公开(公告)号：US20170077056A1

公开(公告)日：2017-03-16

申请号：US15116033

申请日：2015-02-03

Applicant: DEXERIALS CORPORATION

Inventor： Reiji TSUKAO ,  Yasushi AKUTSU

IPC: H01L23/00 ,  B32B27/38 ,  B32B27/14

CPC classification number: H01L24/29 ,  B32B27/08 ,  B32B27/14 ,  B32B27/16 ,  B32B27/20 ,  B32B27/308 ,  B32B27/38 ,  B32B37/02 ,  B32B37/24 ,  B32B2307/202 ,  B32B2310/0831 ,  B32B2457/00 ,  C08K2201/001 ,  C09J4/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/00 ,  C09J163/00 ,  C09J201/00 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27001 ,  H01L2224/27003 ,  H01L2224/27848 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/2021 ,  H01L2924/2064 ,  H01L2924/3511 ,  H05K3/323

Abstract: An anisotropic conductive film has a first connection layer and a second connection layer formed on a surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermo- or photo-cationically, anionically, or radically polymerizable resin layer. Conductive particles for anisotropic conductive connection are arranged on a surface of the first connection layer on a side of the second connection layer so that the embedding ratio of the conductive particles in the first connection layer is 80% or more, or 1% or more and 20% or less.

Abstract translation: 各向异性导电膜具有形成在第一连接层的表面上的第一连接层和第二连接层。 第一连接层是光聚合树脂层，第二连接层是热阳离子，光阴离子或自由基聚合性树脂层。 用于各向异性导电连接的导电颗粒被布置在第二连接层侧的第一连接层的表面上，使得第一连接层中的导电颗粒的嵌入比为80％以上或1％以上， 20％以下。

公开(公告)号：US20160280969A1

公开(公告)日：2016-09-29

申请号：US14904495

申请日：2014-07-28

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU

IPC: C09J9/02 ,  H05K3/36 ,  H01R43/16 ,  C09J7/02

CPC classification number: C09J9/02 ,  C08K3/04 ,  C08K3/08 ,  C08K7/18 ,  C09J7/22 ,  C09J7/30 ,  C09J11/04 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2467/006 ,  H01R43/16 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0224 ,  H05K2203/0139 ,  H05K2203/0534 ,  H05K2203/0545

Abstract: Electrically conductive particles filled in the openings are securely transferred and attached to the binder resin layer. The invention further includes a step of filling a solvent and electrically conductive particles in a plurality of openings formed on a surface of a substrate in a predetermined pattern, a step of pasting a surface on which a binder resin layer is formed of an adhesive film having the binder resin layer formed on a base film on a surface on which the openings are formed of the substrate, and a step of peeling off the adhesive film from the surface of the substrate and transferring and attaching the electrically conductive particles filled in the openings to the binder resin layer while heating the substrate.

Abstract translation: 填充在开口中的导电颗粒被牢固地转移并附着到粘结剂树脂层上。 本发明还包括在预定图案的基板的表面上形成的多个开口填充溶剂和导电性粒子的步骤，将由粘合剂树脂层形成的表面粘贴在其上形成有粘合剂膜的工序， 在由基板形成开口的表面上形成在基膜上的粘合剂树脂层，以及从基板表面剥离粘合剂膜并将填充在开口中的导电颗粒转移并附着到 粘合剂树脂层，同时加热基板。

公开(公告)号：US20220084975A1

公开(公告)日：2022-03-17

申请号：US17536555

申请日：2021-11-29

Applicant: DEXERIALS CORPORATION

Inventor： Reiji TSUKAO ,  Yasushi AKUTSU

IPC: H01L23/00 ,  B32B5/30 ,  B32B27/06 ,  B32B3/30 ,  B32B7/04 ,  B32B27/28 ,  C09J4/00 ,  B32B7/02 ,  H05K3/32 ,  C09J163/00 ,  C09J201/00 ,  B32B7/00 ,  B32B3/00 ,  B32B27/00 ,  H01R4/04 ,  B32B27/08 ,  C08L63/00 ,  C09J7/10

Abstract: An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin layer, and the second is thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. The first connection layer has fine projections and recesses in a surface. An anisotropic conductive film of another aspect has first, second, and third connection layers layered in sequence. The first layer formed of photo-radically polymerized resin. The second and third layers are formed of thermo-cationically or thermo-anionically polymerizable resin, photo-cationically or photo-anionically polymerizable resin, thermo-radically polymerizable resin, or photo-radically polymerizable resin. On a surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer.

公开(公告)号：US20210371706A1

公开(公告)日：2021-12-02

申请号：US17403072

申请日：2021-08-16

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA ,  Yasushi AKUTSU

IPC: C09J7/10 ,  B29C43/00 ,  B29C43/20 ,  B29D7/01 ,  C09J5/06 ,  C09J9/02 ,  H01L23/00 ,  B29C35/08

Abstract: A method of producing an anisotropic conductive film having a three-layer structure including a first connection layer, a second connection layer, and a third connection layer. The connection layers are each formed mainly of an insulating resin. The first connection layer is held between the second connection layer and the third connection layer.

