公开(公告)号：US07297563B2

公开(公告)日：2007-11-20

申请号：US11152433

申请日：2005-06-14

Applicant: Kyle K. Kirby ,  Warren M. Farnworth ,  James M. Wark ,  William M. Hiatt ,  David R. Hembree ,  Alan G. Wood

Inventor： Kyle K. Kirby ,  Warren M. Farnworth ,  James M. Wark ,  William M. Hiatt ,  David R. Hembree ,  Alan G. Wood

IPC: H01L21/66 ,  H01L23/48 ,  H01K3/10 ,  H05K1/11

CPC classification number: G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

Abstract: A compliant contact pin contactor card method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

Abstract translation: 提供一种兼容的接触针接触器卡制造方法。 柔性接触销组件包括由基板的一部分形成的接触销，其中触头销顺从地保持通过柔性联接结构悬挂在基板内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

公开(公告)号：US20070187844A1

公开(公告)日：2007-08-16

申请号：US11593788

申请日：2006-11-06

Applicant: Kong-Chen Chen

Inventor： Kong-Chen Chen

IPC: H01L23/29

CPC classification number: H05K3/303 ,  H01L21/67259 ,  H01L22/32 ,  H01L22/34 ,  H01L23/041 ,  H01L23/10 ,  H01L23/4093 ,  H01L23/481 ,  H01L23/544 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/72 ,  H01L25/0655 ,  H01L2223/54426 ,  H01L2223/5446 ,  H01L2223/54466 ,  H01L2223/54473 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0268 ,  H05K1/0296 ,  H05K1/144 ,  H05K1/16 ,  H05K3/222 ,  H05K3/325 ,  H05K7/20436 ,  H05K2201/0314 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2203/167 ,  Y10T29/49004 ,  Y10T29/49133 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: The present invention provides systems and methods for assembling an electronic assembly using an anisotropic conducting membrane (ACM) as a component interconnect and a substrate embossed with placement cavities or a positional fixture to facilitate component placement on the substrate in the electronic assembly. The fixture may comprise multiple layers of interconnects to improve routing density for the electronic assembly enclosed in a housing. An alignment chain may be used to monitor positional and contact integrity of the ACM interfaced components in a complex assembly. The systems and methods allow components to be detached for reuse. Interconnection elements or conduction pathways at the components can be used to interconnect a plurality of neighboring substrates over the ACM layers into a stacked electronic assembly.

Abstract translation: 本发明提供用于组装使用各向异性导电膜（ACM）作为部件互连的电子组件的系统和方法，以及用放置空腔或位置固定器压花的基板，以便于元件放置在电子组件中的基板上。 夹具可以包括多层互连，以改善围绕在壳体中的电子组件的布线密度。 可以使用对准链来监视复杂组件中ACM接口部件的位置和接触完整性。 系统和方法允许组件分离以重新使用。 组件之间的互连元件或传导路径可用于将ACM层上的多个相邻衬底互连成堆叠式电子组件。

公开(公告)号：US20070187140A1

公开(公告)日：2007-08-16

申请号：US11566912

申请日：2006-12-05

Applicant: Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

Inventor： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC: H05K1/16

CPC classification number: H05K3/326 ,  H01L23/49811 ,  H01L24/72 ,  H01L24/81 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/28 ,  H05K3/341 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/0397 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The present invention is to provide a printed wiring board in which malconnection or disconnection caused by a difference between coefficients of thermal expansion of a semiconductor chip and a printed wiring board can be decreased even when a highly-integrated semiconductor apparatus is mounted thereon and an electronic device using the same. An electronic device (4) according to the present invention includes a printed wiring board (1) with a component mounting pin (18) and a surface-mounting type semiconductor apparatus (2) with an electrode pad (3), wherein the component mounting pin (18) has elasticity and is urged against the electrode pad (3) to maintain electric connection.

Abstract translation: 本发明是提供一种印刷电路板，其中即使在高度集成的半导体装置安装在其上时也能够降低由半导体芯片和印刷电路板的热膨胀系数之间的差异引起的故障连接或断开，并且电子 设备使用相同。 根据本发明的电子设备（4）包括具有元件安装销（18）的印刷电路板（1）和具有电极焊盘（3）的表面安装型半导体设备（2），其中元件安装 销（18）具有弹性并且被推靠在电极焊盘（3）上以保持电连接。

公开(公告)号：US20070181999A1

公开(公告)日：2007-08-09

申请号：US11349949

申请日：2006-02-09

Applicant: Sung-Lai Wang

Inventor： Sung-Lai Wang

IPC: H01L23/34

CPC classification number: H05K7/1061 ,  G11C5/04 ,  H01L25/0655 ,  H01L2924/0002 ,  H01R13/2414 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2201/2018 ,  H01L2924/00

Abstract: A memory module comprises a base plate disposed with a plurality of printed circuit sets and one or more IC embedding frames fixed on the base plate, particularly each IC embedding frame having a rubber spring connector stored inside which comprises an insulating flexible silicone rubber layer embedded with a conductive spring matrix composed of a group of conductive spring modules in longitudinal and latitudinal matrix arrangement and is through its conductive spring modules formed in electrical connection with a corresponding printed circuit set of the base plate; the memory module is to provide IC memory chip being installed in detachable manner taking the advantage of easy installation, convenient maintenance or replacement of IC memory chip without use of SMT, soldering paste or flux.

