公开(公告)号：US08642287B2

公开(公告)日：2014-02-04

申请号：US12532992

申请日：2007-07-25

Applicant: Lei Wang ,  Keith Mitchelson ,  He Wang ,  Jing Cheng

Inventor： Lei Wang ,  Keith Mitchelson ,  He Wang ,  Jing Cheng

IPC: C12Q1/02 ,  C12M1/34 ,  G06F7/60 ,  G06F17/50 ,  G01R27/08

CPC classification number: G01N27/06 ,  G01N27/221 ,  G01N33/48707 ,  G01N33/48728 ,  G01N33/5438

Abstract: Methods and apparatus for designing and measuring a cell-electrode impedance sensor to detect chemical and biological samples, including biological cells. The method of designing a cell-electrode impedance sensor comprises: determining a cell free cell-electrode impedance and a cell-covered cell-electrode impedance; obtaining a sensor sensitivity of the cell-electrode impedance measurement system; and choosing one or more design parameters of the cell-electrode impedance sensor to maximize the sensor sensitivity. When the frequency of AC signal between electrodes ranges from 10 kHz to 40 kHz, the sensitivity of the sensor is maximized.

Abstract translation: 用于设计和测量细胞电极阻抗传感器以检测包括生物细胞在内的化学和生物样品的方法和装置。 设计电池电极阻抗传感器的方法包括：确定无电池的电池 - 电极阻抗和电池覆盖的电池 - 电极阻抗; 获得电池电极阻抗测量系统的传感器灵敏度; 并选择电池电极阻抗传感器的一个或多个设计参数以最大化传感器灵敏度。 当电极间交流信号的频率范围为10 kHz至40 kHz时，传感器的灵敏度最大化。

公开(公告)号：US20130244346A1

公开(公告)日：2013-09-19

申请号：US13420383

申请日：2012-03-14

Applicant: Chien Rhone Wang ,  Chih-Wei Lai ,  Chih-Chiang Chang ,  Kewei Zuo ,  Jing-Cheng Lin

Inventor： Chien Rhone Wang ,  Chih-Wei Lai ,  Chih-Chiang Chang ,  Kewei Zuo ,  Jing-Cheng Lin

IPC: H01L21/66 ,  G06F17/00

CPC classification number: G06F17/00 ,  H01L22/12 ,  H01L22/20 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Packaging methods, material dispensing methods and apparatuses, and automatic measurement systems are disclosed. In one embodiment, a method of packaging semiconductor devices includes coupling a second die to a top surface of a first die, dispensing a first amount of underfill material between the first die and the second die, and capturing an image of the underfill material. Based on the image captured, a second amount or no additional amount of underfill material is dispensed between the first die and the second die.

Abstract translation: 公开了包装方法，材料分配方法和装置以及自动测量系统。 在一个实施例中，包装半导体器件的方法包括将第二管芯耦合到第一管芯的顶表面，在第一管芯和第二管芯之间分配第一量的底部填充材料，以及捕获底部填充材料的图像。 基于所捕获的图像，在第一模具和第二模具之间分配第二量或不需要额外量的底部填充材料。

公开(公告)号：US20130233601A1

公开(公告)日：2013-09-12

申请号：US13412958

申请日：2012-03-06

Applicant: Chin-Fu KAO ,  Wen-Chih Chiou ,  Jing-Cheng Lin ,  Cheng-Lin Huang ,  Po-Hao Tsai

Inventor： Chin-Fu KAO ,  Wen-Chih Chiou ,  Jing-Cheng Lin ,  Cheng-Lin Huang ,  Po-Hao Tsai

IPC: H05K1/09 ,  H05K1/00

CPC classification number: H01L24/14 ,  H01L22/32 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/14515 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/014

Abstract: A surface metal wiring structure for a substrate includes one or more functional μbumps formed of a first metal and an electrical test pad formed of a second metal for receiving an electrical test probe and electrically connected to the one or more functional μbumps. The surface metal wiring structure also includes a plurality of sacrificial μbumps formed of the first metal that are electrically connected to the electrical test pads, where the sacrificial μbumps are positioned closer to the electrical test pad than the one or more functional μbumps.

