公开(公告)号：US07459055B2

公开(公告)日：2008-12-02

申请号：US11549655

申请日：2006-10-16

Applicant: Su-Tsai Lu ,  Shu-Ming Chang ,  Shyh-Ming Chang ,  Yao-Sheng Lin ,  Yuan-Chang Huang

Inventor： Su-Tsai Lu ,  Shu-Ming Chang ,  Shyh-Ming Chang ,  Yao-Sheng Lin ,  Yuan-Chang Huang

IPC: B29C65/00 ,  B32B37/00 ,  B32B38/00 ,  B32B7/14 ,  H01L21/44 ,  H05K1/03 ,  H05K1/09 ,  H05K1/02 ,  H05K1/16 ,  H05K1/11 ,  H01R12/04

CPC classification number: H01L24/13 ,  H01L21/56 ,  H01L24/06 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06515 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14515 ,  H01L2224/29036 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2224/83894 ,  H01L2225/06513 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/3011 ,  Y10T29/49126 ,  H01L2924/014 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the metal pads, a buffer layer coated on the protection layer and the metal pads, a first metal layer covered on the buffer layer, and a second substrate with electrodes and a bonding layer thereon. The first metal layer, the electrodes and the bonding layer are bonded to form the bonding structure. Direct bonding can be performed through surface activation or heat pressure. The method uses fewer steps and is more reliable. The temperature required for bonding the structure is lower. The bonding density between the contacted surfaces is increased to a fine pitch. The quality at the bonding points is increased because fewer contaminations between the contacted surfaces are generated.

Abstract translation: 提供具有缓冲层的接合结构及其形成方法。 接合结构包括其上具有金属焊盘的第一衬底，覆盖在衬底表面上的保护层，形成在金属焊盘上的第一粘合金属层，涂覆在保护层上的缓冲层和金属焊盘，第一金属 覆盖在缓冲层上的第二基板和其上具有电极和接合层的第二基板。 第一金属层，电极和接合层被接合以形成接合结构。 可以通过表面活化或热压直接粘合。 该方法使用较少的步骤并且更可靠。 粘结结构所需的温度较低。 接触表面之间的结合密度增加到细间距。 增加接合点的质量，因为产生了接触表面之间的较少的污染物。

公开(公告)号：US07446421B2

公开(公告)日：2008-11-04

申请号：US11619612

申请日：2007-01-04

Applicant: Su-Tsai Lu ,  Shu-Ming Chang ,  Shyh-Ming Chang ,  Yao-Sheng Lin ,  Yuan-Chang Huang

Inventor： Su-Tsai Lu ,  Shu-Ming Chang ,  Shyh-Ming Chang ,  Yao-Sheng Lin ,  Yuan-Chang Huang

IPC: H01L23/48 ,  H05K1/11

CPC classification number: B32B15/08 ,  B32B7/12 ,  B32B9/005 ,  B32B15/20 ,  B32B27/281 ,  B32B27/283 ,  B32B2457/08 ,  B32B2457/14 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/8123 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3011 ,  Y10T428/24917 ,  Y10T428/31667 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the metal pads, a buffer layer coated on the protection layer and the metal pads, a first metal layer covered on the buffer layer, and a second substrate with electrodes and a bonding layer thereon. The first metal layer, the electrodes and the bonding layer are bonded to form the bonding structure. Direct bonding can be performed through surface activation or heat pressure. The method uses fewer steps and is more reliable. The temperature required for bonding the structure is lower. The bonding density between the contacted surfaces is increased to a fine pitch. The quality at the bonding points is increased because fewer contaminations between the contacted surfaces are generated.

公开(公告)号：US07300865B2

公开(公告)日：2007-11-27

申请号：US11183590

申请日：2005-07-18

Applicant: Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

Inventor： Yu-Te Hsieh ,  Shyh-Ming Chang ,  Wen-Ti Lin

IPC: H01L24/4763 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/305 ,  H01L2224/13111 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a substrate that has bond pads formed on a top surface, wherein at least one of the IC chip and the substrate has dummy bumps formed in-between the bumps or the bond pads, and a non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.

Abstract translation: 通过非导电粘合剂粘合在一起的IC芯片/基板组件和用于形成组件的方法。 该组件由在有源表面上形成的凸块的IC芯片，具有形成在顶面上的接合焊盘的基板构成，其中IC芯片和基板中的至少一个具有形成在凸块之间或 接合焊盘和设置在IC芯片和基板之间的非导电粘合剂，其与与焊盘电连通的凸块面对面地连接在一起。

公开(公告)号：US20070111382A1

公开(公告)日：2007-05-17

申请号：US11644184

申请日：2006-12-22

Applicant: Yuan-Chang Huang ,  Shyh-Ming Chang ,  Su-Chia Lu

Inventor： Yuan-Chang Huang ,  Shyh-Ming Chang ,  Su-Chia Lu

IPC: H01L21/00

CPC classification number: H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05026 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/05099

Abstract: A microelectronic structure having a substrate of multiple conductive bumps for contact with bond pads on an electronic substrate in the fabrication of a flip chip electronic assembly. Each of the conductive bumps includes a conductive layer which is absent from at least one sidewall of the bump to prevent the inadvertent formation of a short-circuiting electrical path between adjacent conductive bumps in the electronic assembly.