Abstract translation: 存储模块包括设置有多个印刷电路组的基板和固定在基板上的一个或多个IC嵌入框架，特别是每个IC嵌入框架，其内部具有橡胶弹簧连接器，该嵌入框架包括嵌入有绝缘的柔性硅橡胶层 导电弹簧基体由纵向和纵向矩阵排列的一组导电弹簧模块组成，并且通过其导电弹簧模块形成，该导电弹簧模块与相应的基板印刷电路组电连接; 存储器模块是提供以可拆卸的方式安装的IC存储器芯片，其优点是不使用SMT，焊膏或助焊剂，易于安装，便于维护或更换IC存储器芯片。

公开(公告)号：US07249954B2

公开(公告)日：2007-07-31

申请号：US11457849

申请日：2006-07-17

Applicant: Roger E. Weiss

Inventor： Roger E. Weiss

IPC: H01R12/00

CPC classification number: H01R31/06 ,  H01R12/707 ,  H01R12/7076 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H05K1/141 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/049 ,  H05K2201/10325 ,  H05K2201/2009

Abstract: A separable electrical connector for electrically interconnecting an electrical device to a substrate. In one embodiment, the connector includes an adapter board electrically connected to the substrate, the adapter board having electrical contacts on both sides, and a layer of ACE between the electrical device and the adapter board. A mechanical structure is used to apply a compressive force on the ACE through the adapter board and the electrical device. In another embodiment, the connector includes a translator board having electrical contacts on both sides and electrical circuits within to expand the footprint of the fine pitch electrical device to the coarser pitch of the substrate. The connector further includes a layer of ACE between the translator board and the substrate.

Abstract translation: 一种用于将电气装置与衬底电连接的可分离的电连接器。 在一个实施例中，连接器包括电连接到基板的适配器板，适配器板在两侧具有电触点，以及在电气设备和适配器板之间的ACE层。 机械结构用于通过适配器板和电气设备在ACE上施加压缩力。 在另一个实施例中，连接器包括具有两侧电触点和电路的转换板，用于将细间距电装置的覆盖区扩大到基板的较粗间距。 连接器还包括翻译板和衬底之间的一层ACE。

公开(公告)号：US20070132098A1

公开(公告)日：2007-06-14

申请号：US11673904

申请日：2007-02-12

Applicant: Takeshi Sano ,  Hirofumi Kobayashi ,  Hideaki Ohkura

Inventor： Takeshi Sano ,  Hirofumi Kobayashi ,  Hideaki Ohkura

IPC: H01L23/48

CPC classification number: H05K3/325 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13386 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13455 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0314 ,  H05K2201/0367 ,  H01L2924/00014 ,  H01L2924/0542 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05147

Abstract: An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.

Abstract translation: 电子设备包括电子部件，其包括至少一个第一电极，包括至少一个第二电极的基板和形成在所述至少一个第一电极上的至少一个凸块，并由包括具有橡胶弹性的树脂的弹性导电树脂形成， 以及包括涂覆有金，银，镍和铜之一的表面层的针状导电填料。 所述至少一个第一电极和所述至少一个第二电极通过使所述至少一个凸块与所述至少一个第二电极机械接触而彼此电连接。

公开(公告)号：US07221053B2

公开(公告)日：2007-05-22

申请号：US11086922

申请日：2005-03-21

Applicant: Thorsten Meyer ,  Harry Hedler ,  Stephan Dobritz

Inventor： Thorsten Meyer ,  Harry Hedler ,  Stephan Dobritz

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/13 ,  H01L23/3114 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13191 ,  H01L2224/13541 ,  H01L2224/13551 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/14051 ,  H01L2224/14141 ,  H01L2224/14145 ,  H01L2224/14146 ,  H01L2224/14177 ,  H01L2224/14505 ,  H01L2224/17051 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/325 ,  H05K3/3436 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10659 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: The present invention relates to an integrated device comprising an electronic circuit chip, a solder contact structure to provide contact to the electronic circuit chip and an elastic contact structure to provide contact to the electronic circuit chip, wherein the solder contact structure and the elastic contact structure are arranged on a contacting surface of the integrated device.

