公开(公告)号：US08574964B2

公开(公告)日：2013-11-05

申请号：US12760428

申请日：2010-04-14

申请人： SungWon Cho ,  TaeWoo Lee ,  DaeSik Choi ,  KyuWon Lee

发明人： SungWon Cho ,  TaeWoo Lee ,  DaeSik Choi ,  KyuWon Lee

IPC分类号： H01L21/00 ,  H01L21/3205 ,  H01L21/4763 ,  H01L21/44

CPC分类号： H01L23/48 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/05568 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/165 ,  H01L2224/29 ,  H01L2224/29099 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81193 ,  H01L2224/83889 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05552 ,  H01L2224/81805

摘要： A semiconductor device has a flipchip type semiconductor die with contact pads and substrate with contact pads. A flux material is deposited over the contact pads of the semiconductor die and contact pads of the substrate. A solder tape formed as a continuous body of solder material with a plurality of recesses is disposed between the contact pads of the semiconductor die and substrate. The solder tape is brought to a liquidus state to separate a portion of the solder tape outside a footprint of the contact pads of the semiconductor die and substrate under surface tension and coalesce the solder material as an electrical interconnect substantially within the footprint of the contact pads of the semiconductor die and substrate. The contact pads on the semiconductor die and substrate can be formed with an extension or recess to increase surface area of the contact pads.

摘要翻译： 半导体器件具有带有接触焊盘和具有接触焊盘的衬底的倒装芯片型半导体管芯。 焊剂材料沉积在半导体管芯的接触焊盘和衬底的接触焊盘上。 形成为具有多个凹部的焊料材料的连续体的焊料带设置在半导体管芯和衬底的接触焊盘之间。 焊带被带到液相线状态，以将表面张力下的半导体管芯和衬底的接触焊盘的一部分焊接区分隔开，并将焊料材料作为基本上在接触焊盘的覆盖区内的电互连 的半导体管芯和衬底。 半导体管芯和衬底上的接触焊盘可以形成有延伸部或凹部，以增加接触焊盘的表面积。

公开(公告)号：US20130221543A1

公开(公告)日：2013-08-29

申请号：US13407554

申请日：2012-02-28

申请人： DaeSik Choi ,  JoonYoung Choi ,  YongHyuk Jeong

发明人： DaeSik Choi ,  JoonYoung Choi ,  YongHyuk Jeong

IPC分类号： H01L23/498 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a base integrated circuit over the base substrate; attaching a lead to the base integrated circuit and the base substrate, the lead having a lead attachment portion over the base integrated circuit; and forming a base encapsulation over the lead, the base encapsulation having a cavity exposing the lead attachment portion.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供基底; 在基底基板上安装基底集成电路; 将引线附接到基底集成电路和基底基板，所述引线在所述基底集成电路上方具有引线附接部分; 以及在所述引线上形成基底封装，所述基底封装具有暴露所述引线附着部分的空腔。

公开(公告)号：US20130154085A1

公开(公告)日：2013-06-20

申请号：US13325530

申请日：2011-12-14

申请人： DaeSik Choi ,  SangMi Park ,  MinJung Kim ,  MinWook Yu

发明人： DaeSik Choi ,  SangMi Park ,  MinJung Kim ,  MinWook Yu

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/36 ,  H01L21/50 ,  H01L23/10 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; mounting a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole; and mounting a heat slug over the lid base, the heat slug having a slug non-horizontal side partially within the base indentation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 在基板上安装集成电路; 在基板上安装盖基座，盖基座具有基座凹口和孔内的集成电路; 并且将热块安装在盖底部上，热块具有部分在基底凹陷内的非水平侧段。

公开(公告)号：US08466567B2

公开(公告)日：2013-06-18

申请号：US12884134

申请日：2010-09-16

申请人： DaeSik Choi ,  SangMi Park ,  Oh Han Kim

发明人： DaeSik Choi ,  SangMi Park ,  Oh Han Kim

IPC分类号： H01L23/28

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2224/11003 ,  H01L2224/1133 ,  H01L2224/13082 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48155 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/83005 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a connection carrier having base device pads and base interconnect pads on a carrier top side of the connection carrier; connecting a base integrated circuit to the base device pads and mounted over the carrier top side; mounting base vertical interconnects directly on the base interconnect pads; attaching a base package substrate to the base integrated circuit and directly on the base vertical interconnects; forming a base encapsulation on the base package substrate, the base device pads, and the base interconnect pads; and removing a portion of the connection carrier with the base device pads and the base interconnect pads partially exposed opposite the base package substrate.

