公开(公告)号：US07211934B2

公开(公告)日：2007-05-01

申请号：US10750821

申请日：2004-01-05

申请人： Shinichi Fujiwara ,  Masahide Harada ,  Kunio Matsumoto ,  Eiji Matsuzaki

发明人： Shinichi Fujiwara ,  Masahide Harada ,  Kunio Matsumoto ,  Eiji Matsuzaki

IPC分类号： H01L41/08

CPC分类号： H03H9/059 ,  B81B7/007 ,  B81C1/00269 ,  B81C2203/019 ,  B81C2203/036 ,  H01L23/10 ,  H01L23/552 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05671 ,  H01L2224/11462 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/29199 ,  H01L2224/29355 ,  H01L2224/29388 ,  H01L2224/29444 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/81139 ,  H01L2224/81203 ,  H01L2224/81411 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/8183 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3025 ,  H03H3/007 ,  H03H3/08 ,  H03H9/1078 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/01049 ,  H01L2924/00

摘要： An electronic device of a chip size having improved airtightness is designed to be formed by a reduced number of process steps. An electronic component including a chip having a functional surface and electrodes at least on one side and a substrate having a portion which can be connected to the electrodes of the chip is designed as such an electronic device. In the electronic component, electroconductive glass or an intermetallic compound is used for connection portions to establish electrical connections between the chip and the substrate and to simultaneously seal the device surface on the chip.

摘要翻译： 具有改善的气密性的芯片尺寸的电子装置被设计成通过减少数量的工艺步骤形成。 将包括具有功能表面的芯片和至少一侧的电极的电子部件以及具有可与芯片的电极连接的部分的基板设计为这样的电子设备。 在电子部件中，导电玻璃或金属间化合物用于连接部分，以建立芯片和基板之间的电连接，同时密封芯片上的器件表面。

公开(公告)号：US20070080447A1

公开(公告)日：2007-04-12

申请号：US11607910

申请日：2006-12-04

申请人： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

发明人： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L24/16 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29139 ,  H01L2224/2929 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/056 ,  H05K1/144 ,  H05K3/384 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10734 ,  H01L2924/05432 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

摘要翻译： 本发明提供一种电子设备，其具有包括金属板的金属芯基板，形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和导体层的端子 电子部件连接。 在电子设备中，具有高导热性的部件被布置成与金属板和电子部件都接触。 因此，电子设备的散热性提高。

公开(公告)号：US06795674B2

公开(公告)日：2004-09-21

申请号：US10679401

申请日：2003-10-07

申请人： Shuuichi Endoh ,  Osamu Endou ,  Yoshihiro Abe ,  Masahide Harada ,  Nobuhiko Umezawa

发明人： Shuuichi Endoh ,  Osamu Endou ,  Yoshihiro Abe ,  Masahide Harada ,  Nobuhiko Umezawa

IPC分类号： G03G1508

CPC分类号： G03G15/0812 ,  G03G2215/0634

摘要： A developing device for an image forming apparatus of the present invention includes an image carrier performing endless movement while carrying a developer in the form of a layer thereon, and a regulating member for regulating the thickness of the layer. Toner stored in the developing device is covered with an additive whose particle size is less than 2 &mgr;m. The regulating member is implemented as a doctor roller having a surface roughness Rz equal to or greater than the above particle size, but smaller than 2 &mgr;m. The doctor roller is pressed against a developing roller or developer carrier by a preselected pressure, forming a nip for development. The developing device reduces irregular development ascribable to impurities caught at a regulating position assigned to the doctor roller more than a conventional developing device using a doctor blade as a regulating member. In addition, the developing device obviates irregular development in the form of fine stripes ascribable to stripe-like irregularities formed in the developer layer existing on the developing roller.

公开(公告)号：US5942185A

公开(公告)日：1999-08-24

申请号：US963119

申请日：1997-10-28

申请人： Tetsuya Nakatsuka ,  Tasao Soga ,  Hanae Shimokawa ,  Kenichi Yamamoto ,  Masahide Harada ,  Yuuji Ochiai ,  Tsuneaki Kamei

发明人： Tetsuya Nakatsuka ,  Tasao Soga ,  Hanae Shimokawa ,  Kenichi Yamamoto ,  Masahide Harada ,  Yuuji Ochiai ,  Tsuneaki Kamei

IPC分类号： B23K35/14 ,  B23K35/00 ,  B23K35/22 ,  B23K35/26 ,  H05K3/34 ,  G01N25/00

CPC分类号： B23K35/262 ,  H05K3/3457 ,  Y10S228/903

摘要： Provided is a lead-free solder for connecting LSI and parts on organic substrates, which can provide soldering at a maximum temperature of 220.degree.-230.degree. C. and which has a sufficient reliability in mechanical strength even at a high temperature of 150.degree. C. Also provided are electronic products prepared using this lead-free solder. The lead-free solder has a solder composition including 3-5% Zn and 10-23% Bi, the balance being Sn. Preferably, the solder composition is a composition (Sn, Zn, Bi) surrounded by lines connecting A and B, B and C and C and A, where A is (85, 5, 10 ), B is (72, 5, 23) and C is (76, 3, 21), of a ternary diagram having pure Sn, pure Zn and pure Bi at the vertices of an equilateral triangle. Through use of this solder, it is possible to solder parts, etc. on conventionally employed organic substrates at reflow temperatures equivalent to those for conventional Pb--Sn eutectic solders. The solder does not damage the environment, can be stably supplied and is low in cost.

