公开(公告)号：US08136242B2

公开(公告)日：2012-03-20

申请号：US12047622

申请日：2008-03-13

Applicant: Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

Inventor： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC: H01R43/16

CPC classification number: H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Abstract translation: 一种制造包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入件的方法。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机

公开(公告)号：US08080741B2

公开(公告)日：2011-12-20

申请号：US12149522

申请日：2008-05-02

Applicant: Myung Sam Kang ,  Chin Kwan Kim

Inventor： Myung Sam Kang ,  Chin Kwan Kim

IPC: H05K1/11

CPC classification number: H05K3/4007 ,  H05K3/246 ,  H05K3/3457 ,  H05K3/4069 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/09481 ,  H05K2201/09745

Abstract: A printed circuit board, which increases the contact area between an IC and a printed circuit board, thus increasing the degree of adhesion, is disclosed. The printed circuit board includes: an insulation layer which includes a first circuit pattern, including at least one via land, embedded in the upper surface of the insulation layer to be flush with the upper surface, and a second circuit pattern formed in the lower surface of the insulation layer to be flush with the lower surface; a solder resist layer formed on the insulation layer; a via hole and a bump integrally formed on the second circuit pattern through the via hole and the via land such that it protrudes from the insulation layer to be higher than the solder resist layer.

Abstract translation: 公开了一种印刷电路板，其增加了IC和印刷电路板之间的接触面积，从而增加了粘合度。 印刷电路板包括：绝缘层，其包括嵌入在绝缘层的上表面中以与上表面齐平的至少一个通孔焊盘的第一电路图案，以及形成在下表面中的第二电路图案 的绝缘层与下表面齐平; 形成在绝缘层上的阻焊层; 通孔和通过通孔和通孔焊盘一体地形成在第二电路图案上的突起，使得其从绝缘层突出成高于阻焊层。

公开(公告)号：US08037600B2

公开(公告)日：2011-10-18

申请号：US12061774

申请日：2008-04-03

Applicant: Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

Inventor： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC: H01R43/00

CPC classification number: H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and mounting at least one interposer on a first surface of the carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. The method includes arranging a plurality of electrically conductive elements about the surface of the at least one hemi-toroidal interposer and extending radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Abstract translation: 一种制造包括电绝缘载体平面并在载体平面的第一表面上安装至少一个插入件的焊盘格栅阵列（LGA）插入器结构的方法。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 该方法包括围绕至少一个半环形插入器的表面布置多个导电元件，并从其最上端向内和向下自由地延伸，与位于电绝缘的相对侧上的至少一个部件电接触 载体飞机

公开(公告)号：US20110235278A1

公开(公告)日：2011-09-29

申请号：US13156493

申请日：2011-06-09

Applicant: Koichi HARA

Inventor： Koichi HARA

IPC: H05K7/20

CPC classification number: H01L23/3675 ,  H01L23/433 ,  H01L23/552 ,  H01L24/50 ,  H01L25/16 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/09745 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2203/1572

Abstract: A circuit module includes a plurality of electronic components including at least one heat-generating electronic component and constituting an electric circuit are spaced from each other on a circuit board. Regions of one or both sides of the circuit board, including regions around the plurality of electronic components, are covered with a heat-dissipating member. A surface of the heat-dissipating member facing the circuit board includes irregularities. An end surface of a protrusion in the facing surface of the heat-dissipating member is in contact with a circuit board surface between the electronic components, directly or with a heat-dissipating sheet interposed therebetween. A wall surface of a recess in the facing surface of the heat-dissipating member is in surface-contact with the heat-generating electronic component within the recess, directly or with the heat-dissipating sheet interposed therebetween. Thus, heat from the heat-generating electronic component and heat from the circuit board heated by the heat from the heat-generating electronic component are dissipated outside through the heat-dissipating member.

Abstract translation: 电路模块包括多个包括至少一个发热电子部件并构成电路的电子部件在电路板上彼此间隔开。 包括多个电子部件周围的电路板的一侧或两侧的区域被散热构件覆盖。 面对电路板的散热构件的表面包括凹凸。 散热构件的相对表面中的突起的端面与电子部件之间的电路板表面直接接触或者与散热片之间插入散热片。 散热构件的相对表面中的凹部的壁表面与凹部内的发热电子部件直接或与散热片介于其间表面接触。 因此，来自发热电子部件的热量和来自发热电子部件的热量加热的电路板的热量通过散热部件散失到外部。

公开(公告)号：US08022533B2

公开(公告)日：2011-09-20

申请号：US11168655

申请日：2005-06-29

Applicant: Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue

Inventor： Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue

IPC: H01L23/34

CPC classification number: H01L24/82 ,  H01L23/142 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L24/45 ,  H01L24/48 ,  H01L27/013 ,  H01L27/016 ,  H01L28/20 ,  H01L28/40 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/24195 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92244 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/056 ,  H05K1/162 ,  H05K1/167 ,  H05K1/185 ,  H05K3/382 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/0338 ,  H05K2201/09745 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Circuit elements including a plurality of semiconductor devices and passive elements embedded in an insulating resin film are formed on a metal substrate having a surface roughness Ra of 0.3 to 10 μm. This produces an anchoring effect occurs between the substrate and the insulating film, thereby improving the adhesiveness between the substrate and the insulating resin film.

