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公开(公告)号：US4889275A
公开(公告)日：1989-12-26
申请号：US266470
申请日：1988-11-02
CPC分类号： G02B6/4442 , B23K1/20 , G02B6/4471 , H01L41/29 , H01R43/0221 , H05K3/3457 , H05K3/363 , B23K2201/36 , B23K2201/40 , H05K2201/09709 , H05K2201/10666 , H05K2203/0278 , H05K2203/043 , H05K2203/107 , H05K3/3494
摘要： A method for effecting high density solder interconnects between a substrate and at least one metalized film having through holes therein is provided. Solder is first applied to metalized portions of the substrates and the solder is then subject to a reflow process to provide reflowed solder. Pressure is applied to the reflowed solder during a second reflow process to provide prestressed or shaped solder. The metalized film is then positioned with at least one metalized portion adjacent to the shaped solder. Heat, as from a laser, is directed through the through holes in the film to melt the solder and form solder interconnections between the substrate and the metalized film.
摘要翻译： 提供了一种用于在衬底和其中具有通孔的至少一个金属化膜之间实现高密度焊料互连的方法。 首先将焊料应用于基板的金属化部分，然后对焊料进行回流工艺以提供回流焊料。 在第二回流过程中，对回流焊料施加压力以提供预应力或成形焊料。 金属化膜然后与邻近成形焊料的至少一个金属化部分定位。 来自激光器的热被引导通过膜中的通孔以熔化焊料并在基底和金属化膜之间形成焊料互连。
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公开(公告)号：US4377316A
公开(公告)日：1983-03-22
申请号：US238873
申请日：1981-02-27
申请人： Mario E. Ecker , Leonard T. Olson
发明人： Mario E. Ecker , Leonard T. Olson
IPC分类号： H01L23/32 , H01L21/48 , H01L23/12 , H01L23/498 , H01L23/52 , H01L23/538 , H05K1/02 , H05K1/11 , H05K1/14 , H05K3/30 , H05K3/34 , H05K3/36 , H05K1/18
CPC分类号： H05K3/303 , H01L21/486 , H01L23/4985 , H01L23/5384 , H05K3/363 , H01L2224/16 , H01L2224/16225 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01322 , H01L2924/16152 , H05K1/0206 , H05K1/113 , H05K1/141 , H05K2201/09472 , H05K2201/09509 , H05K2201/09572 , H05K2201/10659 , H05K2201/10666 , H05K2201/10681 , H05K2201/10727 , H05K2201/10878 , H05K2201/2036 , H05K2203/043 , H05K3/308 , H05K3/3447 , H05K3/3452 , H05K3/3457 , Y02P70/613
摘要： A system for connecting a semiconductor chip carrier to a printed circuit card is described. The semiconductor chip carrier has a flexible, extendable wiring membrane attached to the bottom thereof which extends beyond the periphery of the semiconductor chip carrier and in the area beyond the periphery is provided with electrical contacts. The electrical contacts are mated to complementary contacts in a printed circuit card which is biased from the semiconductor chip carrier by electrical and thermal contact means. The membrane, inter alia, provides high density electrical contact between the semiconductor and printed circuit card. Various elements thereof and a process for forming the same are described.
摘要翻译： 描述了用于将半导体芯片载体连接到印刷电路卡的系统。 半导体芯片载体具有附接到其底部的柔性的可延伸的布线膜，其延伸超出半导体芯片载体的周边，并且在超过外围的区域中设置有电触点。 电触点与印刷电路卡中的互补触点配合，印刷电路卡通过电接触和热接触装置从半导体芯片载体偏置。 该膜尤其在半导体和印刷电路卡之间提供了高密度的电接触。 对其各种要素及其形成方法进行说明。
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公开(公告)号：US12035477B2
公开(公告)日：2024-07-09
申请号：US17910151
申请日：2021-03-08
申请人： Rogers Germany GmbH
发明人： Andreas Meyer , Karsten Schmidt , Tilo Welker
CPC分类号： H05K1/181 , H05K1/0306 , H05K1/183 , H05K3/429 , H05K2201/09036 , H05K2201/09545 , H05K2201/10666 , H05K2203/049
摘要： An electronics module (100), especially a power electronics module, comprising
a metal-ceramic substrate (1) serving as a carrier and having a ceramic element (10) and a primary component metallization (21),
an insulation layer (40) directly or indirectly connected to the primary component metallization (21), and
a secondary component metallization (22) which is connected to the side of the insulation layer (40) facing away from the metal-ceramic substrate (1) and is especially isolated from the primary component metallization (21) using the insulation layer (40),
wherein the ceramic element (10) has a first size (L1, D1) and the insulation layer (40) has a second size (L2, D2) and a ratio of the second size (L2, D2) to the first size (L1, D1) has a value smaller than 0.8, to form an island-like insulation layer (40) on the primary component metallization (21).-
公开(公告)号：US09030007B2
公开(公告)日：2015-05-12
申请号：US12903403
申请日：2010-10-13
申请人： Daisuke Mizutani
发明人： Daisuke Mizutani
CPC分类号： H05K1/147 , H01L21/76898 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K1/0218 , H05K1/141 , H05K3/222 , H05K3/3436 , H05K3/363 , H05K2201/0379 , H05K2201/0715 , H05K2201/09063 , H05K2201/092 , H05K2201/10666 , H05K2201/10734 , H05K2203/167 , Y02P70/613 , H01L2924/00
摘要： A semiconductor device includes a first circuit base member including a surface having multiple first electrodes formed thereon, a second circuit base member being provided above the first circuit base member and having first through holes and second through holes formed respectively above the first electrodes, a semiconductor package provided above the second circuit base member, and multiple first bumps provided inside the first through holes and the second through holes to connect the first electrodes to the semiconductor package.
