公开(公告)号：US08065797B2

公开(公告)日：2011-11-29

申请号：US11896774

申请日：2007-09-05

申请人： Ryoichi Watanabe ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Seung-Chul Kim ,  Myung-San Kang

发明人： Ryoichi Watanabe ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Seung-Chul Kim ,  Myung-San Kang

IPC分类号： H01K3/10 ,  H05K3/36 ,  H05K3/02 ,  H05K3/10 ,  H05K1/00 ,  H05K1/09

CPC分类号： H05K3/0017 ,  H05K3/0014 ,  H05K3/045 ,  H05K3/06 ,  H05K3/107 ,  H05K3/20 ,  H05K3/205 ,  H05K3/426 ,  H05K3/4614 ,  H05K3/465 ,  H05K3/4658 ,  H05K2201/0361 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2203/0278 ,  H05K2203/0384 ,  H05K2203/0582 ,  H05K2203/1152 ,  H05K2203/1189 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of fabricating a printed circuit board is disclosed. A method of fabricating a printed circuit board that includes: stacking an insulation layer on at least one surface of a core layer, on which an inner circuit is formed, and forming an outer circuit pattern; burying the outer circuit pattern in the insulation layer; removing the outer circuit pattern to form minute grooves and curing the insulation layer; and forming an outer circuit by filling metal in the minute grooves, makes it possible to readily form high-resolution fine-line circuits, as well as to reduce fabrication costs and increase productivity.

摘要翻译： 公开了一种制造印刷电路板的方法。 一种制造印刷电路板的方法，包括：在形成有内部电路的芯层的至少一个表面上堆叠绝缘层，并形成外部电路图案; 将外部电路图案埋在绝缘层中; 去除外部电路图案以形成微小凹槽并固化绝缘层; 通过在金属槽中填充金属而形成外部电路，可以容易地形成高分辨率的细线电路，并且能够降低制造成本并提高生产率。

公开(公告)号：US20080052905A1

公开(公告)日：2008-03-06

申请号：US11896774

申请日：2007-09-05

申请人： Ryoichi Watanabe ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Seung-Chul Kim ,  Myung-San Kang

发明人： Ryoichi Watanabe ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Seung-Chul Kim ,  Myung-San Kang

IPC分类号： H05K3/02

CPC分类号： H05K3/0017 ,  H05K3/0014 ,  H05K3/045 ,  H05K3/06 ,  H05K3/107 ,  H05K3/20 ,  H05K3/205 ,  H05K3/426 ,  H05K3/4614 ,  H05K3/465 ,  H05K3/4658 ,  H05K2201/0361 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2203/0278 ,  H05K2203/0384 ,  H05K2203/0582 ,  H05K2203/1152 ,  H05K2203/1189 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of fabricating a printed circuit board is disclosed. A method of fabricating a printed circuit board that includes: stacking an insulation layer on at least one surface of a core layer, on which an inner circuit is formed, and forming an outer circuit pattern; burying the outer circuit pattern in the insulation layer; removing the outer circuit pattern to form minute grooves and curing the insulation layer; and forming an outer circuit by filling metal in the minute grooves, makes it possible to readily form high-resolution fine-line circuits, as well as to reduce fabrication costs and increase productivity.

摘要翻译： 公开了一种制造印刷电路板的方法。 一种制造印刷电路板的方法，包括：在形成有内部电路的芯层的至少一个表面上堆叠绝缘层，并形成外部电路图案; 将外部电路图案埋在绝缘层中; 去除外部电路图案以形成微小凹槽并固化绝缘层; 通过在金属槽中填充金属而形成外部电路，能够容易地形成高分辨率的细线电路，并且能够降低制造成本并提高生产率。

公开(公告)号：US08683684B2

公开(公告)日：2014-04-01

申请号：US13200920

申请日：2011-10-05

申请人： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

发明人： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H05K1/056 ,  H05K1/181 ,  H05K1/186 ,  H05K3/108 ,  H05K2201/0108 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/10121 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/0401

摘要： A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.

摘要翻译： 一种制造光学部件嵌入式印刷电路板的方法，所述方法包括：在金属芯的一侧上堆叠第一绝缘层; 将光学部件嵌入形成在所述金属芯中的空腔中; 在金属芯的另一侧堆叠透明材料的第二绝缘层; 以及在所述第一绝缘层上形成电路图案，所述电路图案与所述光学部件电连接。

公开(公告)号：US08457450B2

公开(公告)日：2013-06-04

申请号：US12314449

申请日：2008-12-10

申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

公开(公告)号：US20110179642A1

公开(公告)日：2011-07-28

申请号：US13064542

申请日：2011-03-30

申请人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K3/30

CPC分类号： H05K1/0231 ,  H01L2224/16225 ,  H05K1/0236 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49146

摘要： A method of embedding a chip capacitor in a printed circuit board including a first conductive layer and a dielectric layer placed on the first conductive layer includes removing the dielectric layer to form a cavity exposing the first conductive layer; seating a chip capacitor in the cavity; filling a filled material at a space excluding a space occupied by the chip capacitor in the cavity; forming a via penetrating the filled material and being connected to the chip capacitor; and stacking a conductive material to constitute a second conductive layer in surfaces of the via and the dielectric layer and in an surface of the filled material filled in the cavity.