摘要翻译： 一种制造集成电路封装系统的方法，包括：在连接载体的载体顶侧上形成具有基底器件焊盘和基底互连焊盘的连接载体; 将基座集成电路连接到基座装置焊盘并安装在载体顶侧上; 将底座垂直互连直接安装在基底互连焊盘上; 将基底封装衬底附接到基底集成电路并直接在基底垂直互连上; 在基底封装衬底，基底器件焊盘和基底互连焊盘上形成基底封装; 以及使用与基底封装衬底相对部分地露出的基底器件焊盘和基底互连焊盘去除连接载体的一部分。

公开(公告)号：US20130075926A1

公开(公告)日：2013-03-28

申请号：US13243699

申请日：2011-09-23

申请人： JoHyun Bae ,  In Sang Yoon ,  DaeSik Choi

发明人： JoHyun Bae ,  In Sang Yoon ,  DaeSik Choi

IPC分类号： H01L21/56 ,  H01L23/48 ,  H01L21/58

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; applying a molded under-fill on the base substrate; forming a substrate contact extender through the molded under-fill and in direct contact with the base substrate; mounting a stack device over the molded under-fill; attaching a coupling connector from the substrate contact extender to the stack device; and forming a base encapsulation on the stack device, the substrate contact extender, and encapsulating the coupling connector.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供基底; 将模制的填充物施加在基底基底上; 通过模制的下填充形成基底接触延伸器并与基底基板直接接触; 将堆叠装置安装在模制的填充物上; 将耦合连接器从所述基板接触延伸器附接到所述堆叠装置; 以及在所述堆叠装置上形成基底封装，所述衬底接触扩展器和封装所述耦合连接器。

公开(公告)号：US20130069240A1

公开(公告)日：2013-03-21

申请号：US13235202

申请日：2011-09-16

申请人： DeokKyung Yang ,  DaeSik Choi

发明人： DeokKyung Yang ,  DaeSik Choi

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L21/4853 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a top integrated circuit on a first side of the substrate; mounting a bottom integrated circuit on a second side of the substrate; forming a top encapsulation over the top integrated circuit and a bottom encapsulation over the bottom integrated circuit simultaneously; and forming a bottom via through the bottom encapsulation to the substrate.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 将顶部集成电路安装在所述基板的第一侧上; 将底部集成电路安装在所述基板的第二侧上; 在顶部集成电路上形成顶部封装，同时在底部集成电路上形成底部封装; 以及通过底部封装形成底部通孔到基底。

公开(公告)号：US20120211900A1

公开(公告)日：2012-08-23

申请号：US13031546

申请日：2011-02-21

申请人： DaeSik Choi ,  JoonYoung Choi ,  WonIl Kwon

发明人： DaeSik Choi ,  JoonYoung Choi ,  WonIl Kwon

IPC分类号： H01L23/48 ,  H01L21/28

CPC分类号： H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02123 ,  H01L2224/02125 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/0361 ,  H01L2224/03622 ,  H01L2224/03845 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05018 ,  H01L2224/05019 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05186 ,  H01L2224/0519 ,  H01L2224/05556 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/00

摘要： A semiconductor wafer has a contact pad. A first insulating layer is formed over the wafer. A second insulating layer is formed over the first insulating layer and contact pad. A portion of the second insulating layer is removed to expose the contact pad. A first UBM layer is formed over and follows a contour of the second insulating layer and contact pad to create a well over the contact pad. A first buffer layer is formed in the well over the first UBM layer and the contact pad. A second UBM layer is formed over the first UBM layer and first buffer layer. A third UBM layer is formed over the second UBM layer. A bump is formed over the third UBM layer. The first buffer layer reduces stress on the bump and contact pad. A second buffer layer can be formed between the second and third UBM layers.

