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    Technique for removing defects from a layer of metal
    25.
    发明授权
    Technique for removing defects from a layer of metal 失效
    从金属层去除缺陷的技术

    公开(公告)号：US5893983A

    公开(公告)日：1999-04-13

    申请号：US758272

    申请日：1996-11-19

    申请人： John Joseph Konrad ,  Voya Rista Markovich ,  George Frederick Reel ,  Jose Antonio Rios ,  Timothy Leroy Wells ,  Michael Wozniak

    发明人： John Joseph Konrad ,  Voya Rista Markovich ,  George Frederick Reel ,  Jose Antonio Rios ,  Timothy Leroy Wells ,  Michael Wozniak

    IPC分类号： B24B7/06 ,  B24B37/04 ,  B24B41/047 ,  C23F1/08 ,  H05K3/06 ,  H05K3/26 ,  C23F1/02 ,  C23F1/44

    CPC分类号： C23F1/08 ,  B24B37/04 ,  B24B41/047 ,  B24B7/06 ,  H05K3/068 ,  H05K3/26 ,  H05K2203/025 ,  H05K2203/0346 ,  H05K2203/0353 ,  H05K2203/1509

    摘要： A technique for polishing an exposed surface of metal on a substrate to remove defects from mechanical working of metals, such as burrs and pigtails resulting from drilling, and defects from plating, such as nodules and depressions, is provided. The substrate has an exposed metal surface such as copper thereon which is to be treated to remove defects. A planarizing or polishing head, preferably a rotating roller, is provided which is continuously rotating with respect to the substrate, with the head in contact with the metal surface on the substrate. A chemical etchant, essentially free of abrasive material, is continuously supplied to the interface between the metal surface and the head. The treating and polishing continues until the defects have been removed or reduced to an acceptable value. In some instances where significant height reduction is required, thus requiring significant metal removal, several passes of the substrate may be required or a device with multiple heads may be used. The polishing head preferably includes a film having a layer of very fine grit embedded therein, such as 5.mu.-15.mu. silicon carbide (SiC).

    摘要翻译： 提供了用于抛光基板上的金属暴露表面以去除金属机械加工的缺陷的技术，例如钻孔引起的毛刺和辫子以及电镀缺陷，例如结节和凹陷。 基板具有暴露的金属表面，例如铜，其被处理以去除缺陷。 提供平面化或抛光头，优选为旋转辊，其相对于衬底连续旋转，头部与衬底上的金属表面接触。 基本上不含研磨材料的化学蚀刻剂被连续供应到金属表面和头部之间的界面。 继续进行处理和抛光，直到缺陷被去除或降低到可接受的值。 在需要显着降低高度的一些情况下，因此需要显着的金属去除，可能需要多次通过基底，或者可以使用具有多个头部的装置。 抛光头优选包括具有嵌入其中的非常细的砂粒层的膜，例如5-15微米的碳化硅（SiC）。