公开(公告)号：US20140054077A1

公开(公告)日：2014-02-27

申请号：US13994253

申请日：2012-10-18

Applicant: Panasonic Corporation

Inventor： Masanori Minamio ,  Hiroki Ikeuchi

IPC: H05K1/03

CPC classification number: H05K1/0306 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/4275 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49575 ,  H01L23/49822 ,  H01L23/49861 ,  H01L23/49894 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0224 ,  H05K1/0256 ,  H05K1/0373 ,  H05K1/186 ,  H05K3/284 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0227 ,  H05K2201/0376 ,  H05K2201/0723 ,  H05K2201/1056 ,  H05K2201/10969 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.

Abstract translation: 半导体器件是包括用第一树脂6模制的半导体元件T1的树脂封装结构。第一树脂6包含填充物7，填充物7包括用相变材料包围的电绝缘胶囊，其吸收周围热量和相变 以提高介电强度。 填料7的效果达到具有令人满意的散热和高耐受电压的结构。

公开(公告)号：US08449143B2

公开(公告)日：2013-05-28

申请号：US12600377

申请日：2008-05-14

Applicant: Takeshi Miyakawa ,  Kenji Miyata ,  Taiki Nishi ,  Yoshihiko Okajima

Inventor： Takeshi Miyakawa ,  Kenji Miyata ,  Taiki Nishi ,  Yoshihiko Okajima

IPC: F21V7/00

CPC classification number: H05K1/0274 ,  H01L33/60 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0266 ,  H05K2201/0338 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: Provided is a metal base circuit board having a new function of a light reflection in addition to the conventional printed circuit board function for mounting electronic parts. The metal base circuit board has a circuit arranged on a metal plate via an insulation layer. A white film is arranged at least one the insulation layer.

Abstract translation: 提供除了用于安装电子部件的常规印刷电路板功能之外，还具有具有光反射的新功能的金属基底电路板。 金属基电路板具有通过绝缘层设置在金属板上的电路。 绝缘层至少布置有白色膜。

公开(公告)号：US20180168036A1

公开(公告)日：2018-06-14

申请号：US15878398

申请日：2018-01-23

Applicant: Sierra Circuits, Inc.

Inventor： Kenneth S. BAHL ,  Konstantine KARAVAKIS

IPC: H05K1/03 ,  H05K3/18 ,  H05K3/46 ,  H05K3/42 ,  H05K3/38 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/0313 ,  H05K1/0296 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/09 ,  H05K1/115 ,  H05K3/18 ,  H05K3/181 ,  H05K3/182 ,  H05K3/387 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4632 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0242 ,  H05K2201/0376 ,  H05K2203/0716

Abstract: A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.

公开(公告)号：US09832870B2

公开(公告)日：2017-11-28

申请号：US14407190

申请日：2013-06-06

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Hiroaki Kobayashi ,  Masanobu Sogame ,  Kentaro Nomizu ,  Yoshinori Mabuchi ,  Yoshihiro Kato

IPC: B32B3/10 ,  H05K1/03 ,  C08J5/24 ,  C08L63/00 ,  C08G59/40 ,  B32B15/14 ,  B32B15/20 ,  C08K9/02 ,  B32B5/02 ,  H05K1/05 ,  C08K3/14

CPC classification number: H05K1/0366 ,  B32B5/022 ,  B32B5/024 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2307/5825 ,  B32B2307/726 ,  B32B2457/08 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/02 ,  C08J2363/04 ,  C08K3/14 ,  C08K9/02 ,  C08L63/00 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0227 ,  Y10T428/24893 ,  Y10T442/2721 ,  Y10T442/3415 ,  Y10T442/3423 ,  Y10T442/656 ,  C08L79/04

Abstract: A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide.

公开(公告)号：US09706650B1

公开(公告)日：2017-07-11

申请号：US15240133

申请日：2016-08-18

Applicant: Sierra Circuits, Inc.

Inventor： Kenneth S. Bahl ,  Konstantine Karavakis

IPC: H05K1/03 ,  H05K3/18 ,  H05K1/02 ,  H05K1/09 ,  H05K3/42 ,  H05K3/46 ,  H05K1/11 ,  H05K3/38

CPC classification number: H05K1/0313 ,  H05K1/0296 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/09 ,  H05K1/115 ,  H05K3/18 ,  H05K3/181 ,  H05K3/182 ,  H05K3/387 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4632 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0242 ,  H05K2201/0376 ,  H05K2203/0716

Abstract: A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.

公开(公告)号：US09505914B2

公开(公告)日：2016-11-29

申请号：US14638474

申请日：2015-03-04

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang A Ju ,  Hyun Gu Im ,  Jae Man Park

IPC: C08K9/06 ,  C08K9/02 ,  C08K3/22

CPC classification number: C08K9/06 ,  B05D3/0254 ,  C08K3/22 ,  C08K3/38 ,  C08K9/02 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2003/385 ,  H01L33/641 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0227 ,  C08L63/00

Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.

