23C18/16 ,  C23C18/18 ,  C25D5/10 ,  C25D5/12 ,  C25D5/50 ,  G21K1/06 ,  C25D7/12 ,  C25D5/02

CPC classification number: G21K1/06 ,  C23C18/1612 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/1851 ,  C23C18/1868 ,  C25D5/02 ,  C25D5/022 ,  C25D5/10 ,  C25D5/12 ,  C25D5/50 ,  C25D7/123 ,  G02B5/1838 ,  G02B5/1857 ,  G02B5/1866 ,  G21K2207/005 ,  Y10T428/12396

Abstract: A microstructure manufacturing method includes: preparing a mold having on a front side thereof a plurality of fine structures, with conductivity being imparted to a bottom portion between the plurality of fine structures; forming a first plating layer between the plurality of fine structures by plating the bottom portion; and forming a second plating layer of larger stress than the first plating layer on the first plating layer between the plurality of fine structures, wherein the stress of the second plating layer is used to curve a back side surface of the mold.

Abstract translation: 微结构制造方法包括：制备在其前侧具有多个精细结构的模具，其导电性被施加到所述多个精细结构之间的底部; 通过电镀底部在多个精细结构之间形成第一镀层; 并且形成比所述多个微细结构之间的所述第一镀层上的第一镀层大的应力的第二镀层，其中所述第二镀层的应力用于弯曲所述模具的背面。

公开(公告)号：US08728629B2

公开(公告)日：2014-05-20

申请号：US12885059

申请日：2010-09-17

Applicant: Shuichi Kitagawa ,  Kengo Mitose ,  Yoshiaki Kobayashi

Inventor： Shuichi Kitagawa ,  Kengo Mitose ,  Yoshiaki Kobayashi

IPC: C25D5/50 ,  C25D3/12 ,  C25D3/30 ,  H01R13/03 ,  B23K26/00 ,  C22F1/08

CPC classification number: C25D3/30 ,  B23K26/354 ,  C22F1/08 ,  C25D3/12 ,  C25D5/10 ,  C25D5/505 ,  H01R13/03 ,  Y10S428/929 ,  Y10T29/49213 ,  Y10T428/12715 ,  Y10T428/12722

Abstract: A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface.

Abstract translation: 由铜或铜合金基材上形成的具有锡或锡合金层的材料的金属连接器制成的连接器端子，其中锡或锡合金层在该表面上的接触部位的厚度 端子小于接触部位以外的区域中的锡或锡合金层的厚度，并且在接触部位形成作为锡或锡合金层的下层的铜锡合金层; 以及由用于连接器的金属材料制成的连接器端子，该材料具有铜或铜合金基材，其中铜 - 锡合金层在端子的表面上的接触部位处形成点状，并且锡 或锡合金层形成在表面上的其余区域中。

公开(公告)号：US20140120262A1

公开(公告)日：2014-05-01

申请号：US13911052

申请日：2013-06-05

Applicant: Leo Shih

Inventor： Leo Shih

IPC: B41M5/00 ,  C25D7/00

CPC classification number: C25D7/00 ,  C25D5/022 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14

Abstract: A method of forming a tool marking structure includes: a coloring step of coloring a predetermined position of the first protective layer so as to form a marking area with a color layer and forming the first protective layer on a bottom surface of the marking area, and a second-time surface processing step of forming a second protective layer on a non-marking area of the tool.

Abstract translation: 一种形成工具标记结构的方法包括：着色步骤，使第一保护层的预定位置着色，以形成具有着色层的标记区域，并在标记区域的底面上形成第一保护层;以及 第二表面处理步骤，在所述工具的非标记区域上形成第二保护层。

公开(公告)号：US20140110265A1

公开(公告)日：2014-04-24

申请号：US14135745

申请日：2013-12-20

Applicant: CENTRE DE RECHERCHE PUBLIC - GABRIEL LIPPMANN

Inventor： Mikael Fredenberg ,  Patrik Möller ,  Peter Wiwen-N ilsson ,  Cecilia Aronsson ,  Matteo Dainese