Abstract translation: 在表面粗糙度Ra为0.3〜10μm的金属基材上形成包含多个半导体器件和埋入绝缘树脂膜中的无源元件的电路元件。 这样会在基板和绝缘膜之间产生锚定效应，从而提高基板与绝缘树脂膜之间的粘附性。

公开(公告)号：US08017959B2

公开(公告)日：2011-09-13

申请号：US11654665

申请日：2007-01-18

Applicant: Yutaka Akiba ,  Hiroki Kaneko ,  Ikuo Hiyama ,  Toshiaki Tanaka

Inventor： Yutaka Akiba ,  Hiroki Kaneko ,  Ikuo Hiyama ,  Toshiaki Tanaka

IPC: H01L33/00

CPC classification number: H05K1/056 ,  G02F2001/133628 ,  H01L33/64 ,  H01L33/648 ,  H01L2224/16225 ,  H05K1/0203 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2203/1476

Abstract: A widely applicable and low cost module substrate with a high accuracy, reliability and heat-radiation structure. A light source includes: a heat radiation substrate; an insulating layer formed in some regions in an upper surface of the substrate; a wiring layer having wiring patterns, the wiring layer being arranged on the insulating layer; and a plurality of LED elements connected to the wiring layer. Moreover, the light source includes: a heat radiation substrate; an insulating layer arranged in some regions in an upper surface of the substrate; a wiring layer having wiring patterns, the wiring layer being arranged on the insulating layer; and LED elements connected to the wiring layer, wherein the insulating layer has two layers of a resin layer arranged in the wiring layer side and an adhesive layer arranged in the heat radiation substrate side.

Abstract translation: 广泛适用的低成本模块基板，具有高精度，可靠性和散热结构。 光源包括：散热基板; 绝缘层，形成在所述基板的上表面的一些区域中; 具有布线图案的布线层，布线层布置在绝缘层上; 以及连接到布线层的多个LED元件。 此外，光源包括：散热基板; 布置在所述基板的上表面中的一些区域中的绝缘层; 具有布线图案的布线层，布线层布置在绝缘层上; 以及连接到所述布线层的LED元件，其中所述绝缘层具有布置在所述布线层侧的两层树脂层和布置在所述散热基板侧的粘合剂层。

公开(公告)号：US08000105B2

公开(公告)日：2011-08-16

申请号：US12172580

申请日：2008-07-14

Applicant: Jonathan Randall Hinkle

Inventor： Jonathan Randall Hinkle

IPC: H05K1/00

CPC classification number: G06F1/20 ,  H05K1/117 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/047 ,  H05K2201/056 ,  H05K2201/09745 ,  H05K2201/10159 ,  H05K2203/302 ,  Y10T29/49002

Abstract: Memory systems and methods of forming memory modules. In one embodiment, a computer memory system includes a substantially tubular frame with an elongate card edge extending along the frame. A flexible circuit comprising a flexible substrate, a plurality of memory chips affixed to the flexible substrate, and a plurality of electrical terminals interconnected with the memory chips, is secured along a perimeter of the tubular frame with the electrical terminals arranged along the card edge.

Abstract translation: 内存系统和形成内存模块的方法。 在一个实施例中，计算机存储器系统包括具有沿框架延伸的细长卡边缘的基本上管状的框架。 包括柔性基板，固定到柔性基板的多个存储芯片以及与存储芯片互连的多个电端子的柔性电路沿着管状框架的周边被固定，电端子沿卡边缘布置。

公开(公告)号：US20110164391A1

公开(公告)日：2011-07-07

申请号：US12775341

申请日：2010-05-06

Applicant: Yee Na SHIN ,  Tae Sung JEONG ,  Young Ki LEE ,  Seung Eun LEE

Inventor： Yee Na SHIN ,  Tae Sung JEONG ,  Young Ki LEE ,  Seung Eun LEE

IPC: H05K1/18 ,  H05K3/00

CPC classification number: H05K3/445 ,  H01L23/13 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/4641 ,  H05K2201/09745 ,  H05K2201/09772 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/0315 ,  H01L2924/00

