公开(公告)号：US20180020549A1

公开(公告)日：2018-01-18

申请号：US15646086

申请日：2017-07-10

Applicant: ROHM CO., LTD.

Inventor： Motohiro TOYONAGA ,  Yasuhiro FUWA ,  Mamoru YAMAGAMI ,  Isamu NISHIMURA

IPC: H05K1/18 ,  H01L23/13 ,  H01L23/31 ,  H05K1/11 ,  H05K3/00 ,  H01L23/00 ,  H05K1/02 ,  H05K3/28 ,  H01L21/48 ,  H01L23/498

CPC classification number: H05K1/186 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/562 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2924/15156 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09018 ,  H05K2201/10636 ,  H05K2203/1316 ,  H01L2224/81 ,  H01L2924/014

Abstract: An electronic component includes a substrate including a first principal surface, a second principal surface positioned on a side opposite to the first principal surface, a first side surface that connects the first principal surface and the second principal surface and that extends along a first direction, a second side surface that connects the first principal surface and the second principal surface and that extends along a second direction intersecting the first direction, and a corner portion that connects the first side surface and the second side surface and that has a curved surface curved outwardly, and a chip arranged at the first principal surface of the substrate.

公开(公告)号：US20170040185A1

公开(公告)日：2017-02-09

申请号：US15225442

申请日：2016-08-01

Applicant: ROHM CO., LTD.

Inventor： Yasuhiro FUWA

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/373 ,  H01L23/498 ,  H01L23/495 ,  H01L23/29 ,  H01L23/13

CPC classification number: H01L21/56 ,  H01L21/4803 ,  H01L21/4821 ,  H01L21/54 ,  H01L23/13 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3737 ,  H01L23/4951 ,  H01L23/49517 ,  H01L23/49582 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49861 ,  H01L43/065 ,  H01L43/10 ,  H01L2224/16225 ,  H01L2924/15159

Abstract: A semiconductor device includes a semiconductor element, a substrate formed with a recess in a main surface, a conductive layer formed on the substrate and electrically connected to the semiconductor element, and a sealing resin covering the semiconductor element. The substrate is made of an electrically insulative synthetic resin. The recess has a bottom surface on which the semiconductor element is mounted, and an intermediate surface connected to the main surface and the bottom surface. The bottom surface is orthogonal to the thickness direction of the substrate. The intermediate surface is inclined with respect to the bottom surface.

Abstract translation: 半导体器件包括半导体元件，在主表面上形成有凹部的基板，形成在基板上并与半导体元件电连接的导电层，以及覆盖半导体元件的密封树脂。 基板由电绝缘合成树脂制成。 所述凹部具有安装所述半导体元件的底表面和连接到所述主表面和所述底表面的中间表面。 底面与基板的厚度方向正交。 中间表面相对于底面倾斜。

公开(公告)号：US20160211198A1

公开(公告)日：2016-07-21

申请号：US14993857

申请日：2016-01-12

Applicant: ROHM CO., LTD.

Inventor： Mamoru YAMAGAMI ,  Yasuhiro FUWA

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/78 ,  H01L21/48

CPC classification number: H01L21/568 ,  H01L21/4825 ,  H01L21/561 ,  H01L21/78 ,  H01L23/4951 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/544 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides a semiconductor device and a method for manufacturing a semiconductor device. The method comprises: Preparing a semiconductor chip 6 with a first electrode layer 21 formed on an element-forming surface 7. Prepared a support member 30 having a conductor 31 formed on a pattern-forming surface 33. The first electrode layer 21 is bonded to the conductor 31 by a solder, and thus the semiconductor chip 6 is fixed on the support member 30. While the semiconductor chip 6 is fixed on the support member 30, the semiconductor chip 6 is coated by the sealing resin 3 to form a sealing structure 46. By removing the support member 30 from the sealing structure 46, the conductor 31 formed on the support member 30 is transferred to the sealing structure 46. The conductor 31 transferred to the sealing structure 46 is an external electrode exposed from the sealing structure 46.