Abstract translation: 本发明涉及一种集成装置，其包括电子电路芯片，提供与电子电路芯片的接触的焊接触点结构和用于提供与电子电路芯片的接触的弹性接触结构，其中焊料接触结构和弹性接触结构 布置在集成装置的接触表面上。

公开(公告)号：US20060273446A1

公开(公告)日：2006-12-07

申请号：US10543253

申请日：2004-01-22

Applicant: Junya Sato ,  Yoshiyuki Hashimoto

Inventor： Junya Sato ,  Yoshiyuki Hashimoto

IPC: H05K7/20 ,  H01L23/12

CPC classification number: H01R13/2414 ,  H01R12/52 ,  H05K1/0298 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/0314 ,  H05K2201/0919 ,  H05K2201/09845

Abstract: A circuit board device comprises a first wiring board (79) having plural first electrode terminals (73, 75, 77) for connection row-arranged on a surface layer, a second wiring board (87) having plural second electrode terminals (81, 83, 85) for connection row-arranged on a surface layer, and an anisotropic conductive member (89) disposed therebetween to the electrode terminals (73, 75, 77, 81, 83, 85). A local portion of each of the wiring boards (79, 87) has a step difference to divide and dispose the electrode terminals (73, 75, 77, 81, 83, 85). A local portion of the anisotropic conductive member (89) corresponding to the step difference has a step shape that is capable of contacting with the step difference. A laminate comprising respective wiring boards (79, 87) and the anisotropic conductive member disposed therebetween is pressed and held in a lamination direction.

Abstract translation: 一种电路板装置，具备：第一配线基板（79），具有多个第一电极端子（73,75,77），用于连接排列在表面层上;第二布线板（87），具有多个第二电极端子（81,83 ，85），以及设置在所述电极端子（73,75,77,81,83,85）之间的各向异性导电构件（89）。 每个布线板（79,87）的局部部分具有台阶差以分隔和布置电极端子（73,75,77,81,83,85）。 对应于台阶差的各向异性导电构件（89）的局部部分具有能够与台阶差接触的台阶形状。 包括各个布线板（79,87）和设置在其间的各向异性导电构件的层叠体被压制并保持在层叠方向。

公开(公告)号：US20060201705A1

公开(公告)日：2006-09-14

申请号：US11433721

申请日：2006-05-12

Applicant: Akram Salman ,  Warren Farnworth ,  Alan Wood ,  J. Brooks ,  Eugene Cloud

Inventor： Akram Salman ,  Warren Farnworth ,  Alan Wood ,  J. Brooks ,  Eugene Cloud

IPC: H05K1/18

CPC classification number: H05K3/4007 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/095 ,  H05K3/321 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10696 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate. Also disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the circuit, and a lead having a first end connected to the active side of the circuit via a lead-over-chip connection, and having a second end extending from the package. Also disclosed is a device comprising a circuit and a lead formed from a flexible conductor, with the lead having a first end connected to the circuit.

公开(公告)号：US07090336B2

公开(公告)日：2006-08-15

申请号：US10760217

申请日：2004-01-21

Applicant: Kia Silverbrook ,  Norman Micheal Berry ,  Garry Raymond Jackson ,  Akira Nakazawa

Inventor： Kia Silverbrook ,  Norman Micheal Berry ,  Garry Raymond Jackson ,  Akira Nakazawa

IPC: B41J2/14

CPC classification number: H05K1/142 ,  B41J2/155 ,  B41J2002/14362 ,  B41J2002/14419 ,  B41J2002/14435 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20 ,  H05K3/0064 ,  H05K2201/0314 ,  H05K2201/09845

Abstract: A printhead assembly is provided comprising at least one printhead module comprising at least two printhead integrated circuits, each of which has nozzles formed therein for delivering printing fluid onto the surface of print media, and a support member supporting and carrying the printing fluid for the at least two printhead integrated circuits, and a casing in which the at least one printhead module is removably mounted so as to constrain movement of the at least one printhead module relative to the casing in at least the direction of printing fluid delivery from the nozzles to the print media.

Abstract translation: 提供了一种打印头组件，其包括至少一个打印头模块，该打印头模块包括至少两个打印头集成电路，每个打印头集成电路具有形成在其中的喷嘴，用于将打印流体输送到打印介质的表面上;以及支撑部件， 至少两个打印头集成电路，以及外壳，其中所述至少一个打印头模块可移除地安装，以便至少在从所述喷嘴到所述喷嘴的打印流体传送的方向上限制所述至少一个打印头模块相对于所述壳体的运动 印刷媒体。