公开(公告)号：US20110075386A1

公开(公告)日：2011-03-31

申请号：US12873702

申请日：2010-09-01

Applicant: Hiroaki Tamura ,  Fumihiko Tokura ,  Michinao Nomura ,  Toshihiro Kusagaya ,  Kazuhiro Mizukami

Inventor： Hiroaki Tamura ,  Fumihiko Tokura ,  Michinao Nomura ,  Toshihiro Kusagaya ,  Kazuhiro Mizukami

IPC: H05K7/14 ,  H01R4/02 ,  H05K1/18

CPC classification number: H05K3/3426 ,  H01L23/495 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H05K2201/09136 ,  H05K2201/10189 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2201/10984 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion.

Abstract translation: 电子部件包括：电子部件主体; 以及固定到电气部件的引线，并且包括由彼此面对的第一和第二倾斜部限定的突出部。 第一倾斜部分的焊料润湿性小于第二倾斜部分的焊料润湿性。

公开(公告)号：US20100167560A1

公开(公告)日：2010-07-01

申请号：US12344849

申请日：2008-12-29

Applicant: Charles V. DeSantis ,  David E. Burchell

Inventor： Charles V. DeSantis ,  David E. Burchell

IPC: H01R12/00

CPC classification number: H05K7/1053 ,  H01R12/57 ,  H01R12/7082 ,  H01R12/716 ,  H01R13/2435 ,  H01R13/2478 ,  H01R13/2485 ,  H01R13/41 ,  H05K3/3426 ,  H05K2201/10734 ,  H05K2201/10946 ,  Y02P70/613

Abstract: An adaptor for connecting ball grid array components to a circuit board with a leaded grid array joint, utilizing electric leads which can connect to a ball grid array on one end and a leaded grid array pad pattern on the opposite end.

Abstract translation: 一种用于将球栅阵列部件连接到具有引线格栅阵列接头的电路板的适配器，其利用可以连接到一端上的球栅阵列的电引线和相对端上的引线格栅阵列焊盘图案。

公开(公告)号：US07746658B2

公开(公告)日：2010-06-29

申请号：US12237650

申请日：2008-09-25

Applicant: Hidefumi Saito

Inventor： Hidefumi Saito

IPC: H05K7/00

CPC classification number: H05K3/284 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/165 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/056 ,  H05K3/0061 ,  H05K2201/10409 ,  H05K2201/10946 ,  H05K2201/2018 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: The present invention provides a circuit device in which warpage of a case member is prevented. The circuit device of the present invention includes: a circuit board having on an upper surface thereof a built-in hybrid integrated circuit constituted by a conductive pattern and a circuit element; a case member including four side wall parts forming a frame-like shape and being in contact with the circuit board so as to form on the upper surface of the circuit board a space in which the circuit element is sealed; and a lead being fixed to a pad composed of the conductive pattern and extending to the outside. The circuit device of the present invention is further provided with a supporting part arranged at a corner of the case member so as to make continuous inner walls of the respective side wall parts with each other.

Abstract translation: 本发明提供了一种电路装置，其中防止了壳体构件的翘曲。 本发明的电路装置包括：电路板，其上表面具有由导电图案和电路元件构成的内置混合集成电路; 壳体构件，包括形成框状形状并与电路板接触的四个侧壁部，以在电路板的上表面上形成电路元件被密封的空间; 并且引线固定到由导电图案组成并延伸到外部的焊盘。 本发明的电路装置还具有设置在壳体的角部的支撑部，以使各个侧壁部分的连续的内壁彼此相连。

公开(公告)号：US07714598B2

公开(公告)日：2010-05-11

申请号：US12054289

申请日：2008-03-24

Applicant: Benjamin N. Eldridge ,  Thomas H. Dozier, II ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  William D. Smith

Inventor： Benjamin N. Eldridge ,  Thomas H. Dozier, II ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  William D. Smith

IPC: G01R31/02 ,  G01R31/26

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract translation: 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US07652894B2

公开(公告)日：2010-01-26

申请号：US11679177

申请日：2007-02-26

Applicant: Cheng-Lien Chiang

Inventor： Cheng-Lien Chiang

IPC: H05K7/10

CPC classification number: H05K3/32 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3421 ,  H05K3/4015 ,  H05K2201/10265 ,  H05K2201/10318 ,  H05K2201/1059 ,  H05K2201/10946 ,  H05K2201/10962 ,  H05K2201/2036