摘要翻译： 提供一种用于连接LSI和有机基板上的部件的无铅焊料，其可以在220℃-230℃的最高温度下提供焊接，并且即使在150℃的高温下也具有足够的机械强度可靠性 还提供使用这种无铅焊料制备的电子产品。 无铅焊料具有包含3-5％Zn和10-23％Bi的焊料组合物，余量为Sn。 优选地，焊料组合物是由连接A和B，B和C以及C和A的线包围的组合物（Sn，Zn，Bi），其中A是（85,5,10），B是（72,5,23 ）和C是（76,3,21），在等边三角形的顶点处具有纯Sn，纯Zn和纯Bi的三元图。 通过使用这种焊料，可以在与常规Pb-Sn共晶焊料相同的回流温度下将常规使用的有机基板上的部件等进行焊接。 焊料不会损坏环境，可以稳定供电，成本低。

公开(公告)号：US5867809A

公开(公告)日：1999-02-02

申请号：US438477

申请日：1995-05-10

申请人： Tasao Soga ,  Hanae Shimokawa ,  Masahide Harada ,  Tatsuya Suzuki ,  Yuji Ochiai ,  Asao Nakano ,  Hiroyoshi Matsumura ,  Tsuneaki Kamei

发明人： Tasao Soga ,  Hanae Shimokawa ,  Masahide Harada ,  Tatsuya Suzuki ,  Yuji Ochiai ,  Asao Nakano ,  Hiroyoshi Matsumura ,  Tsuneaki Kamei

IPC分类号： G01R31/00 ,  B29B17/02 ,  G06F11/00 ,  G06F11/30 ,  G06F11/34 ,  G07C3/00 ,  G05D23/00

CPC分类号： G07C3/00 ,  G06F11/3031 ,  G06F11/3055 ,  G06F11/3058 ,  G06F11/3093 ,  G06F11/008 ,  G06F11/3096 ,  G06F11/3419 ,  G06F11/3476 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  Y02B60/165

摘要： The present invention relates to an electric appliance and a remaining life estimation system wherein the electric appliance having a printed circuit board on which at least LSI components are mounted includes an IC with sensor. The IC includes a time monitor for calculating the operation status which is a use condition affecting the life of a reusable component of the appliance, a temperature and humidity sensor for detecting at least temperature and humidity environmental conditions affecting the life of the reusable component, and a memory for storing the history of temperature and humidity in correspondence with the history of operation status. A control unit controls storage of the history of temperature and humidity which is detected by the temperature and humidity sensor so as to be stored in the memory in correspondence with the history of operation status which is calculated by the time monitor, and allows, when the remaining life of the component is evaluated so as to decide whether or not to reuse it, external reading of the history of temperature and humidity corresponding to the history of operation status from the memory.

摘要翻译： 本发明涉及一种电器和剩余寿命估计系统，其中具有至少LSI组件的印刷电路板的电器包括具有传感器的IC。 IC包括用于计算作为影响器具的可重复使用部件的寿命的使用条件的操作状态的时间监视器，用于检测影响可重用组件的寿命的至少温度和湿度环境条件的温度和湿度传感器，以及 用于存储与操作状态的历史相对应的温度和湿度历史的存储器。 控制单元控制由温度和湿度传感器检测的温度和湿度的历史记录，以便与由时间监视器计算的操作状态的历史相对应地存储在存储器中，并且当 评估组件的剩余寿命，以决定是否重用它，从存储器读取对应于操作状态的历史的温度和湿度的历史。

公开(公告)号：US07498671B2

公开(公告)日：2009-03-03

申请号：US11834724

申请日：2007-08-07

申请人： Shinichi Fujiwara ,  Masahide Harada ,  Hideto Yoshinari ,  Shosaku Ishihara ,  Shiro Yamashita ,  Isamu Yoshida ,  Ukyo Ikeda

发明人： Shinichi Fujiwara ,  Masahide Harada ,  Hideto Yoshinari ,  Shosaku Ishihara ,  Shiro Yamashita ,  Isamu Yoshida ,  Ukyo Ikeda

IPC分类号： H01L23/10

CPC分类号： H01L23/3735 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/26165 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40499 ,  H01L2224/73263 ,  H01L2224/83136 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/9221 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/84

摘要： A semiconductor module of the present invention comprises a first conductive layer (film) and a second conductive layer (film) which are separately formed on the main surface of a packed substrate, a thermal diffusion plate connected by solder to the upper surface of the first conductive layer, a semiconductor element connected by solder to the upper surface of the thermal diffusion plate, and a lead having one end connected by solder to the second conductive layer and the other end connected by solder to the semiconductor element, wherein the outer periphery of the connected region where the semiconductor element is connected by solder to the upper surface of the thermal diffusion plate is formed with protrusion parts protruding up from the connecting region and a turning of the semiconductor element in the upper surface of the thermal diffusion plate in the solder connecting process is suppressed by the protrusion parts.