IPC: C25D5/02 ,  C25D7/12 ,  C25D5/50 ,  C23C14/34

CPC classification number: C25D5/02 ,  B81C99/0085 ,  C23C14/34 ,  C23C14/3414 ,  C25D1/003 ,  C25D1/10 ,  C25D5/022 ,  C25D5/10 ,  C25D5/50 ,  C25D7/12 ,  C25D7/123 ,  C25F3/14 ,  H01L21/2885 ,  H01L21/32134 ,  H01L21/76838 ,  H01L21/76843 ,  H01L21/76852 ,  H01L21/76873 ,  H01L21/76877 ,  H01L21/76885 ,  H05K3/07 ,  H05K3/108 ,  H05K3/241 ,  H05K3/4647 ,  H05K2203/0117 ,  H05K2203/0733 ,  Y10T156/10

Abstract: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier provided with an insulating layer which is patterned at a front side. Conducting material in an electrode layer is applied in the cavities of the patterned insulating layer and in contact with the carrier. A connection layer is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.

Abstract translation: 用于形成具有基底的电化学电池的电极和形成所述电极的方法。 电极包括设置有在前侧被图案化的绝缘层的载体。 将电极层中的导电材料施加在图案化绝缘层的空腔中并与载体接触。 连接层被施加在载体的背面并与载体接触。 电极的周边由绝缘材料覆盖。

公开(公告)号：US08702956B2

公开(公告)日：2014-04-22

申请号：US13356398

申请日：2012-01-23

Applicant: Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

Inventor： Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

IPC: C25D5/52 ,  C25D5/10 ,  C25D5/02

CPC classification number: C25D5/48 ,  B33Y10/00 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885 ,  Y10T156/1052

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

Abstract translation: 本发明的一些实施例提供了用于电化学制造多层结构（例如中尺度或微结构）的方法和装置，其具有改进的端点检测和用于在电化学制造过程中被平坦化的材料（例如层）的并行维护。 一些方法涉及在平坦化期间使用夹具，其确保材料的平面化平面平行于给定公差内的其它沉积平面。 一些方法涉及使用端点检测夹具，其相对于第一沉积层或相对于在制造过程期间形成的一些其它层，相对于衬底的初始表面确保沉积材料的精确高度。 在一些实施例中，平面化可以通过研磨发生，而其他实施例可以使用金刚石切片机。

公开(公告)号：US20140087205A1

公开(公告)日：2014-03-27

申请号：US13706863

申请日：2012-12-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Youn PANG ,  Shimoji Teruaki ,  Eun Heay Lee ,  Seong Min Cho ,  Chi Seong Kim

IPC: B32B15/01 ,  C23C18/42 ,  C23C28/02 ,  B32B15/04

CPC classification number: B32B15/018 ,  B32B15/043 ,  C22C5/02 ,  C22C5/04 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1844 ,  C23C18/42 ,  C23C18/44 ,  C23C18/54 ,  C23C28/021 ,  C23C28/023 ,  C25D5/10 ,  H01L24/00 ,  H05K3/244 ,  H05K2201/09472 ,  Y10T428/12396 ,  Y10T428/12514 ,  Y10T428/12868 ,  Y10T428/12875

Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.

Abstract translation: 提供一种电极焊盘，包括：连接端子部; 包括形成在所述连接端子部上的钯磷（Pd-P）的第一镀层; 以及包含形成在第一镀层上的钯（Pd）的第二镀层。

公开(公告)号：US20140054020A1

公开(公告)日：2014-02-27

申请号：US13591239

申请日：2012-08-22

Applicant: Friedrich Kroener

Inventor： Friedrich Kroener

IPC: F28F21/02 ,  H01L21/60 ,  F28F21/08 ,  C25D5/54 ,  C25D7/12

CPC classification number: C25D5/022 ,  B82Y30/00 ,  C25D5/10 ,  C25D5/14 ,  C25D5/18 ,  C25D5/50 ,  C25D5/54 ,  C25D7/12 ,  D06M10/06 ,  D06M11/83 ,  D06M2101/40 ,  F28F3/02 ,  F28F21/00 ,  F28F21/02 ,  F28F21/085 ,  H01L21/4871 ,  H01L23/373 ,  H01L23/3733 ,  H01L24/83 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/13055

Abstract: A method for fabricating a heat sink may include: providing a carbon fiber fabric having carbon fibers and openings, the openings leading from a first side to a second side of the fabric; and electroplating the fabric with metal, wherein metal is deposited with a higher rate at the first side than at the second side of the fabric. Another method for fabricating a heat sink may include: providing a carbon metal composite having metal-coated carbon fibers and openings, the openings leading from a first side to a second side of the carbon metal composite; disposing the composite over a semiconductor element such that the first side of the composite faces the semiconductor element; and bonding the composite to the semiconductor element by means of an electroplating process, wherein metal electrolyte is supplied to an interface between the carbon metal composite and the semiconductor element via the openings.