Abstract: A contact lead for engaging with an aperture lead of a circuit carrier, including a substrate contact portion electrically connected to a pad on a substrate a chip contact portion extending from the substrate contact portion and forming an angle with the substrate contact portion raising from the substrate. The contact lead chip contact portion may also be of a cylindrical shape vertically extending from the substrate contact portion. The present invention also provides a module including a printed circuit board having a plurality of pad thereon ,the contact lead electrically connected to the pad, an integrated circuit carrier having a plurality of aperture leads, the aperture leads passing through the contact lead and contacting respectively thereof, and a housing structure for housing the module and providing access for the user to assemble the integrated circuit carrier.

Abstract translation: 一种用于与电路载体的孔径引线接合的接触引线，包括基板接触部分，电连接到基板上的焊盘，该芯片接触部分从基板接触部分延伸并与基板接触部分形成一角度， 。 接触引线芯片接触部分也可以是从基板接触部分垂直延伸的圆柱形形状。 本发明还提供了一种模块，其包括其上具有多个焊盘的印刷电路板，所述触点引线电连接到所述焊盘，集成电路载体，具有多个孔引线，所述孔引线分别穿过所述接触引线并分别接触 以及用于容纳模块并提供用于组装集成电路载体的接口的壳体结构。

公开(公告)号：US20090291573A1

公开(公告)日：2009-11-26

申请号：US12535070

申请日：2009-08-04

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01R12/00

CPC classification number: B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49155 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Abstract translation: 探针卡组件包括探针卡，具有弹性接触结构（探针元件）的空间变换器，其直接安装到（即，不需要额外的连接线等）并且从其表面上的端子延伸，并且设置有插入器 空间变压器和探针卡之间。 空间变换器和插入器“堆叠”，从而可以调节空间变压器的方向，从而可以调节探针元件的尖端的方向，而不改变探针卡的方向。 公开了用于调整空间变换器的取向以及用于确定进行什么调整的适当机构。 插入器具有从其顶表面和底表面延伸的弹性接触结构，并且确保通过插入件的固有顺应性，在整个空间变压器的调整范围内在空间变压器和探针卡之间保持电连接。 使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置探针元件以优化整个晶片的探测。 作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。

公开(公告)号：US20090246984A1

公开(公告)日：2009-10-01

申请号：US12382349

申请日：2009-03-13

Applicant: Deepak Pai

Inventor： Deepak Pai

IPC: H01R12/00 ,  H01R43/00

CPC classification number: H01R12/523 ,  H05K1/144 ,  H05K1/147 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10681 ,  H05K2201/10946 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4922 ,  Y10T29/53183

Abstract: A system for connecting circuit boards is provided. A plurality of overlapping spaced apart circuit boards have a plurality of conductive pins passing through holes in the circuit boards. A connector includes a flexible sheet insulator and a plurality of conductive surfaces separated and supported by the flexible insulator. At least one of the conductive surfaces has a hole there through and a bent compliant lead extending there from. The hole engages one of the pins, and the complaint lead connects to one of the circuit boards.

公开(公告)号：US07579269B2

公开(公告)日：2009-08-25

申请号：US10821715

申请日：2004-04-08

Applicant: Benjamin N. Eldridge ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pedersen

Inventor： Benjamin N. Eldridge ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pedersen

IPC: H01L21/00

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06744 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07371 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01H1/0036 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/45099 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on a semiconductor devices resident on a semiconductor wafer so that temporary connections can be made with the semiconductor devices to burn-in and/or test the semiconductor devices.