摘要翻译： 本发明的半导体模块包括在填充基板的主表面上分别形成的第一导电层（膜）和第二导电层（膜），通过焊料与第一导电层（膜）的上表面连接的热扩散板 导电层，通过焊料连接到热扩散板的上表面的半导体元件，以及引线，其一端通过焊料连接到第二导电层，另一端通过焊料连接到半导体元件，其中外周边 半导体元件通过焊料连接到热扩散板的上表面的连接区域形成有从连接区域突出的突出部分和在焊料中的热扩散板的上表面中的半导体元件的转动 连接过程被突出部分抑制。

公开(公告)号：US20090008128A1

公开(公告)日：2009-01-08

申请号：US12184119

申请日：2008-07-31

申请人： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

发明人： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

IPC分类号： H05K1/00

CPC分类号： H01L24/16 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29139 ,  H01L2224/2929 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/056 ,  H05K1/144 ,  H05K3/384 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10734 ,  H01L2924/05432 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

摘要翻译： 本发明提供一种电子设备，其具有包括金属板的金属芯基板，形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和导体层的端子 电子部件连接。 在电子设备中，具有高导热性的部件被布置成与金属板和电子部件都接触。 因此，电子设备的散热性提高。

公开(公告)号：US07445455B2

公开(公告)日：2008-11-04

申请号：US11183972

申请日：2005-07-19

申请人： Takehide Yokozuka ,  Masahide Harada ,  Shiro Yamashita ,  Isamu Yoshida ,  Masahiko Asano ,  Koji Sato ,  Shuji Eguchi ,  Kaoru Uchiyama

发明人： Takehide Yokozuka ,  Masahide Harada ,  Shiro Yamashita ,  Isamu Yoshida ,  Masahiko Asano ,  Koji Sato ,  Shuji Eguchi ,  Kaoru Uchiyama

IPC分类号： H01R12/00

CPC分类号： H05K5/069 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0313 ,  H05K3/3447 ,  H05K5/0069 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10977 ,  H05K2201/2009 ,  Y10S439/935 ,  H01L2924/00

摘要： An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.

摘要翻译： 一种电子设备包括具有通孔并使用玻璃化转变温度超过150℃的树脂作为基底的电路板，具有开口的金属外壳和安装在所述开口的连接器 金属壳体，其中连接器的销插入通孔中，销和通孔与导电构件连接，并且还在导电构件上设置用于固定连接器和板的加强构件，从而改善 电子设备的可靠性。

公开(公告)号：US20070045037A1

公开(公告)日：2007-03-01

申请号：US11488079

申请日：2006-07-18

申请人： Hideto Yoshinari ,  Masahide Harada ,  Kaoru Uchiyama ,  Osamu Koizumi

发明人： Hideto Yoshinari ,  Masahide Harada ,  Kaoru Uchiyama ,  Osamu Koizumi

IPC分类号： B62D5/04

CPC分类号： B62D5/0406 ,  H02K5/225 ,  H02K11/33

摘要： The present invention provides an electric power steering apparatus, in which reduction and thickness thereof can be achieved, radiation performance thereof can concurrently be ensured, and manufacturing and running costs thereof can also be reduced, even when the apparatus includes a structure having a motor and a motor control device integrated therewith. The apparatus includes a motor which assists in steering operations, a motor control device which controls the motor, and a housing which accommodates the motor and the motor control device. The housing includes a motor accommodation portion which accommodates the motor, and a control device accommodation portion which accommodates the motor control device. The motor control device includes a drive unit which drives the motor, and a control unit which controls the motor. The drive unit is disposed in a position in the control device accommodation portion, the position being in proximity to the motor accommodation portion.

摘要翻译： 本发明提供一种电动助力转向装置，其中可以实现其减小和厚度，同时可以确保其辐射性能，并且即使当该装置包括具有电机和 与其集成的电动机控制装置。 该装置包括辅助转向操作的电动机，控制电动机的电动机控制装置以及容纳电动机和电动机控制装置的壳体。 壳体包括容纳电动机的电动机容纳部分和容纳电动机控制装置的控制装置容纳部分。 马达控制装置包括驱动马达的驱动单元和控制马达的控制单元。 驱动单元设置在控制装置容纳部分中的位置，该位置靠近电动机容纳部分。

公开(公告)号：US5878943A

公开(公告)日：1999-03-09

申请号：US753018

申请日：1996-11-19

申请人： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

发明人： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

IPC分类号： B23K1/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34

CPC分类号： H01L24/12 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/16 ,  H05K3/3489 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157

摘要： In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.

摘要翻译： 在将诸如电子电路器件的两个部件焊接在氧化物或污染层已经从焊料或焊盘的表面除去之后，例如，这些部件在氧化气氛中对准。 然后将焊料材料在非氧化气氛中加热以熔化焊料并结合该构件。 通过溅射清洗，激光清洗，机械抛光或切割来进行焊料或焊盘的清洁。