Abstract translation: 用于基板的表面金属布线结构包括由第一金属形成的一个或多个功能性微片和由用于接收电测试探针的第二金属形成的电测试焊盘，并电连接到所述一个或多个功能性微波。 表面金属布线结构还包括多个由第一金属形成的牺牲片，其电连接到电测试焊盘，其中牺牲微片比一个或多个功能性微片更靠近电测试垫定位。

公开(公告)号：US20130203215A1

公开(公告)日：2013-08-08

申请号：US13369083

申请日：2012-02-08

Applicant: Jui-Pin Hung ,  Jing-Cheng Lin

Inventor： Jui-Pin Hung ,  Jing-Cheng Lin

IPC: H01L21/56

CPC classification number: H01L24/97 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/563 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/3185 ,  H01L24/11 ,  H01L24/19 ,  H01L24/94 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/92224 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/83

Abstract: Methods of packaging semiconductor devices are disclosed. In one embodiment, a packaging method for semiconductor devices includes providing a workpiece including a plurality of first dies, and coupling a plurality of second dies to the plurality of first dies. The plurality of second dies and the plurality of first dies are partially packaged and separated. Top surfaces of the second dies are coupled to a carrier, and the partially packaged plurality of second dies and plurality of first dies are fully packaged. The carrier is removed, and the fully packaged plurality of second dies and plurality of first dies are separated.

公开(公告)号：US08500182B2

公开(公告)日：2013-08-06

申请号：US12818022

申请日：2010-06-17

Applicant: Ku-Feng Yang ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Chen-Hua Yu

Inventor： Ku-Feng Yang ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Chen-Hua Yu

IPC: B25J15/00

CPC classification number: H01L21/67346 ,  H01L21/6838 ,  H01L21/68785

Abstract: An apparatus for supporting a wafer includes a base, and a gas-penetration layer. The gas-penetration layer and a portion of the base directly underlying the gas-penetration layer form a gas passage therebetween. The gas passage is configured to be sealed by the wafer placed directly over the gas-penetration layer. The apparatus further includes a valve connected to the gas passage.

Abstract translation: 用于支撑晶片的装置包括基座和气体穿透层。 气体渗透层和直接位于气体穿透层下方的基底的一部分在它们之间形成气体通道。 气体通道被直接设置在气体穿透层上方的晶片密封。 该装置还包括连接到气体通道的阀。

公开(公告)号：US20130187258A1

公开(公告)日：2013-07-25

申请号：US13356173

申请日：2012-01-23

Applicant: Szu Wei Lu ,  Ying-Da Wang ,  Li-Chung Kuo ,  Jing-Cheng Lin

Inventor： Szu Wei Lu ,  Ying-Da Wang ,  Li-Chung Kuo ,  Jing-Cheng Lin

IPC: H01L27/06 ,  H01L21/78

CPC classification number: H01L25/0655 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3135 ,  H01L23/3178 ,  H01L23/3185 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/11464 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92125 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/10156 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A method includes bonding a first and a second package component on a top surface of a third package component, and dispensing a polymer. The polymer includes a first portion in a space between the first and the third package components, a second portion in a space between the second and the third package components, and a third portion in a gap between the first and the second package components. A curing step is then performed on the polymer. After the curing step, the third portion of the polymer is sawed to form a trench between the first and the second package components.

Abstract translation: 一种方法包括将第一和第二包装部件接合在第三包装部件的顶表面上，并分配聚合物。 聚合物包括在第一和第三包装部件之间的空间中的第一部分，在第二和第三包装部件之间的空间中的第二部分和第一和第二包装部件之间的间隙中的第三部分。 然后在聚合物上进行固化步骤。 在固化步骤之后，将聚合物的第三部分锯切以在第一和第二包装部件之间形成沟槽。

公开(公告)号：US08489539B2

公开(公告)日：2013-07-16

申请号：US12893447

申请日：2010-09-29

Applicant: Denise M. DiCanio ,  Arlette Palo ,  Jing Cheng ,  Rose Marie Sparacio ,  Julie A. Hidalgo ,  Eric G. Yovine

Inventor： Denise M. DiCanio ,  Arlette Palo ,  Jing Cheng ,  Rose Marie Sparacio ,  Julie A. Hidalgo ,  Eric G. Yovine

IPC: G06F17/00 ,  G06N5/04

CPC classification number: G16H50/20 ,  G06F19/00 ,  G16H10/20

Abstract: Computer-aided systems and methods are provided for determining the skin composition of a specific user according to Traditional Chinese Medicinal (TCM) principles by statistically analyzing biological and/or psychological information collected from such user, such as age, gender, bodily sensation, skin condition and complexion, sleep pattern, dietary habits, energy level, stress level, physical fitness and emotional wellness, so as to classify the skin composition of the user according to TCM principles but without employing a TCM practitioner. Preferably, the skin composition classification is indicative of Yin-Yang balance of the skin of the user or the lack thereof. The present systems and methods may further recommend to the user one or more topical skin care regimens and/or ingestible skin benefit products suitable for the skin composition of the specific user.