Abstract translation: 根据本发明的一个实施方案的无机填料包括氮化硼附聚物和形成在氮化硼附聚物上并包含-Si-R-NH 2基团的涂层，R选自具有 1至3个碳原子，具有2至3个碳原子的烯烃基和具有2至3个碳原子的炔基。

公开(公告)号：US09206308B2

公开(公告)日：2015-12-08

申请号：US13637629

申请日：2011-03-22

Applicant: Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

Inventor： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

IPC: H05K1/03 ,  B32B27/04 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  C08K3/10 ,  C08K3/22 ,  C08L63/00 ,  C08G59/22 ,  C08G59/30 ,  C08G59/38 ,  C08G59/62 ,  C08G59/40 ,  C08J5/24 ,  C08K9/02 ,  C08K5/5313 ,  C08K5/5397

CPC classification number: C08L63/00 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/10 ,  C08K3/22 ,  C08K5/5313 ,  C08K5/5397 ,  C08K9/02 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0263

Abstract: The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

Abstract translation: 本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有 必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团 环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚度优异，孔位精度优异 在燃烧时不产生有害物质，使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。

公开(公告)号：US20150181707A1

公开(公告)日：2015-06-25

申请号：US14407190

申请日：2013-06-06

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Hiroaki Kobayashi ,  Masanobu Sogame ,  Kentaro Nonizu ,  Yoshinori Mabuchi ,  Yoshihiro Kato

IPC: H05K1/03 ,  B32B15/14 ,  B32B5/02 ,  H05K1/05

CPC classification number: H05K1/0366 ,  B32B5/022 ,  B32B5/024 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2307/5825 ,  B32B2307/726 ,  B32B2457/08 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/02 ,  C08J2363/04 ,  C08K3/14 ,  C08K9/02 ,  C08L63/00 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0227 ,  Y10T428/24893 ,  Y10T442/2721 ,  Y10T442/3415 ,  Y10T442/3423 ,  Y10T442/656 ,  C08L79/04

Abstract: A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide.

Abstract translation: 提供能够实现散热性，吸水性，铜箔剥离强度和吸湿后的耐热性优异的印刷线路板等的树脂组合物。 还提供了使用树脂组合物的预浸料坯，层压板，覆金属箔层压板，印刷线路板等。 至少具有环氧树脂，氰酸酯化合物和无机填料的本发明的树脂组合物，其中所述无机填料至少包括具有表面的至少一部分的碳化硅粉末的经表面处理的碳化硅 用无机氧化物处理。

公开(公告)号：US20140290994A1

公开(公告)日：2014-10-02

申请号：US13963807

申请日：2013-08-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ki Seok Kim ,  Ji Hye Shim ,  Hwa Young Lee ,  Joon Ho Bae

IPC: C09C1/30 ,  H05K1/03 ,  H05K1/11 ,  C08K9/06

CPC classification number: C09C1/3081 ,  C08K9/02 ,  C09C1/027 ,  C09C1/028 ,  C09C1/28 ,  C09C1/3045 ,  C09C1/3054 ,  C09C1/309 ,  C09C1/36 ,  C09C1/3653 ,  C09C1/3661 ,  C09C1/3684 ,  C09C1/3692 ,  C09C1/407 ,  C09C1/42 ,  C09C3/006 ,  C09C3/043 ,  C09C3/06 ,  C09C3/063 ,  C09C3/12 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/12105 ,  H05K1/0326 ,  H05K1/0373 ,  H05K1/185 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0227 ,  C08L63/00

Abstract: Disclosed herein is a method of preparing a surface-modified inorganic filler, comprising the steps of: drying an inorganic filler; treating the inorganic filler with fluorine-containing gas to bond fluorine (F) to a part of the surface of the inorganic filler; and bonding a functional group-bonded silane coupling agent to another part of the surface of the inorganic filler, this other part of the surface thereof being not bonded with fluorine.

Abstract translation: 本文公开了一种制备表面改性无机填料的方法，包括以下步骤：干燥无机填料; 用含氟气体处理无机填料以将氟（F）与无机填料表面的一部分结合; 并且将官能团键合的硅烷偶联剂粘合到无机填料表面的另一部分，其表面的另一部分不与氟键合。

公开(公告)号：US20100164362A1

公开(公告)日：2010-07-01

申请号：US12600377

申请日：2008-05-14

Applicant: Takeshi Miyakawa ,  Kenji Miyata ,  Taiki Nishi ,  Yoshihiko Okajima

Inventor： Takeshi Miyakawa ,  Kenji Miyata ,  Taiki Nishi ,  Yoshihiko Okajima

IPC: H01J1/66 ,  H05K1/03

CPC classification number: H05K1/0274 ,  H01L33/60 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0266 ,  H05K2201/0338 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: Provided is a metal base circuit board having a new function of a light reflection in addition to the conventional printed circuit board function for mounting electronic parts. The metal base circuit board has a circuit arranged on a metal plate via an insulation layer. A white film is arranged at least one the insulation layer.

Abstract translation: 提供除了用于安装电子部件的常规印刷电路板功能之外，还具有具有光反射的新功能的金属基底电路板。 金属基电路板具有通过绝缘层设置在金属板上的电路。 绝缘层至少布置有白色膜。