Abstract translation: 一种微电子结构，其具有多个导电凸块的基板，用于在倒装芯片电子组件的制造中与电子基板上的接合焊盘接触。 每个导电凸块包括导体层，该导电层不存在于凸起的至少一个侧壁中，以防止电子组件中相邻的导电凸块之间的短路电路无意形成。

公开(公告)号：US20050098901A1

公开(公告)日：2005-05-12

申请号：US10829115

申请日：2004-04-20

Applicant: Shyh-Ming Chang ,  Yuan-Chang Huang ,  Wen-Chih Chen ,  Sheng-Shu Yang

Inventor： Shyh-Ming Chang ,  Yuan-Chang Huang ,  Wen-Chih Chen ,  Sheng-Shu Yang

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/30 ,  H05K3/32 ,  H01L23/48

CPC classification number: H05K3/325 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/10135 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1357 ,  H01L2224/1411 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2201/2036 ,  H05K2203/1189 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00

Abstract: The invention provides a bonding structure with compliant bumps, and also includes a stopper structure and a protection layer. Compliant bumps include at least a polymer bump, a metal layer and a surface conductive layer. Both the stopper structure and protection layer are formed with polymer bumps and metal layer. Compliant bumps provide bonding pad and conductive channel. Stoppers are used to prevent compliant bumps from crushing for overpressure in bonding process. The protection layer provides functions of grounding and shielding. The stoppers can be outside or connected with the compliant bumps. The protection layer is lower then the stopper structure and compliant bumps. It can be separated or connected with stoppers.

Abstract translation: 本发明提供一种具有柔性凸块的接合结构，并且还包括止动结构和保护层。 合适的凸块包括至少聚合物凸块，金属层和表面导电层。 阻挡结构和保护层均由聚合物凸块和金属层形成。 符合凸块提供焊盘和导电通道。 止动器用于防止在接合过程中顺应性的颠簸破碎超压。 保护层提供接地和屏蔽功能。 止动器可以在外部或与顺应性凸块连接。 保护层低于止动器结构和顺应性凸块。 它可以与塞子分离或连接。

公开(公告)号：US06537854B1

公开(公告)日：2003-03-25

申请号：US09317307

申请日：1999-05-24

Applicant: Shyh-Ming Chang ,  Jwo-Huei Jou ,  Chi-Yuan Wu

Inventor： Shyh-Ming Chang ,  Jwo-Huei Jou ,  Chi-Yuan Wu

IPC: H01L2144

CPC classification number: H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05567 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/13019 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13171 ,  H01L2224/13184 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: A method for bonding an IC chip formed with corrugated, multi-layered bumps to conductive elements on a substrate and devices formed by such method are disclosed. In the method, multi-layered bumps are formed by a cover layer of a conductive metal deposited on a base layer of a compliant material. The exposed bonding surface of the bump is formed in a corrugated fashion, or in a serrated shape with saw-tooth configurations. The saw-tooth configurations may either be rectangular or triangular. In the bonding method, instead of using an anisotropic conductive film loaded with conductive particles, a solid adhesive film without conductive particles or a liquid adhesive material without conductive particles can be utilized. The serrated bonding surface of the bumps is effective in expelling the adhesive material from the bonding interface between the bumps and the conductive elements such that a low resistance bond can be formed between an IC chip and a substrate. The solid adhesive layer or the liquid adhesive material, after bonding and curing, functions effectively as a moisture barrier layer.

Abstract translation: 公开了一种用于将形成有波纹状多层凸起的IC芯片与基板上的导电元件和由该方法形成的器件接合的方法。 在该方法中，多层凸起由沉积在柔性材料的基底层上的导电金属的覆盖层形成。 凸起的暴露的接合表面以波纹形式形成，或者具有锯齿形状的锯齿状形状。 锯齿配置可以是矩形或三角形。 在接合方法中，代替使用负载有导电颗粒的各向异性导电膜，可以使用不具有导电颗粒的固体粘合剂膜或不具有导电颗粒的液体粘合剂材料。 凸块的锯齿状接合面有效地将粘合剂材料从凸块和导电元件之间的结合界面排出，使得可以在IC芯片和基板之间形成低电阻结合。 粘合和固化后的固体粘合剂层或液体粘合剂材料有效地用作防潮层。

