公开(公告)号：US20150079726A1

公开(公告)日：2015-03-19

申请号：US14552123

申请日：2014-11-24

Applicant: LG CHEM, LTD.

Inventor： Yoon Gyung CHO ,  Suk Ky Chang ,  Jung Sup SHIM ,  Hyun Jee YOO ,  Seung Min LEE

IPC: H01L51/52 ,  H01L51/56 ,  H01L51/44 ,  C09J7/00 ,  H01L51/10

CPC classification number: H01L51/5246 ,  C09J5/06 ,  C09J7/00 ,  C09J133/062 ,  C09J133/08 ,  C09J163/00 ,  C09J2201/606 ,  C09J2423/00 ,  C09J2463/00 ,  H01L51/0024 ,  H01L51/107 ,  H01L51/448 ,  H01L51/5259 ,  H01L51/56

Abstract: Provided is a method of manufacturing an organic electronic device using a pressure-sensitive adhesive film. The method of manufacturing an organic electronic device including an encapsulation layer having excellent moisture barrier property and adhesiveness may be provided. In addition, according to the manufacturing method, for example, though the encapsulation layer is formed on an entire surface of an organic electronic element, a flexibility phenomenon of the organic electronic device may be minimized, and the organic electronic device may be manufactured without damage to the organic electronic element for a short process time.

Abstract translation: 提供一种使用压敏粘合膜制造有机电子器件的方法。 可以提供包括具有优异的防潮性和粘合性的封装层的有机电子器件的制造方法。 此外，根据制造方法，例如，尽管在有机电子元件的整个表面上形成封装层，但是可以使有机电子器件的柔性现象最小化，并且可以在不损坏的情况下制造有机电子器件 到有机电子元件处理时间短。

公开(公告)号：US08742411B2

公开(公告)日：2014-06-03

申请号：US13886098

申请日：2013-05-02

Applicant: LG Chem, Ltd.

Inventor： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Jung Sup Shim ,  Suk Chin Lee ,  Kwang Jin Jeong ,  Suk Ky Chang

IPC: H01L29/08 ,  H01L35/24 ,  H01L51/00 ,  H01L33/00

CPC classification number: H01L51/0094 ,  C08K3/16 ,  C08K3/22 ,  C08K3/346 ,  C08K3/36 ,  C08K2003/162 ,  C08K2003/166 ,  C08K2003/2206 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L21/56 ,  H01L23/28 ,  H01L23/295 ,  H01L23/564 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

Abstract: An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.

Abstract translation: 提供了一种粘合膜，以及使用其的封装有机电子器件（OED）的产品和方法。 粘合膜用于包封OED并且包括可固化的热熔粘合剂层，其包括可固化树脂和吸湿剂，并且可固化热熔粘合剂层包括在封装OED时与OED接触的第一区域，以及 第二个区域不与OED接触。 此外，基于粘合剂层中的吸湿剂的总重量，吸湿剂在第一和第二区域中的含量分别为0至20％和80至100％。

公开(公告)号：US20140106207A1

公开(公告)日：2014-04-17

申请号：US14042187

申请日：2013-09-30

Applicant: LG Chem, LTD.

Inventor： Se Ra Kim ,  Suk Ky Chang ,  Hyo Sook Joo ,  Yoon Tae Hwang ,  Se Woo Yang ,  Joon Hyung Kim ,  Sung Jong Kim

IPC: H01M2/10

CPC classification number: H01M2/1094 ,  C09J7/22 ,  C09J2201/28 ,  C09J2201/606 ,  C09J2203/33 ,  C09J2401/006 ,  C09J2433/006 ,  C09J2463/006 ,  C09J2475/006 ,  H01M2/14 ,  H01M2/16 ,  H01M2/347 ,  H01M10/0422 ,  H01M10/0431 ,  H01M10/049 ,  Y10T428/24802

Abstract: A swelling tape for filling a gap, a method of manufacturing the swelling tape for filling a gap, a method of filling a gap, an electrode assembly and a secondary battery are provided. For example, the swelling tape can be applied inside a gap in which a fluid exists so as to fill the gap by becoming a 3D form, and can be useful at anchoring a subject in which the gap is formed, as necessary.