Abstract translation: 弹性接触元件通过将至少一层金属材料沉积到沉积在可以是诸如有源半导体器件的电子部件的基板的表面上的掩模层中限定的开口中来制造。 每个弹簧接触元件具有基端，接触端和中心主体部分。 接触端在z轴（在不同的高度）和从基端到x和y方向中的至少一个偏移。 以这种方式，在衬底上以规定的空间关系制造多个弹簧接触元件。 弹簧接触元件使另一个电子元件的端子与其间的电连接暂时（即压力）或永久（例如通过焊接或钎焊或与导电粘合剂连接）连接。 在示例性应用中，弹簧接触元件设置在驻留在半导体晶片上的半导体器件上，使得可以利用半导体器件进行临时连接来老化和/或测试半导体器件。

公开(公告)号：US07564337B2

公开(公告)日：2009-07-21

申请号：US11072553

申请日：2005-03-03

Applicant: Stephen J. Whitney ,  Gordon T. Dietsch ,  Vincent Minh-Tu Tran

Inventor： Stephen J. Whitney ,  Gordon T. Dietsch ,  Vincent Minh-Tu Tran

IPC: H01H85/143 ,  H01H85/48

CPC classification number: H05K3/301 ,  H01H85/0418 ,  H01H85/202 ,  H01H2085/0414 ,  H01H2085/2085 ,  H05K3/3426 ,  H05K2201/062 ,  H05K2201/10181 ,  H05K2201/1031 ,  H05K2201/10386 ,  H05K2201/10636 ,  H05K2201/10757 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613

Abstract: In one aspect of the present invention, subminiature fuses are soldered to a PCB via clips attached to the fuse end caps. The clips are physically attached to the PCB pads, enabling the fuse to be replaced if needed and providing thermal decoupling between the fuse and the heating sinking solder/PCB pads. The fuse and clips can also be picked and placed in one operation. In another aspect, improved fuse clips are provided that include tabs that separate the housing portions of the clips from the heating sinking solder/PCB pads. Such improved clips further enhance thermal decoupling. In a further aspect, an improved fuse is provided, in which the thermal decoupling tabs just described are provided directly with the fuse. In yet a further aspect, a thermally insultive fuse body is provided to further decouple the fuse element from its surroundings.

Abstract translation: 在本发明的一个方面，通过连接到保险丝端盖的夹子将超小型保险丝焊接到PCB。 夹子物理连接到PCB焊盘，使熔断器可以更换，如果需要，并提供保险丝和加热焊锡/ PCB焊盘之间的热解耦。 保险丝和夹子也可以被拾取并放置在一个操作中。 在另一方面，提供了改进的熔断器夹，其包括将夹子的壳体部分与加热凹陷焊料/ PCB焊盘分离的突片。 这种改进的夹子进一步增强了热解耦。 在另一方面，提供了一种改进的保险丝，其中刚刚描述的热去耦接头直接与保险丝一起提供。 在另一方面，提供了一种热绝缘熔丝体，以进一步使熔丝元件与其周围环路分离。

公开(公告)号：US20090102041A1

公开(公告)日：2009-04-23

申请号：US12222255

申请日：2008-08-06

Applicant: Ted Ju

Inventor： Ted Ju

IPC: H01L23/48 ,  H01L21/60

CPC classification number: H05K7/1069 ,  H01R12/7076 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10598 ,  H05K2201/10719 ,  H05K2201/10946 ,  H05K2203/0271 ,  H05K2203/167

Abstract: An electrical connection device and assembly method thereof includes a substrate with a plurality of contacting portions arranged on a surface thereof; a chip module having a plurality of terminals inclining in one direction and compressed and contacted with the contacting portions correspondingly; at least one restricting structure which restricts the chip module to move a distance relative to the substrate depending on the compression deformation of the terminals when the terminals are contacted with the contacting portions; and at least one elastic element just producing deformation when the chip module moves the distance. When the terminals are compressed and contacted with the contacting portions, the restricting structure restricts the chip module to move the distance depending on the compression deformation of the terminals, so that the elastic element just produces deformation, which make the chip module only move in the direction opposite to the deformation direction of the terminals.

Abstract translation: 一种电连接装置及其组装方法，包括：具有布置在其表面上的多个接触部分的基板; 芯片模块，其具有多个端子，其一个方向倾斜并且相应地与所述接触部分压缩和接触; 至少一个限制结构，其限制当所述端子与所述接触部分接触时，所述芯片模块相对于所述基板相对于所述端子的压缩变形而相对于所述基板移动一定距离; 并且至少一个弹性元件刚好在芯片模块移动距离时产生变形。 当端子被压缩并与接触部分接触时，限制结构限制芯片模块根据端子的压缩变形移动距离，使得弹性元件刚刚产生变形，这使得芯片模块仅在 方向与端子的变形方向相反。