Abstract translation: 提供计算机辅助系统和方法，通过统计分析从这样的用户收集的生物和/或心理信息，如年龄，性别，身体感觉，皮肤，根据中医药（TCM）原理确定特定用户的皮肤组成 条件和肤色，睡眠模式，饮食习惯，能量水平，压力水平，身体健康和情绪健康，以根据中医原理对用户的皮肤组成进行分类，但不使用中医从业人员。 优选地，皮肤组合物分类表示使用者的皮肤的阴阳平衡或其缺乏。 本系统和方法可以进一步向使用者推荐适合于特定用户的皮肤组合物的一种或多种局部皮肤护理方案和/或可摄取的皮肤益处产品。

公开(公告)号：US08455995B2

公开(公告)日：2013-06-04

申请号：US12762085

申请日：2010-04-16

Applicant: Po-Hao Tsai ,  Jing-Cheng Lin ,  Chen-Hua Yu

Inventor： Po-Hao Tsai ,  Jing-Cheng Lin ,  Chen-Hua Yu

IPC: H01L23/04

CPC classification number: H01L23/3121 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/00 ,  H01L2224/81805

Abstract: A device includes an interposer including a substrate having a top surface and a bottom surface. A plurality of through-substrate vias (TSVs) penetrates through the substrate. The plurality of TSVs includes a first TSV having a first length and a first horizontal dimension, and a second TSV having a second length different from the first length, and a second horizontal dimension different from the first horizontal dimension. An interconnect structure is formed overlying the top surface of the substrate and electrically coupled to the plurality of TSVs.

Abstract translation: 一种器件包括具有顶表面和底表面的衬底的插入器。 多个穿通基板通孔（TSV）穿过基板。 多个TSV包括具有第一长度和第一水平尺寸的第一TSV和具有不同于第一长度的第二长度的第二TSV和与第一水平尺寸不同的第二水平尺寸。 互连结构形成在衬底的顶表面上并电耦合到多个TSV。

公开(公告)号：US20130134581A1

公开(公告)日：2013-05-30

申请号：US13308162

申请日：2011-11-30

Applicant: Jing-Cheng LIN ,  Po-Hao TSAI

Inventor： Jing-Cheng LIN ,  Po-Hao TSAI

IPC: H01L23/498 ,  H01L21/50 ,  H01L21/768

CPC classification number: H01L24/11 ,  H01L21/486 ,  H01L21/563 ,  H01L23/147 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05647 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/119 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1401 ,  H01L2224/1403 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2224/05552 ,  H01L2924/00

Abstract: The mechanisms for forming bump structures reduce variation of standoffs between chips and package substrates. By planarizing the solder layer on bump structures on chips and/or substrates after plating, the heights of bump structures are controlled to minimize variation due to within die and within wafer locations, pattern density, die size, and process variation. As a result, the standoffs between chips and substrates are controlled to be more uniform. Consequently, underfill quality is improved.

Abstract translation: 用于形成凸块结构的机构减少了芯片和封装衬底之间的间隙的变化。 通过在电镀后对芯片和/或基板上的凸块结构上的焊料层进行平坦化，可以控制凸块结构的高度，以最小化晶片内部以及晶片位置，图案密度，晶粒尺寸和工艺变化中的变化。 结果，芯片和基板之间的间隔被控制得更均匀。 因此，底部填充质量得到改善。

公开(公告)号：US20130119382A1

公开(公告)日：2013-05-16

申请号：US13297845

申请日：2011-11-16

Applicant: Chin-Fu Kao ,  Cheng-Lin Huang ,  Jing-Cheng Lin

Inventor： Chin-Fu Kao ,  Cheng-Lin Huang ,  Jing-Cheng Lin

IPC: H01L23/544 ,  H01L21/28

CPC classification number: H01L22/32

Abstract: A system and method for plating a contact is provided. An embodiment comprises forming protective layers over a contact and a test pad, and then selectively removing the protective layer over the contact without removing the protective layer over the test pad. With the protective layer still on the test pad, a conductive layer may be plated onto the contact without plating it onto the test pad. After the contact has been plated, the protective layer over the contact may be removed.

Abstract translation: 提供了一种用于电镀触点的系统和方法。 一个实施例包括在触点和测试垫上形成保护层，然后在触头上选择性地去除保护层，而不需要在测试垫上移除保护层。 在保护层仍在测试焊盘上的情况下，可以将导电层电镀到触点上，而不将其覆盖在测试焊盘上。 接触电镀后，触点上的保护层可以被去除。