Abstract translation: 提供用于填充间隙的膨胀带，制造用于填充间隙的膨胀带的方法，填充间隙的方法，电极组件和二次电池。 例如，膨胀带可以应用在存在流体的间隙内，以便通过成为3D形状填充间隙，并且可以有必要根据需要锚定形成间隙的对象。

公开(公告)号：US10457842B2

公开(公告)日：2019-10-29

申请号：US14767182

申请日：2014-09-24

Applicant: LG CHEM, LTD.

Inventor： Yoon Gyung Cho ,  Hyun Jee Yoo ,  Seung Min Lee ,  Suk Ky Chang ,  Jung Sup Shim

IPC: C09J163/00 ,  C08L63/00 ,  C08L101/02 ,  H01L51/52 ,  C08K5/5435 ,  H01L51/00 ,  C08G59/50 ,  C08L101/04

Abstract: The present invention relates to a curable composition and an adhesive film including the same, and provides a curable composition and an adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifespan and durability of an organic electronic device.

公开(公告)号：US10392536B2

公开(公告)日：2019-08-27

申请号：US14765494

申请日：2014-08-05

Applicant: LG CHEM, LTD.

Inventor： Kyung Yul Bae ,  Hyun Jee Yoo ,  Yoon Gyung Cho ,  Suk Ky Chang

IPC: C09J123/22 ,  C09J109/00 ,  H01L51/00 ,  H01L51/56 ,  H01L51/52 ,  C09J9/00 ,  C09J4/00 ,  C09J7/00 ,  C09J133/08 ,  C09J145/00 ,  C09J7/20 ,  C09J7/10

Abstract: Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

公开(公告)号：US10243233B2

公开(公告)日：2019-03-26

申请号：US14443268

申请日：2013-11-18

Applicant: LG Chem, Ltd.

Inventor： Min Soo Park ,  Byung Kyu Jung ,  Yoon Tae Hwang ,  Se Woo Yang ,  Suk Ky Chang ,  Sung Jong Kim ,  Ji Young Hwang ,  Cha Hun Ku

IPC: H01M10/04 ,  H01M10/052 ,  H01M10/0587 ,  H01M2/10 ,  H01M2/16 ,  H01M2/14 ,  C08G18/66 ,  C08G18/76 ,  C08G18/32 ,  C08G18/42 ,  C09J133/08 ,  C09J133/10 ,  C09J7/22 ,  C09J7/25

Abstract: The present invention relates to swelling tape for filling a gap and its use. The swelling tape is, for example, applied between gaps in which a fluid is present, thereby being deformed into a three-dimensional shape to fill the gap and fix an object separated by gaps as needed.

公开(公告)号：US09923169B2

公开(公告)日：2018-03-20

申请号：US14899518

申请日：2014-06-19

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee Yoo ,  Seung Min Lee ,  Yoon Gyung Cho ,  Kyung Yul Bae ,  Jung Sup Shim ,  Suk Ky Chang ,  Hyun Suk Kim ,  Jung Ok Moon ,  Ban Seok Choi ,  Se Woo Yang

IPC: H01L51/00 ,  H01L51/54 ,  C08K3/10 ,  C08K3/22 ,  C08K3/32 ,  C08K3/36 ,  H01L51/52 ,  C08J5/18 ,  G01N21/958

CPC classification number: H01L51/5259 ,  C08J5/18 ,  C08K3/10 ,  C08K3/22 ,  C08K3/32 ,  C08K3/36 ,  C08L2203/206 ,  G01N21/958 ,  H01L51/0034 ,  H01L51/0043

Abstract: There are provided a film and an organic electronic device. The present application may provide a film that may be provided for an evaluation method in which reliability of an encapsulant film is simply and easily evaluated only by measuring a haze immediately before the encapsulant film is used, thereby a failure of a product is determined and reliability may be predicted.

公开(公告)号：US09868881B2

公开(公告)日：2018-01-16

申请号：US14306933

申请日：2014-06-17

Applicant: LG CHEM, LTD.