摘要翻译： 半导体器件包括：第一电路基体部件，其包括形成有多个第一电极的表面;第二电路基体部件，设置在第一电路基体的上方，并具有分别形成在第一电极上方的第一通孔和第二通孔; 设置在第二电路基体上方的封装，以及设置在第一通孔内的多个第一凸起和第二通孔，以将第一电极连接到半导体封装。
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公开(公告)号：US08969730B2
公开(公告)日：2015-03-03
申请号：US13587793
申请日：2012-08-16
CPC分类号： H05K1/14 , H05K1/0218 , H05K1/118 , H05K1/147 , H05K3/3494 , H05K3/363 , H05K2201/09481 , H05K2201/10666 , H05K2201/10977 , H05K2203/0195 , H05K2203/1147 , H05K2203/1311 , Y10T29/49121 , Y10T29/49155
摘要： Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have solder pads and other metal traces. A second printed circuit such as a flexible printed circuit may have openings. Solder connections may be formed in the openings to attach metal traces in the flexible printed circuit to the solder pads on the rigid printed circuit board. A ring of adhesive may surround the solder connections. The flexible printed circuit may be attached to the rigid printed circuit board using the ring of adhesive. An insulating tape may cover the solder connections. A conductive shielding layer with a conductive layer and a layer of conductive adhesive may overlap the solder joints. The conductive adhesive may connect the shielding layer to the metal traces on the rigid printed circuit board.
摘要翻译： 印刷电路可以使用诸如焊料连接的连接彼此电连接和机械连接。 诸如刚性印刷电路板的第一印刷电路板可以具有焊盘和其它金属迹线。 诸如柔性印刷电路的第二印刷电路可以具有开口。 可以在开口中形成焊接连接以将柔性印刷电路中的金属迹线附接到刚性印刷电路板上的焊盘。 粘合剂环可以围绕焊料连接。 柔性印刷电路可以使用粘合剂环附接到刚性印刷电路板。 绝缘胶带可以覆盖焊料连接。 具有导电层和导电粘合剂层的导电屏蔽层可与焊点重叠。 导电粘合剂可以将屏蔽层连接到刚性印刷电路板上的金属迹线。
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公开(公告)号：US20140048310A1
公开(公告)日：2014-02-20
申请号：US13587793
申请日：2012-08-16
CPC分类号： H05K1/14 , H05K1/0218 , H05K1/118 , H05K1/147 , H05K3/3494 , H05K3/363 , H05K2201/09481 , H05K2201/10666 , H05K2201/10977 , H05K2203/0195 , H05K2203/1147 , H05K2203/1311 , Y10T29/49121 , Y10T29/49155
摘要： Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have solder pads and other metal traces. A second printed circuit such as a flexible printed circuit may have openings. Solder connections may be formed in the openings to attach metal traces in the flexible printed circuit to the solder pads on the rigid printed circuit board. A ring of adhesive may surround the solder connections. The flexible printed circuit may be attached to the rigid printed circuit board using the ring of adhesive. An insulating tape may cover the solder connections. A conductive shielding layer with a conductive layer and a layer of conductive adhesive may overlap the solder joints. The conductive adhesive may connect the shielding layer to the metal traces on the rigid printed circuit board.
摘要翻译： 印刷电路可以使用诸如焊料连接的连接彼此电连接和机械连接。 诸如刚性印刷电路板的第一印刷电路板可以具有焊盘和其它金属迹线。 诸如柔性印刷电路的第二印刷电路可以具有开口。 可以在开口中形成焊接连接以将柔性印刷电路中的金属迹线附接到刚性印刷电路板上的焊盘。 粘合剂环可以围绕焊料连接。 柔性印刷电路可以使用粘合剂环附接到刚性印刷电路板。 绝缘胶带可以覆盖焊料连接。 具有导电层和导电粘合剂层的导电屏蔽层可与焊点重叠。 导电粘合剂可以将屏蔽层连接到刚性印刷电路板上的金属迹线。
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公开(公告)号：US08514587B2
公开(公告)日：2013-08-20
申请号：US12882216
申请日：2010-09-15
申请人： Jun-Yong Zhang , Peng Wang
发明人： Jun-Yong Zhang , Peng Wang
CPC分类号： H05K3/361 , G06F3/0412 , H05K1/118 , H05K3/321 , H05K3/4069 , H05K2201/10666 , H05K2201/10977
摘要： The present disclosure relates to a conductive structure. The conductive structure includes a first conductive layer, a conductive unit, a circuit board and a conductive material. The conductive unit is disposed on the first conductive layer. The circuit board having a first through hole is disposed on the first conductive layer. The conductive unit is exposed to the first through hole. The first through hole is filled with a conductive material, such that the conductive material is electrically connected to the conductive unit.