公开(公告)号：US20190206831A1

公开(公告)日：2019-07-04

申请号：US16247957

申请日：2019-01-15

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU

IPC: H01L23/00 ,  C09J9/02 ,  G02F1/1345 ,  H01L23/544 ,  C09J7/00 ,  H05K1/02 ,  H05K3/32 ,  C09D163/00

CPC classification number: H01L24/83 ,  C08K2201/001 ,  C09D163/00 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J171/12 ,  C09J2203/326 ,  C09J2205/102 ,  G02F1/13306 ,  G02F1/1339 ,  G02F1/134309 ,  G02F1/13439 ,  G02F1/1345 ,  G02F1/13452 ,  G02F2001/133302 ,  G02F2001/133354 ,  G02F2202/28 ,  H01L23/544 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/91 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/83101 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H05K1/0269 ,  H05K3/323 ,  H05K2203/166 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665

Abstract: An alignment mark at a position that overlaps an area in which an anisotropic conductive film is pasted, and to accurately perform alignment using an image captured by a camera. An alignment method in which an electronic component is mounted on the obverse surface of a transparent substrate with a conductive adhesive agent interposed therebetween, a substrate-side alignment mark and a component-side alignment mark are adjusted from the captured image, and the position at which the electronic component is mounted on the transparent substrate is aligned, wherein in the conductive adhesive agent, conductive particles are in a regular arrangement as viewed from a planar perspective, and in the captured image, the outside edges of the alignment marks exposed between the conductive particles are intermittently visible as line segments (S) along the imaginary line segments of the outside edges of the alignment mark.

公开(公告)号：US20190139927A1

公开(公告)日：2019-05-09

申请号：US16096255

申请日：2017-04-24

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU ,  Reiji TSUKAO

IPC: H01L23/00

Abstract: An anisotropic conductive film which can be used as a standard product as long as no problems arise in anisotropic conductive connections, even in a case where omissions are present in a prescribed disposition of conductive particles, includes a regular disposition region in which conductive particles are disposed regularly in an insulating resin binder, and has a length of 5 m or greater. A standard region including no sections with more than a prescribed number of consecutive omissions in conductive particles is present in the regular disposition region over a prescribed width in a short-side direction of the anisotropic conductive film and at least a prescribed length in a long-side direction of the anisotropic conductive film.

公开(公告)号：US20190106548A1

公开(公告)日：2019-04-11

申请号：US16087598

申请日：2017-04-24

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU ,  Reiji TSUKAO

IPC: C08J5/18 ,  B29C59/02

Abstract: A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.

公开(公告)号：US20190096843A1

公开(公告)日：2019-03-28

申请号：US16096606

申请日：2017-04-25

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU ,  Reiji TSUKAO

IPC: H01L23/00

Abstract: An anisotropic conductive film capable of accommodating bumps with a narrow pitch and reducing the number density of conductive particles in comparison to known anisotropic conductive films. In an anisotropic conductive film, conductive particles are disposed in an insulating resin binder, and repeating units of polygons formed by successively connecting the centers of a plurality of conductive particles are disposed repeatedly in the vertical and horizontal directions in a plan view. The sides of the polygons of the repeating units intersect diagonally with the long-side direction or the short-side direction of the anisotropic conductive film.

公开(公告)号：US20180287273A1

公开(公告)日：2018-10-04

申请号：US15765439

申请日：2016-10-06

Applicant: DEXERIALS CORPORATION

Inventor： Hiromi KUBODE ,  Yasushi AKUTSU ,  Reiji TSUKAO

IPC: H01R11/01 ,  H05K1/14 ,  H05K3/32 ,  C09J9/02 ,  H01R4/04

Abstract: An anisotropic conductive film which suppresses occurrence of short circuit at the time of anisotropic conductive connection, prevents reduction in capturing capability of electrically conductive particles, enables favorable pushing of electrically conductive particles and exhibits not only favorable initial conductivity but also favorable conduction reliability, contains a first electrically conductive particle group and a second electrically conductive particle group, each including a plurality of electrically conductive particles, in an insulating binder. The first electrically conductive particle group and the second electrically conductive particle group are present in a first region and a second region, respectively, which differ from each other in the thickness direction of the anisotropic conductive film and are parallel to the plane direction. Moreover, the first electrically conductive particle group and the second electrically conductive particle group differ from each other in an existence state of the electrically conductive particles.

公开(公告)号：US20170358549A1

公开(公告)日：2017-12-14

申请号：US15543113

申请日：2016-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA ,  Yasushi AKUTSU ,  Tomoyuki ISHIMATSU

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L24/27 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13164 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2224/13686 ,  H01L2224/1369 ,  H01L2224/1403 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16146 ,  H01L2224/16147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/17107 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27515 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81101 ,  H01L2224/81122 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83122 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/00015 ,  H01L2924/3841 ,  H01L2224/83851 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/05432

Abstract: Provided is a multilayer substrate including laminated semiconductor substrates each having a penetrating hole (hereinafter referred to as through hole) having a plated film formed in the inner surface. The multilayer substrate has excellent conduction characteristics and can be manufactured at low cost. Conductive particles are selectively present at a position where the through holes face each other as viewed in a plan view of the multilayer substrate. The multilayer substrate has a connection structure in which the facing through holes are connected by the conductive particles, and the semiconductor substrates each having the through hole are bonded by an insulating adhesive.