Abstract translation: 本发明提供半导体器件和半导体器件的制造方法。 该方法包括：准备具有形成在元件形成表面7上的第一电极层21的半导体芯片6.制备具有形成在图案形成表面33上的导体31的支撑构件30.第一电极层21与 导体31通过焊料，从而半导体芯片6固定在支撑构件30上。半导体芯片6固定在支撑构件30上时，半导体芯片6被密封树脂​​3涂覆以形成密封结构 通过从密封结构46移除支撑构件30，形成在支撑构件30上的导体31被传递到密封结构46.转移到密封结构46的导体31是从密封结构46暴露的外部电极 。

公开(公告)号：US20150253121A1

公开(公告)日：2015-09-10

申请号：US14639588

申请日：2015-03-05

Applicant: ROHM CO., LTD.

Inventor： Yuichi NAKAO ,  Yasuhiro FUWA

IPC: G01B7/00 ,  H01L25/16 ,  H01L21/768 ,  H01L43/12 ,  H01L23/31 ,  H01L21/52 ,  H01L43/02 ,  H01L23/528 ,  H01L21/56

CPC classification number: H01L21/52 ,  H01L21/56 ,  H01L23/13 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/49827 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/15151 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/15333

Abstract: A semiconductor device is provided with a substrate made of a semiconductor material, an interconnect layer, at least one electronic element, and a sealing resin. The substrate has a main surface and a pair of lateral surfaces that are orthogonal to the main surface and face in opposite directions to each other. A recessed portion that is recessed from the main surface and has an opening portion that opens on at least one of the pair of lateral surfaces is formed in the substrate. The interconnect layer is formed on the substrate. The electronic element is an orientation sensor, for example, and is accommodated in the recessed portion of the substrate. The sealing resin covers the electronic element.

Abstract translation: 半导体器件设置有由半导体材料制成的衬底，互连层，至少一个电子元件和密封树脂。 基板具有与主表面正交并且彼此相反方向面对的主表面和一对侧表面。 在基板上形成有从主表面凹陷并且具有在一对侧面中的至少一个上开口的开口部的凹部。 互连层形成在基板上。 电子元件例如是定向传感器，并且容纳在基板的凹部中。 密封树脂覆盖电子元件。

公开(公告)号：US20210001641A1

公开(公告)日：2021-01-07

申请号：US16911293

申请日：2020-06-24

Applicant: Rohm Co., Ltd.

Inventor： Goro NAKATANI ,  Akira FUJITA ,  Kazuya NAKAKUBO ,  Yasuhiro FUWA

IPC: B41J2/335 ,  B41J2/34

Abstract: A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.

公开(公告)号：US20180174759A1

公开(公告)日：2018-06-21

申请号：US15836208

申请日：2017-12-08

Applicant: ROHM CO., LTD.

Inventor： Hiroyuki OKADA ,  Yasuhiro FUWA

IPC: H01G5/011 ,  H01L49/02 ,  H01L27/01 ,  H01G5/38 ,  H01G4/015 ,  H01G4/38 ,  H01G4/33 ,  H01G4/40

CPC classification number: H01G5/011 ,  H01G4/015 ,  H01G4/33 ,  H01G4/385 ,  H01G4/40 ,  H01G5/38 ,  H01L27/016 ,  H01L28/40

Abstract: A chip capacitor and a method for manufacturing the chip capacitor, where the chip capacitor includes a substrate, a first external electrode disposed on the substrate, a second external electrode disposed on the substrate, capacitor elements formed on the substrate and connected between the first external electrode and the second external electrode, and fuses that are formed on the substrate, are each interposed between the capacitor elements and the first external electrode or the second external electrode, and are capable of disconnecting each of the capacitor elements.

公开(公告)号：US20180009232A1

公开(公告)日：2018-01-11

申请号：US15710360

申请日：2017-09-20

Applicant: Rohm Co., Ltd.