摘要翻译： 本发明涉及导电结构。 导电结构包括第一导电层，导电单元，电路板和导电材料。 导电单元设置在第一导电层上。 具有第一通孔的电路板设置在第一导电层上。 导电单元暴露于第一通孔。 第一通孔填充有导电材料，使得导电材料电连接到导电单元。
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公开(公告)号：US08344518B2
公开(公告)日：2013-01-01
申请号：US12828175
申请日：2010-06-30
申请人： Mark Moshayedi
发明人： Mark Moshayedi
IPC分类号： H01L23/52
CPC分类号： H05K1/181 , H01L23/50 , H01L25/105 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H05K1/141 , H05K1/144 , H05K1/182 , H05K3/3442 , H05K2201/049 , H05K2201/09072 , H05K2201/0949 , H05K2201/10515 , H05K2201/10666 , H05K2201/10689 , H01L2924/00
摘要： A multi-chip stack module provides increased circuit density for a given surface chip footprint. Support structures are alternated with standard surface mount type chips to form a stack wherein the support structures electrically interconnect the chips. One aspect is a structure and method for interconnecting a plurality of generally planar chips in a vertical stack such that signals, which are common to the chips, are connected in the stack and signals, which are accessed individually, are separated within the stack.
摘要翻译： 多芯片堆叠模块为给定的表面芯片占用空间提供了增加的电路密度。 支撑结构与标准表面贴装型芯片交替形成堆叠，其中支撑结构将芯片电互连。 一个方面是用于在垂直堆叠中互连多个大致平面的芯片的结构和方法，使得在堆叠中共同连接的芯片的信号和单独访问的信号在堆栈内分离。
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109.发明授权Wiring connecting structure for piezoelectric element, wiring connecting method, piezoelectric actuator, and head suspension 有权用于压电元件的接线连接结构，接线方法，压电执行器和磁头悬挂公开(公告)号：US08149542B2
公开(公告)日：2012-04-03
申请号：US12643031
申请日：2009-12-21
申请人： Toshiki Ando
发明人： Toshiki Ando
CPC分类号： G11B5/4873 , G11B5/486 , H01L41/0475 , H01L41/0986 , H05K3/321 , H05K3/3452 , H05K3/361 , H05K2201/10083 , H05K2201/10666 , Y10T29/42
摘要： A wiring connecting structure for a piezoelectric element is capable of performing wiring to the piezoelectric element without deteriorating the quality and reliability of the piezoelectric element. The piezoelectric element is arranged between a base and head of an object, to minutely move the head in a sway direction according to deformation that occurs on the piezoelectric element in response to a voltage applied from a terminal to an electrode of the piezoelectric element. The wiring connecting structure includes first and second liquid stoppers arranged between the terminal and the electrode, the second liquid stopper being arranged outside the first liquid stopper. The wiring connecting structure also includes an adhesive part to connect the electrode to the terminal. The adhesive part has a conductive adhesive part defined by the first liquid stopper and a sealing adhesive part defined by the second liquid stopper. The sealing adhesive part seals the first liquid stopper and conductive adhesive part.
摘要翻译： 压电元件的布线连接结构能够对压电元件进行布线，而不会降低压电元件的质量和可靠性。 压电元件设置在物体的基座和头部之间，以响应于从端子施加到压电元件的电极的电压，根据在压电元件上发生的变形在摇摆方向上微小地移动头部。 布线连接结构包括布置在端子和电极之间的第一和第二液体塞子，第二液体塞子布置在第一液体塞子的外部。 布线连接结构还包括将电极连接到端子的粘合部分。 粘合部具有由第一液塞和由第二液塞限定的密封粘合部限定的导电粘合部。 密封粘合部分密封第一液体塞子和导电粘合剂部分。
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公开(公告)号：US20110083882A1
公开(公告)日：2011-04-14
申请号：US12882216
申请日：2010-09-15
申请人： JUN-YONG ZHANG , PENG WANG
发明人： JUN-YONG ZHANG , PENG WANG
CPC分类号： H05K3/361 , G06F3/0412 , H05K1/118 , H05K3/321 , H05K3/4069 , H05K2201/10666 , H05K2201/10977
摘要： The present disclosure relates to a conductive structure. The conductive structure includes a first conductive layer, a conductive unit, a circuit board and a conductive material. The conductive unit is disposed on the first conductive layer. The circuit board having a first through hole is disposed on the first conductive layer. The conductive unit is exposed to the first through hole. The first through hole is filled with a conductive material, such that the conductive material is electrically connected to the conductive unit.
摘要翻译： 本发明涉及导电结构。 导电结构包括第一导电层，导电单元，电路板和导电材料。 导电单元设置在第一导电层上。 具有第一通孔的电路板设置在第一导电层上。 导电单元暴露于第一通孔。 第一通孔填充有导电材料，使得导电材料电连接到导电单元。
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