公开(公告)号：US6084301A

公开(公告)日：2000-07-04

申请号：US950376

申请日：1997-10-14

Applicant: Shyh-Ming Chang ,  Yu-Chi Lee ,  Jwo-Huei Jou

Inventor： Shyh-Ming Chang ,  Yu-Chi Lee ,  Jwo-Huei Jou

IPC: H01L21/60 ,  H01L23/485 ,  H01L29/43 ,  H01L23/50

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11901 ,  H01L2224/13019 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/13609 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: A composite bump structure and methods of forming the composite bump structure. The composite bump structure comprises a polymer body of relatively low Young's Modulus compared to metals covered by a conductive metal coating formed at the input/output pads of an integrated circuit element or substrate. The composite bump is formed using material deposition, lithography, and etching techniques. A layer of soldering metal can be formed on the composite bumps if this is desired for subsequent processing. A base metal pad covering the integrated circuit element input/output pad can be used to provide added flexibility in location of the composite bump. The composite bump can be formed directly on the input/output pad or on the base metal pad.

Abstract translation: 复合凸块结构和形成复合凸块结构的方法。 与由在集成电路元件或衬底的输入/输出焊盘处形成的导电金属涂层覆盖的金属相比，复合凸块结构包括相对低的杨氏模量的聚合物体。 使用材料沉积，光刻和蚀刻技术形成复合凸块。 如果需要后续处理，可以在复合凸块上形成一层焊接金属。 可以使用覆盖集成电路元件输入/输出垫的基底金属垫来提供复合凸块的位置的增加的灵活性。 复合凸块可以直接形成在输入/输出垫或基底金属垫上。

公开(公告)号：US5127573A

公开(公告)日：1992-07-07

申请号：US703873

申请日：1991-05-22

Applicant: Shyh-Ming Chang ,  Jen-Huang Jeng

Inventor： Shyh-Ming Chang ,  Jen-Huang Jeng

IPC: B29C65/00 ,  H01L21/00

CPC classification number: H01L21/67132 ,  B29C66/8163

Abstract: An improveent in a Tape Automated Bonding (TAB) apparatus wherein a support for the device being bonded to a tape, or film carrier, is provided that will automatically adjust the position of the device supported thereon to conform to the bonding surface of the thermode. The support of the invention has a central member that provides for swivelling and a second member that prevents relative rotation.

Abstract translation: 磁带自动接合（TAB）设备的改进在于其中提供了粘合到带或胶片载体上的装置的支撑件，其将自动地调节支撑在其上的装置的位置以符合热敏电极的接合表面。 本发明的支撑件具有提供旋转的中心构件和防止相对旋转的第二构件。

公开(公告)号：US08215969B2

公开(公告)日：2012-07-10

申请号：US12144658

申请日：2008-06-24

Applicant: Sheng-Shu Yang ,  Shyh-Ming Chang

Inventor： Sheng-Shu Yang ,  Shyh-Ming Chang

IPC: H01R4/58

CPC classification number: H05K3/4007 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05567 ,  H01L2224/1147 ,  H01L2224/13007 ,  H01L2224/13008 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13078 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/13563 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/1401 ,  H01L2224/1411 ,  H01L2224/1415 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/9211 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2924/15788 ,  H01R12/714 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/0367 ,  H05K2201/09909 ,  Y10S439/931 ,  Y10T29/49155 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A contact structure disposed on a substrate is provided. The contact structure includes a pad, a polymer bump and a conductive layer. The pad is on the substrate. The polymer bump having a curve surface and a steep surface connecting with the curve surface is disposed on the substrate. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.

Abstract translation: 设置在基板上的接触结构。 接触结构包括垫，聚合物凸块和导电层。 衬垫在衬底上。 具有弯曲表面和与曲面连接的陡峭表面的聚合物凸块设置在基板上。 聚合物凸块被导电层覆盖，并且导电层与焊盘电连接。

公开(公告)号：US20090243093A1

公开(公告)日：2009-10-01

申请号：US12366629

申请日：2009-02-05

Applicant: Shyh-Ming Chang

Inventor： Shyh-Ming Chang

IPC: H01L23/48

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/15788 ,  H05K1/111 ,  H05K1/114 ,  H05K3/244 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  Y02P70/611 ,  H01L2924/00

Abstract: A contact structure disposed on a substrate is provided. The contact structure includes at least one pad, at least one polymer bump and at least one conductive layer. The pad is disposed on the substrate and the polymer bump is disposed on the substrate. The polymer bump has a curved surface having a plurality of concave-convex structures. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.

Abstract translation: 设置在基板上的接触结构。 接触结构包括至少一个焊盘，至少一个聚合物凸块和至少一个导电层。 衬垫设置在衬底上，并且聚合物凸块设置在衬底上。 聚合物凸块具有具有多个凹凸结构的曲面。 聚合物凸块被导电层覆盖，并且导电层与焊盘电连接。