Inventor： Isamu NISHIMURA ,  Yasuhiro FUWA

IPC: B41J2/335 ,  B41J2/34

CPC classification number: B41J2/33595 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/33525 ,  B41J2/3353 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/34

Abstract: A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

公开(公告)号：US20170182795A1

公开(公告)日：2017-06-29

申请号：US15390141

申请日：2016-12-23

Applicant: Rohm Co., Ltd.

Inventor： Isamu NISHIMURA ,  Yasuhiro FUWA

IPC: B41J2/335 ,  B41J2/34

CPC classification number: B41J2/33595 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/33525 ,  B41J2/3353 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/34

Abstract: A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

公开(公告)号：US20160336489A1

公开(公告)日：2016-11-17

申请号：US15139006

申请日：2016-04-26

Applicant: ROHM CO., LTD.

Inventor： Isamu NISHIMURA ,  Yasuhiro FUWA

IPC: H01L33/50 ,  H05B33/08 ,  H01L33/62 ,  H01L33/56 ,  H01L33/32 ,  H01L33/60

CPC classification number: H01L33/502 ,  H01L25/167 ,  H01L33/32 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2924/181 ,  H05B33/0803 ,  H05B33/0842 ,  H01L2924/00012

Abstract: A semiconductor light-emitting device includes a substrate, an LED chip, a control element, a conductive layer and an insulating layer. The substrate, made of a semiconductor material, has an obverse surface and a reverse surface spaced apart from each other in the thickness direction of the substrate. The control element controls light emission of the LED chip. The conductive layer is electrically connected to the LED chip and the control element. The insulating layer is arranged between at least apart of the conductive layer and the substrate. The substrate has a recess formed in the obverse surface, and the LED chip is housed in the recess. The control element is arranged between the LED chip and the reverse surface in the thickness direction of the substrate.

Abstract translation: 半导体发光器件包括衬底，LED芯片，控制元件，导电层和绝缘层。 由半导体材料制成的衬底具有在衬底的厚度方向上彼此间隔开的正面和反面。 控制元件控制LED芯片的发光。 导电层电连接到LED芯片和控制元件。 绝缘层布置在导电层的至少一部分和基板之间。 基板具有形成在正面的凹部，LED芯片容纳在凹部中。 控制元件布置在基板的厚度方向上的LED芯片和反面之间。

公开(公告)号：US20160242292A1

公开(公告)日：2016-08-18

申请号：US15015870

申请日：2016-02-04

Applicant: ROHM CO., LTD.

Inventor： Isamu NISHIMURA ,  Hideaki YANAGIDA ,  Michihiko MIFUJI ,  Yasuhiro FUWA

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15156 ,  H01L2924/181 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/112 ,  H05K1/186 ,  H05K2201/0162 ,  H05K2201/0376 ,  H05K2201/09036 ,  H01L2924/00012

Abstract: An electronic device includes a semiconductor substrate, an electronic element mounted on the substrate, a conductive layer electrically connected to the electronic element, a sealing resin and a columnar conductor. The substrate has a recess formed in its obverse surface. The electronic element is mounted on the bottom surface of the recess. The conductive layer has an obverse-surface contacting region located on the obverse surface of the substrate. The sealing resin is disposed in at least a part of the recess for covering at least a part of the obverse surface of the substrate. The columnar conductor is electrically connected to the obverse-surface contacting region of the conductive layer and exposed from the sealing resin at a side opposite to the obverse surface of the substrate.

Abstract translation: 电子设备包括半导体衬底，安装在衬底上的电子元件，与电子元件电连接的导电层，密封树脂和柱状导体。 基板具有在其正面形成的凹部。 电子元件安装在凹槽的底面上。 导电层具有位于基板的正面上的正面接触区域。 密封树脂设置在用于覆盖基板的正面的至少一部分的凹部的至少一部分中。 柱状导体与导电层的正面接触区域电连接，并且在密封树脂的与基板的正面相反的一侧露出。