公开(公告)号：US09711387B2

公开(公告)日：2017-07-18

申请号：US15212962

申请日：2016-07-18

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L29/76 ,  H01L21/683 ,  H01L29/06 ,  H01L21/266 ,  B81C99/00 ,  B32B38/18 ,  H01L23/00 ,  H02N13/00 ,  H01L21/308 ,  H01L21/762 ,  H01L29/40 ,  H01L29/66 ,  H01L29/78 ,  H01L29/872

CPC classification number: H01L21/6833 ,  B32B38/18 ,  B81C99/002 ,  H01L21/266 ,  H01L21/3083 ,  H01L21/76264 ,  H01L24/75 ,  H01L29/06 ,  H01L29/0619 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/407 ,  H01L29/66143 ,  H01L29/66348 ,  H01L29/7806 ,  H01L29/7813 ,  H01L29/872 ,  H01L29/8725 ,  H01L2224/7598 ,  H01L2924/1461 ,  H02N13/00 ,  Y10T156/17

Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

公开(公告)号：US20170141091A1

公开(公告)日：2017-05-18

申请号：US15417015

申请日：2017-01-26

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: H01L25/16 ,  H01L31/0216 ,  G06F1/16 ,  H01L23/538 ,  H01L33/62 ,  H01L33/44 ,  H01L31/16 ,  H01L25/075

CPC classification number: H01L25/167 ,  G04G9/10 ,  G06F1/163 ,  G06F1/1652 ,  G06F3/0412 ,  G06F3/042 ,  G06F3/14 ,  G09G3/32 ,  G09G2380/02 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/0753 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10128 ,  H01L2924/00

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

公开(公告)号：US20160336484A1

公开(公告)日：2016-11-17

申请号：US15223900

申请日：2016-07-29

Applicant: Apple Inc.

Inventor： Kelly McGroddy ,  Hsin-Hua Hu ,  Andreas Bibl ,  Clayton Ka Tsun Chan ,  Daniel Arthur Haeger

IPC: H01L33/14 ,  H01L27/15 ,  H01L33/42 ,  H01L33/30 ,  H01L33/00 ,  H01L25/075 ,  H01L33/06

Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.

公开(公告)号：US09478583B2

公开(公告)日：2016-10-25

申请号：US14563772

申请日：2014-12-08

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Andreas Bibl

IPC: H01L27/15 ,  H01L33/62 ,  H01L51/00

CPC classification number: H01L25/0753 ,  H01L27/156 ,  H01L33/44 ,  H01L33/62 ,  H01L51/0097 ,  H01L2224/24 ,  H01L2251/5338 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y02E10/549 ,  Y02P70/521

Abstract: A conformable electronic device and methods for forming such devices are described. Embodiments of a conformable electronic device may include a silicon substrate having a thickness of 50 μm or less. An array of LEDs that are electrically coupled to a controller chip may be formed on a surface of the silicon substrate. In an embodiment, a top passivation layer is formed over the array of LEDs, the one or more controller chips, and the top surface of the silicon substrate. An embodiment also includes a bottom passivation layer formed on a bottom surface of the silicon substrate.

Abstract translation: 描述了适合的电子设备和用于形成这种设备的方法。 适应电子器件的实施例可以包括厚度为50μm或更小的硅衬底。 电耦合到控制器芯片的LED阵列可以形成在硅衬底的表面上。 在一个实施例中，顶部钝化层形成在LED阵列上，一个或多个控制器芯片和硅衬底的顶表面上。 实施例还包括形成在硅衬底的底表面上的底部钝化层。

公开(公告)号：US20160308103A1

公开(公告)日：2016-10-20

申请号：US15192936

申请日：2016-06-24

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Kevin K.C. Chang ,  Andreas Bibl

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/06 ,  H01L33/32 ,  H01L25/075 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/156 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/04 ,  H01L33/06 ,  H01L33/08 ,  H01L33/32 ,  H01L33/60 ,  H01L2224/83005 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.

公开(公告)号：US12131922B1

公开(公告)日：2024-10-29

申请号：US17089585

申请日：2020-11-04

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Patrick J. Czarnota ,  Paul A. Parks ,  Nile A. Light

IPC: H01L21/68 ,  B65G47/90 ,  H01L21/67 ,  H01L21/683 ,  B25J7/00 ,  B25J9/00 ,  B25J15/00

CPC classification number: H01L21/67144 ,  B65G47/90 ,  H01L21/68 ,  H01L21/681 ,  H01L21/6831 ,  B25J7/00 ,  B25J9/0015 ,  B25J15/0085

Abstract: A micro device transfer tool and methods of operation in which the micro device transfer tool includes an articulating transfer head assembly capable of six degrees of motion. A miniatured camera assembly may be secured near the point of contact for the articulating transfer head assembly to aid in system alignment. In an embodiment, an encoder system is included for alignment of a micro pick up array and target substrate using complementary concentric grating patterns. In an embodiment a miniaturized position sensor design is included for sensing position of various system components during alignment or pick and place processes.

公开(公告)号：US12094864B2

公开(公告)日：2024-09-17

申请号：US18315758

申请日：2023-05-11

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/075 ,  H01L27/02 ,  H01L27/12 ,  H01L33/00 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/48 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/12044 ,  H01L2924/00

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US20240234399A9

公开(公告)日：2024-07-11

申请号：US18494109

申请日：2023-10-25

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L23/31 ,  H01L25/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/00 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L21/56

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US11837179B2

公开(公告)日：2023-12-05

申请号：US17063371

申请日：2020-10-05

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Kelly McGroddy

IPC: G09G3/20 ,  G09G3/32 ,  H01L25/075 ,  H01L25/16 ,  G09G3/34 ,  G09G3/3233 ,  G09G3/3266 ,  G09G3/3216

CPC classification number: G09G3/3426 ,  G09G3/2088 ,  G09G3/32 ,  G09G3/3216 ,  G09G3/3233 ,  G09G3/3266 ,  H01L25/0753 ,  H01L25/167 ,  G09G2300/0828 ,  G09G2300/0842 ,  G09G2300/0857 ,  G09G2310/027 ,  G09G2310/08 ,  G09G2320/029 ,  G09G2330/028 ,  H01L2924/0002 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

公开(公告)号：US11107208B2

公开(公告)日：2021-08-31

申请号：US16581683

申请日：2019-09-24

Applicant: Apple Inc.

Inventor： Patrick J. Czarnota ,  Paul Argus Parks ,  Nile A. Light ,  Stephen P. Bathurst ,  John H. Higginson ,  Stephen R. Deming ,  Robert B. Martin ,  Tsan Y. Chan ,  Andreas Bibl

IPC: G06K9/00 ,  G06T7/00

Abstract: An optical verification method and mass transfer system described. In an embodiments, a mass transfer sequence may be accompanied by optical imaging and inspection to detect pick and place errors. The optical imaging and inspection techniques may be performed in-situ.