摘要翻译： 半导体晶片具有接触垫。 在晶片上形成第一绝缘层。 在第一绝缘层和接触垫上形成第二绝缘层。 去除第二绝缘层的一部分以露出接触垫。 第一UBM层形成在第二绝缘层和接触垫的轮廓之上并且跟随第二绝缘层和接触垫的轮廓以在接触垫上产生良好的孔。 在第一UBM层和接触垫上的阱中形成第一缓冲层。 在第一UBM层和第一缓冲层上形成第二UBM层。 在第二UBM层上形成第三UBM层。 在第三UBM层上形成凸块。 第一个缓冲层减少了凸块和接触垫上的应力。 可以在第二和第三UBM层之间形成第二缓冲层。

公开(公告)号：US20110291264A1

公开(公告)日：2011-12-01

申请号：US12791865

申请日：2010-06-01

申请人： DaeSik Choi ,  Taewoo Lee ,  KyuWon Lee ,  SungWon Cho

发明人： DaeSik Choi ,  Taewoo Lee ,  KyuWon Lee ,  SungWon Cho

IPC分类号： H01L23/50 ,  H01L21/56

CPC分类号： H01L24/94 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/50 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81805 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05147

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a semiconductor wafer having a chip pad; attaching a wafer frame to the semiconductor wafer, the wafer frame having a horizontal cover integral to a protruding connector with the protruding connector on the chip pad; forming an underfill around the protruding connector and between the horizontal cover and the semiconductor wafer; removing the horizontal cover exposing the underfill and the protruding connector; and singulating an integrated circuit package from the semiconductor wafer.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有芯片焊盘的半导体晶片; 将晶片框架附接到半导体晶片，晶片框架具有与突出连接器成一体的水平盖，突出连接器在芯片垫上; 在所述突出连接器周围和所述水平盖和所述半导体晶片之间形成底部填充物; 移除露出底部填充物和突出连接器的水平盖; 以及从半导体晶片分离集成电路封装。

公开(公告)号：US08067307B2

公开(公告)日：2011-11-29

申请号：US12037291

申请日：2008-02-26

申请人： DaeSik Choi ,  Sang-Ho Lee ,  Soo-San Park

发明人： DaeSik Choi ,  Sang-Ho Lee ,  Soo-San Park

IPC分类号： H01L21/44 ,  H01L23/28

CPC分类号： H01L23/3128 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06596 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package system comprising: providing a package die; and connecting a connector lead having a first connector end with a protruded connection surface and a lowered structure over the package die.

摘要翻译： 一种集成电路封装系统，包括：提供封装管芯; 以及将具有第一连接器端部的连接器引线与在封装模具上的突出的连接表面和降低的结构连接。

公开(公告)号：US08063475B2

公开(公告)日：2011-11-22

申请号：US12239715

申请日：2008-09-26

申请人： DaeSik Choi ,  DeokKyung Yang ,  Seung Won Kim

发明人： DaeSik Choi ,  DeokKyung Yang ,  Seung Won Kim

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L21/6835 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/91 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2221/68359 ,  H01L2224/04042 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor package system includes: providing a top package, a through silicon via interposer embedded in the top package; providing a bottom package having a bottom semiconductor die with a top connection adjacent the center active face thereof, a substrate interposer being embedded in the bottom package, the bottom semiconductor die being attached to the substrate interposer; and attaching the top package to the bottom package, the top package having the through silicon via interposer having a via connected to the top connection.

摘要翻译： 半导体封装系统包括：提供顶部封装，嵌入在顶部封装中的通过硅通孔插入器; 提供具有底部半导体管芯的底部封装，所述底部半导体管芯具有邻近其中心主动面的顶部连接，衬底插入器嵌入在所述底部封装中，所述底部半导体管芯附接到所述衬底插入器; 并且将顶部封装附接到底部封装，具有通过硅通孔插入件的顶部封装具有连接到顶部连接的通孔。