Inventor： Se Ra Kim ,  Suk Ky Chang ,  Byung Kyu Jung ,  Yoon Tae Hwang ,  Cha Hun Ku ,  Sung Jong Kim ,  Se Woo Yang ,  Hyo Sook Joo ,  Min Soo Park

IPC: B32B41/00 ,  C09J7/02 ,  H01M2/10 ,  H01M10/04 ,  H01M6/00 ,  H01M10/02 ,  B32B37/02 ,  H01M4/04 ,  B32B27/36 ,  B32B27/28 ,  B32B27/40 ,  B32B27/30 ,  B32B27/38 ,  C09J133/08

CPC classification number: C09J7/241 ,  B32B27/285 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B37/02 ,  C09J7/22 ,  C09J7/245 ,  C09J7/25 ,  C09J7/26 ,  C09J7/29 ,  C09J133/08 ,  C09J2203/33 ,  C09J2401/006 ,  C09J2433/00 ,  C09J2433/006 ,  C09J2463/00 ,  C09J2463/006 ,  C09J2475/00 ,  C09J2475/006 ,  H01M2/10 ,  H01M4/04 ,  H01M6/005 ,  H01M10/02 ,  H01M10/04 ,  H01M10/0431 ,  H01M10/049 ,  Y10T29/49114 ,  Y10T428/24521 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

Abstract: A swelling tape for filling a gap and a method of filling a gap are provided. The swelling tape can be applied within the gap having a fluid to realize a 3D shape thereby filling the gap, and be used to fix a subject forming the gap as necessary.

公开(公告)号：US09806293B2

公开(公告)日：2017-10-31

申请号：US14244693

申请日：2014-04-03

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Suk Ky Chang ,  Jung Sup Shim ,  Seung Min Lee

IPC: H01L23/29 ,  H01L51/52 ,  H01L21/56 ,  B32B27/08 ,  B32B27/18 ,  H05B33/04 ,  B32B43/00 ,  H01L51/56 ,  B32B37/14 ,  C09D123/22 ,  C09D163/00 ,  B32B3/04 ,  B32B37/10 ,  B32B37/12 ,  B32B37/24

CPC classification number: H01L51/5259 ,  B32B3/04 ,  B32B27/08 ,  B32B27/18 ,  B32B37/10 ,  B32B37/142 ,  B32B43/00 ,  B32B2037/1223 ,  B32B2037/243 ,  B32B2307/54 ,  B32B2307/7265 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/10 ,  B32B2309/105 ,  B32B2310/0831 ,  B32B2315/08 ,  B32B2457/00 ,  B32B2457/20 ,  B32B2457/206 ,  C09D123/22 ,  C09D163/00 ,  H01L21/56 ,  H01L23/293 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/56 ,  H01L2924/0002 ,  H05B33/04 ,  Y10T156/10 ,  Y10T428/24942 ,  Y10T428/31511 ,  Y10T428/31931 ,  Y10T428/31938 ,  H01L2924/00

Abstract: The present application relates to an encapsulating film, an electronic device and a method of manufacturing the same. In the present application, an encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.

公开(公告)号：US09803112B2

公开(公告)日：2017-10-31

申请号：US14763410

申请日：2014-08-05

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee Yoo ,  Suk Ky Chang ,  Yoon Gyung Cho ,  Kyung Yul Bae

IPC: H01L29/08 ,  C09J109/00 ,  H01L51/00 ,  H01L51/56 ,  H01L51/52 ,  C09J9/00 ,  C09J4/00 ,  C09J7/00 ,  C09J7/02 ,  C09J123/22 ,  C09J133/08 ,  C09J145/00

CPC classification number: C09J109/00 ,  C09J4/00 ,  C09J7/00 ,  C09J7/10 ,  C09J7/20 ,  C09J9/00 ,  C09J123/22 ,  C09J133/08 ,  C09J145/00 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2409/00 ,  C09J2415/003 ,  C09J2423/00 ,  C09J2423/003 ,  C09J2433/003 ,  H01L51/0001 ,  H01L51/0026 ,  H01L51/004 ,  H01L51/0043 ,  H01L51/0094 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  Y10T428/2883

Abstract: Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.