Abstract translation: 一种用于制造散热器的方法可以包括：提供具有碳纤维和开口的碳纤维织物，所述开口从所述织物的第一侧向第二侧延伸; 并用金属电镀织物，其中金属在第一侧以比织物第二面高的速率沉积。 制造散热器的另一种方法可以包括：提供具有金属涂覆的碳纤维和开口的碳金属复合材料，所述碳开口从所述碳金属复合材料的第一面到第二面; 将所述复合材料布置在半导体元件上，使得所述复合材料的第一面面对所述半导体元件; 以及通过电镀工艺将所述复合材料结合到所述半导体元件，其中通过所述开口将金属电解质供应到所述碳金属复合材料和所述半导体元件之间的界面。

公开(公告)号：US08637164B2

公开(公告)日：2014-01-28

申请号：US13571984

申请日：2012-08-10

Applicant: Yoshiaki Kobayashi ,  Satoru Zama ,  Satoshi Suzuki ,  Masato Ohno

Inventor： Yoshiaki Kobayashi ,  Satoru Zama ,  Satoshi Suzuki ,  Masato Ohno

IPC: H01H1/02 ,  C25D5/26 ,  C25D5/50 ,  C25D7/00

CPC classification number: C25D5/12 ,  C25D3/12 ,  C25D3/38 ,  C25D3/40 ,  C25D3/46 ,  C25D3/64 ,  C25D5/10 ,  C25D5/50 ,  C25D7/00 ,  H01H1/021 ,  H01H1/023 ,  H01H1/025 ,  Y10T428/12778 ,  Y10T428/12896 ,  Y10T428/1291 ,  Y10T428/12937 ,  Y10T428/12979

Abstract: A silver-coated composite material for movable contact parts, which has: an underlying layer composed of any one of nickel, cobalt, a nickel alloy, and a cobalt alloy at least provided on a part of the surface of a stainless steel substrate; an intermediate layer composed of copper or a copper alloy provided thereon; and a silver or silver alloy layer provided thereon as an outermost layer, wherein a thickness of the intermediate layer is 0.05 to 0.3 μm, and wherein an average grain size of the silver or silver alloy provided as the outermost layer is 0.5 to 5.0 μm.

Abstract translation: 一种用于可移动接触部件的银涂复合材料，其具有：至少设置在不锈钢基板的表面的一部分上的由镍，钴，镍合金和钴合金中的任一种构成的下层; 由铜或铜合金构成的中间层; 以及设置在其上的银或银合金层作为最外层，其中中间层的厚度为0.05〜0.3μm，其中作为最外层设置的银或银合金的平均粒径为0.5〜5.0μm。

公开(公告)号：US20140017512A1

公开(公告)日：2014-01-16

申请号：US13547781

申请日：2012-07-12

Applicant: Masayuki Iimori ,  Michael David Hopper

Inventor： Masayuki Iimori ,  Michael David Hopper

IPC: C25D21/10 ,  A44B1/00 ,  B21D53/48 ,  B32B15/01 ,  C25D5/10

CPC classification number: C25D7/02 ,  C25D3/40 ,  C25D3/58 ,  C25D5/10 ,  C25D5/44 ,  C25D7/00 ,  C25D17/16 ,  Y10T24/36 ,  Y10T428/1275

Abstract: A button or fastener member is provided wherein aluminum or an aluminum alloy is used as raw material, a first copper plating layer is formed directly over the entire surface of said raw material, and a second copper plating layer is formed directly on top of the first copper plating layer, with the aforementioned second copper plating layer being thicker than the aforementioned first copper plating layer.

Abstract translation: 提供了一种按钮或紧固件，其中使用铝或铝合金作为原料，在所述原料的整个表面上直接形成第一铜镀层，并且第二镀铜层直接形成在第一 铜镀层，上述第二镀铜层比上述第一镀铜层厚。