公开(公告)号：US20160307854A1

公开(公告)日：2016-10-20

申请号：US15095848

申请日：2016-04-11

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L23/49575 ,  H01L21/48 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05014 ,  H01L2224/05554 ,  H01L2224/0612 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.

Abstract translation: 半导体器件包括半导体元件电路，导电支撑体和密封树脂。 导电支撑件包括：芯片焊盘，沿第一方向隔开的第一端子，在垂直于第一方向的第二方向上在第一方向上与第一端子相对的第二端子和与第一方向相反的第二端子，以及连接到管芯焊盘的支撑端子。 密封树脂封装第一和第二端子的一部分，支撑端子的一部分，半导体元件电路和管芯焊盘。 密封树脂具有在第二方向上间隔开的两个第一侧表面和沿第一方向隔开的两个第二侧表面。 第一端子和第二端子从第一侧表面露出，而导电支撑件的元件都不会从第二侧表面露出。

公开(公告)号：US20250062199A1

公开(公告)日：2025-02-20

申请号：US18934548

申请日：2024-11-01

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/64

Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.

公开(公告)号：US20180182729A1

公开(公告)日：2018-06-28

申请号：US15905324

申请日：2018-02-26

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA ,  Taro NISHIOKA

IPC: H01L23/00 ,  H01L23/544

CPC classification number: H01L24/32 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/544 ,  H01L23/564 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54486 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/06155 ,  H01L2224/29139 ,  H01L2224/29239 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32013 ,  H01L2224/32105 ,  H01L2224/32106 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/05442 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/207

Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.

公开(公告)号：US20180005981A1

公开(公告)日：2018-01-04

申请号：US15707632

申请日：2017-09-18

Applicant: ROHM CO., LTD.

Inventor： Motoharu HAGA ,  Shingo YOSHIDA ,  Yasumasa KASUYA ,  Toichi NAGAHARA ,  Akihiro KIMURA ,  Kenji FUJII

IPC: H01L23/00 ,  H01L23/495 ,  B23K20/10 ,  H01L21/56 ,  B23K20/24 ,  B23K20/00 ,  H01L23/31

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K20/10 ,  B23K20/24 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48847 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/78307 ,  H01L2224/78309 ,  H01L2224/83 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/838 ,  H01L2224/85 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/8592 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/01206 ,  H01L2924/013 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/20757 ,  H01L2924/3512 ,  H01L2924/01026 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/207 ,  H01L2924/20753 ,  H01L2924/20756 ,  H01L2924/20758 ,  H01L2924/00015

Abstract: A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.

公开(公告)号：US20140312513A1

公开(公告)日：2014-10-23

申请号：US14322461

申请日：2014-07-02

Applicant: ROHM CO., LTD.

Inventor： Yasumasa KASUYA ,  Motoharu HAGA ,  Hiroaki MATSUBARA

IPC: H01L23/00

CPC classification number: H01L24/09 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0913 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83464 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor chip to the junction plane of a chip junction portion such as an island or a die pad. This semiconductor device includes a semiconductor chip and a chip junction portion having a junction plane that is bonded to the back surface of the semiconductor chip with a soldering material. The junction plane is smaller in size than the back surface of the semiconductor chip. This semiconductor device may further include a plurality of extending portions which extend respectively from the periphery of the junction plane to directions parallel with the junction plane.

Abstract translation: 即使使用焊接材料将半导体芯片的背面接合到诸如岛或芯片焊盘的芯片接合部的接合面，半导体器件也可以防止半导体芯片的损坏。 该半导体器件包括半导体芯片和芯片接合部分，其具有用焊接材料结合到半导体芯片的背面的结面。 接合面的尺寸小于半导体芯片的背面。 该半导体器件还可以包括多个延伸部分，这些延伸部分分别从接合面的周边延伸到与接合平面平行的方向。

公开(公告)号：US20240282676A1

公开(公告)日：2024-08-22

申请号：US18649331

申请日：2024-04-29

Applicant: Rohm Co., Ltd.

Inventor： Ryotaro KAKIZAKI ,  Yasumasa KASUYA ,  Koshun SAITO

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49513 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48245 ,  H01L2924/13091

Abstract: A semiconductor device includes a semiconductor element, a lead and a sealing resin. The lead includes a die pad and terminal. The die pad includes a lead obverse surface facing a first side in a thickness direction for mounting the semiconductor element, and a lead reverse surface facing a second side in the thickness direction. The sealing resin includes a first resin surface facing the first side in the thickness direction, a second resin surface facing the second side in the thickness direction, and a third resin surface facing a first side in a first direction orthogonal to the thickness direction. The sealing covers resin the semiconductor element and a part of the die pad. The lead reverse surface includes a portion exposed from the second resin surface and located on the first side in the first direction from the third resin surface as viewed in the thickness direction.

公开(公告)号：US20230298981A1

公开(公告)日：2023-09-21

申请号：US18324424

申请日：2023-05-26

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L23/64

CPC classification number: H01L23/49575 ,  H01L21/56 ,  H01L24/49 ,  H01L23/49503 ,  H01L23/49531 ,  H01L24/85 ,  H01L21/48 ,  H01L24/06 ,  H01L23/645 ,  H01L23/49537 ,  H01L23/4952 ,  H01L23/49517 ,  H01L24/45 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2224/78301 ,  H01L23/3107

Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.

公开(公告)号：US20220310491A1

公开(公告)日：2022-09-29

申请号：US17596414

申请日：2020-06-25

Applicant: ROHM CO., LTD.

Inventor： Toshiro TSUCHIYAMA ,  Yasumasa KASUYA ,  Tatsuo YAMAZAKI

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

Abstract: An electronic device includes: an electronic element having an element obverse surface and an element reverse surface spaced apart from each other in a first direction, the element obverse surface being provided with an obverse-surface electrode; a resin member having a resin reverse surface facing in a same direction as the element reverse surface, the resin member covering the electronic element; and an electrically conductive member supporting the electronic element and electrically connected to the electronic element. The electrically conductive member has a first exposed region, a second exposed region and a third exposed region each of which is exposed from the resin reverse surface. The resin member has a first resin side surface and a second resin side surface connected to each other and standing up from the resin reverse surface. As viewed in the first direction, the first exposed region is located at a corner portion where the first resin side surface and the second resin side surface are connected. As viewed in the first direction, the second exposed region is located side by side with the first exposed region in a second direction extending along the first resin side surface. The third exposed region is located between the first exposed region and the second exposed region in the second direction. As viewed in the first direction, the third exposed region has a larger area than each of the first exposed region and the second exposed region.

公开(公告)号：US20220028763A1

公开(公告)日：2022-01-27

申请号：US17499018

申请日：2021-10-12

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/18

Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.

公开(公告)号：US20200066619A1

公开(公告)日：2020-02-27

申请号：US16671699

申请日：2019-11-01

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.