摘要翻译： 将片状电容器嵌入到包括放置在第一导电层上的第一导电层和介电层的印刷电路板中的方法包括去除电介质层以形成露出第一导电层的空腔; 将片状电容器放置在空腔中; 在不包括空腔中的片状电容器占据的空间的空间填充填充材料; 形成穿过填充材料并连接到片式电容器的通孔; 并且在通孔和电介质层的表面和填充在空腔中的填充材料的表面中堆叠导电材料以构成第二导电层。

公开(公告)号：US07983055B2

公开(公告)日：2011-07-19

申请号：US12010436

申请日：2008-01-24

申请人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

发明人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC分类号： H05K1/18 ,  H01L27/108

CPC分类号： H05K1/162 ,  H05K1/0218 ,  H05K1/0236 ,  H05K3/4069 ,  H05K2201/09509 ,  H05K2201/09618 ,  H05K2201/09663 ,  H05K2201/09972

摘要： A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein at least one cavity capacitor is arranged in a noise-transferable path between a noise source and a noise prevented destination which are placed on the printed circuit board, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped region than the first dielectric layer, the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode.

摘要翻译： 公开了一种具有嵌入式腔体电容器的印刷电路板。 根据本发明的实施例，具有嵌入式空腔电容器的印刷电路板，印刷电路板可以分别包括用作功率层和接地层的两个导电层; 以及放置在所述两个导电层之间的第一电介质层，其中至少一个空腔电容器被布置在放置在所述印刷电路板上的噪声源和被噪声阻止的目的地之间的可噪声转移路径中，形成所述空腔电容器 以允许第二电介质层具有比第一电介质层更低的台阶区域，第二电介质层分别使用两个导电层作为第一电极和第二电极，并且放置在第一电极和第二电极之间。

公开(公告)号：US20100212951A1

公开(公告)日：2010-08-26

申请号：US12654766

申请日：2009-12-31

申请人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

发明人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC分类号： H05K9/00

CPC分类号： H05K9/0071 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/00014 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0236 ,  H05K9/002 ,  H05K9/0064 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An EMI noise reduction board using an electromagnetic bandgap structure is disclosed. In the EMI noise reduction board according to an embodiment of the present invention, an electromagnetic bandgap structure having band stop frequency properties can be inserted into an inner portion of the board so as to shield an EMI noise, in which the portion corresponds to an edge of the board and in which the EMI noise is conducted from the inside to the edge of the board and radiates to the outside of the board.

摘要翻译： 公开了一种使用电磁带隙结构的EMI降噪板。 在根据本发明实施例的EMI噪声抑制板中，具有带阻频率特性的电磁带隙结构可以插入到板的内部，以屏蔽EMI噪声，其中该部分对应于边缘 并且其EMI噪声从板的内部传导到边缘并辐射到板的外部。

公开(公告)号：US20090294739A1

公开(公告)日：2009-12-03

申请号：US12263685

申请日：2008-11-03

申请人： Eung-Suek Lee ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Jun-Oh Hwang ,  Tae-Eun Chang ,  Jee-Soo Mok

发明人： Eung-Suek Lee ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Jun-Oh Hwang ,  Tae-Eun Chang ,  Jee-Soo Mok

IPC分类号： H01B1/02

CPC分类号： H01B1/24 ,  B82Y10/00 ,  H05K1/095 ,  H05K3/4069 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0323 ,  H05K2203/0425

摘要： The invention provides a conductive paste including a carbon nanotube and a printed circuit board using the same. The invention provides the conductive paste which exhibits an excellent electrical conductivity and allows the implementation of the X-Y interconnection and simultaneously the Z-interconnection without loosing the carbon nanotube's own original characteristics.

摘要翻译： 本发明提供一种包括碳纳米管的导电浆料和使用其的印刷电路板。 本发明提供了导电性优异的导电性糊剂，其导电性优异，可以实现X-Y互连，同时实现Z-互连，而不会使碳纳米管本身的原有特性丧失。

公开(公告)号：US20090133444A1

公开(公告)日：2009-05-28

申请号：US12149517

申请日：2008-05-02

申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Han-Seo Cho ,  Joon-Sung Kim

发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Han-Seo Cho ,  Joon-Sung Kim

IPC分类号： C03B37/022

CPC分类号： G02B6/136 ,  G02B6/4214 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4611

摘要： A method of manufacturing an optical board is disclosed. The method of manufacturing an optical board may include stacking an optical waveguide core layer over a first optical waveguide cladding layer, forming an inclined surface by diffracting a laser with a mask to remove a portion of the optical waveguide core layer, and stacking a reflective layer over the inclined surface.

摘要翻译： 公开了一种制造光学板的方法。 制造光学板的方法可以包括在第一光波导包层上层叠光波导芯层，通过用掩模衍射激光来形成倾斜表面以去除光波导芯层的一部分，并且将反射层 在倾斜的表面上。

公开(公告)号：US20090130390A1

公开(公告)日：2009-05-21

申请号：US12149952

申请日：2008-05-09

申请人： Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

发明人： Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

IPC分类号： B32B3/00 ,  B29D11/00

CPC分类号： B29D11/00663 ,  B29D11/00807 ,  G02B6/136 ,  H05K1/0274 ,  Y10T428/24612

摘要： An optical wiring board and a method of manufacturing the optical wiring board are disclosed. The method of manufacturing an optical wiring board may include forming a lower cladding over an insulating layer; forming a side cladding, which has an indentation corresponding with the core, over the lower cladding; filling a core material in the indentation; and forming an upper cladding such that the core material is covered. Embodiments of the invention can be utilized to readily control the thickness of the core.

摘要翻译： 公开了一种光布线板及其制造方法。 制造光布线板的方法可以包括在绝缘层上形成下包层; 在所述下包层上形成具有与所述芯对应的凹陷的侧包层; 填充压痕中的芯材; 并且形成上覆层，使得芯材被覆盖。 本发明的实施例可用于容易地控制芯的厚度。