Abstract: Disclosed herein is an electronic component-embedded printed circuit board, including: a metal substrate including an anodic oxide film formed over the entire surface thereof; two electronic components disposed in a cavity formed in the metal substrate in two stages; an insulation layer formed on both sides of the metal substrate to bury the electronic components disposed in the cavity; and circuit layers including vias connected with connecting terminals of the electronic components and formed on the exposed surfaces of the insulation layer. The electronic component-embedded printed circuit board is advantageous in that its radiation performance of radiating the heat generated from an electronic component can be improved, and its production cost can be reduced, because a metal substrate is used instead of a conventional insulating material.

Abstract translation: 这里公开了一种电子部件嵌入式印刷电路板，包括：金属基板，包括在其整个表面上形成的阳极氧化膜; 设置在形成在金属基板中的空腔中的两个电子部件分两级; 形成在所述金属基板的两侧的绝缘层，以埋置设置在所述空腔中的电子部件; 以及电路层，包括与电子部件的连接端子连接并形成在绝缘层的暴露表面上的通孔。 电子元件嵌入式印刷电路板的优点在于，由于使用金属基板代替传统的绝缘材料，因此可以提高其辐射电子元件产生的热量的辐射性能，并且可以降低其制造成本。

公开(公告)号：US20110127675A1

公开(公告)日：2011-06-02

申请号：US12628428

申请日：2009-12-01

Applicant: Henrik Ewe ,  Joachim Mahler ,  Anton Prueckl ,  Stefan Landau

Inventor： Henrik Ewe ,  Joachim Mahler ,  Anton Prueckl ,  Stefan Landau

IPC: H01L23/538 ,  H01L21/50 ,  H01L21/56

CPC classification number: H01L23/481 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/18 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2224/0557 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/05 ,  H05K1/185 ,  H05K1/188 ,  H05K3/4644 ,  H05K2201/09745 ,  H05K2201/09972 ,  H05K2203/0353 ,  H05K2203/1469 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A method of manufacturing a laminate electronic device is disclosed. One embodiment provides a carrier, the carrier defining a first main surface and a second main surface opposite to the first main surface. The carrier has a recess pattern formed in the first main surface. A first semiconductor chip is attached on one of the first and second main surface. A first insulating layer overlying the main surface of the carrier on which the first semiconductor chip is attached and the first semiconductor chip is formed. The carrier is then separated into a plurality of parts along the recess pattern.

Abstract translation: 公开了一种制造层压电子装置的方法。 一个实施例提供载体，载体限定第一主表面和与第一主表面相对的第二主表面。 载体具有形成在第一主表面中的凹陷图案。 第一半导体芯片附接在第一和第二主表面之一上。 覆盖在其上附着有第一半导体芯片的载体的主表面上的第一绝缘层和形成第一半导体芯片。 然后沿着凹槽图案将载体分离成多个部分。

公开(公告)号：US07947906B2

公开(公告)日：2011-05-24

申请号：US11528322

申请日：2006-09-28

Applicant: Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

Inventor： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC: H05K3/02 ,  H05K1/00

CPC classification number: H05K1/185 ,  H01L23/13 ,  H01L23/142 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/021 ,  H05K1/053 ,  H05K3/4608 ,  H05K2201/09745 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2203/0315 ,  Y10T29/49156 ,  H01L2924/00

Abstract: A multi-layer printed circuit board and a method of manufacturing the multi-layer printed circuit board using a metal substrate as a core member and having an electronic component embedded in the metal substrate, the method including anodizing the metal substrate such that an anodic oxide layer is formed on upper and lower sides of the metal substrate, respectively; forming an inner layer circuit on upper and lower anodic oxide layers, respectively; etching the metal substrate to form a cavity in correspondence with a position where the electronic component is to be embedded; mounting the electronic component in the cavity with a chip bond adhesive; and forming an outer layer circuit on upper and lower sides of the metal substrate, respectively, such that a multi-layer circuit is formed.

Abstract translation: 一种多层印刷电路板和使用金属基板作为核心部件并且具有嵌入在金属基板中的电子部件的多层印刷电路板的制造方法，该方法包括阳极氧化金属基板以使阳极氧化物 层分别形成在金属基板的上侧和下侧; 分别在上下阳极氧化层上形成内层电路; 蚀刻金属基板以形成与要嵌入电子部件的位置相对应的空腔; 用芯片粘合剂将电子部件安装在腔体中; 并且在金属基板的上侧和下侧分别形成外层电路，使得形成多层电路。