公开(公告)号：US20120261838A1

公开(公告)日：2012-10-18

申请号：US13531827

申请日：2012-06-25

Applicant: Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

Inventor： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

IPC: H01L25/07 ,  H01L21/60 ,  H01L23/538

CPC classification number: H01L23/5385 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00

Abstract: A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

Abstract translation: 多芯片封装包括具有第一侧面（111），相对的第二侧面（112）和从第一侧向第二侧延伸的第三侧面（213）的基板（110），第一模具（120） ）和附接到所述基板的第一侧的第二模具（130），以及邻近所述基板的第三侧并连接到所述第一模具和所述第二模具的桥接件（140） 。 基板的任何部分都不在桥下。 该桥在第一管芯和第二管芯之间形成连接。 或者，桥可以设置在衬底中的空腔（615,915）中，或者设置在衬底和裸片层（750）之间。 该桥可以构成一个有源管芯，并且可以使用引线键连接到衬底（241,841,1141,1541）。

公开(公告)号：US20110278351A1

公开(公告)日：2011-11-17

申请号：US12777476

申请日：2010-05-11

Applicant: Aleksandar Aleksov ,  Rajasekaran Swaminathan ,  Nachiket Raravikar

Inventor： Aleksandar Aleksov ,  Rajasekaran Swaminathan ,  Nachiket Raravikar

IPC: B23K31/02 ,  B23K1/20

CPC classification number: B23K1/0016 ,  B23K1/20 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8122 ,  H01L2224/81222 ,  H01L2224/81355 ,  H01L2224/81375 ,  H01L2224/81395 ,  H01L2224/81411 ,  H01L2224/81416 ,  H01L2224/81594 ,  H01L2224/81655 ,  H01L2224/81657 ,  H01L2224/8166 ,  H01L2224/81686 ,  H01L2224/81711 ,  H01L2224/81799 ,  H01L2224/83222 ,  H01L2924/00011 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/3494 ,  H05K2203/101 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01026 ,  H01L2924/053 ,  H01L2924/00 ,  H01L2224/81805

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein a magnetic particle attachment material comprising magnetic particles distributed within a carrier material may be used to achieve attachment between microelectronic components. The magnetic particle attachment material may be exposed to a magnetic field, which, through the vibration of the magnetic particles within the magnetic particle attachment material, can heat a solder material to a reflow temperature for attaching microelectronic components of the microelectronic packages.

Abstract translation: 本公开涉及制造微电子封装的领域，其中包含分布在载体材料内的磁性颗粒的磁性颗粒附着材料可用于实现微电子部件之间的附着。 磁性颗粒附着材料可能暴露于磁场，通过磁性颗粒附着材料内的磁性颗粒的振动，可以将焊料材料加热到回流温度，以附着微电子封装的微电子部件。

公开(公告)号：US20090242247A1

公开(公告)日：2009-10-01

申请号：US12079785

申请日：2008-03-28

Applicant: Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan ,  Shankar Ganapathysubramanian

Inventor： Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan ,  Shankar Ganapathysubramanian

IPC: H05K1/09 ,  H05K3/42

CPC classification number: H05K1/0201 ,  H01L21/4807 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/107 ,  H05K3/205 ,  H05K3/388 ,  H05K3/4617 ,  H05K3/4629 ,  H05K3/4647 ,  H05K2201/0175 ,  H05K2201/0187 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

Abstract translation: 描述了用于封装衬底和管芯间隔件的层或层。 层或层包括位于平面内并由金属通孔分开的多个陶瓷阱。 陶瓷井内的凹陷由介电填料材料占据。

公开(公告)号：US20230207492A1

公开(公告)日：2023-06-29

申请号：US17561559

申请日：2021-12-23

Applicant: Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Neelam PRABHU GAUNKAR ,  Telesphor KAMGAING ,  Veronica STRONG ,  Brandon RAWLINGS ,  Robert MONGRAIN ,  Beomseok CHOI

Inventor： Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Neelam PRABHU GAUNKAR ,  Telesphor KAMGAING ,  Veronica STRONG ,  Brandon RAWLINGS ,  Robert MONGRAIN ,  Beomseok CHOI

IPC: H01L23/64 ,  H01F27/40 ,  H01L23/15 ,  H01L23/498

CPC classification number: H01L23/645 ,  H01F27/40 ,  H01L23/15 ,  H01L23/49827

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a via opening is formed through a thickness of the substrate, and a first layer is over sidewalls of the via opening. In an embodiment, the first layer comprises a magnetic material. In an embodiment, a second layer is over the first layer, where the second layer is an insulator. In an embodiment, a third layer fills the via opening, where the third layer is a conductor.

公开(公告)号：US20230084379A1

公开(公告)日：2023-03-16

申请号：US17472081

申请日：2021-09-10

Applicant: Gang Duan ,  Srinivas Venkata Ramanuja Pietambaram ,  Aleksandar Aleksov ,  Tarek Ibrahim

Inventor： Gang Duan ,  Srinivas Venkata Ramanuja Pietambaram ,  Aleksandar Aleksov ,  Tarek Ibrahim

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L23/13 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L25/00

Abstract: Disclosed herein are local bridge-last architectures for heterogeneous integration applications and methods for manufacturing the same. The local bridge-last architectures may include a substrate, a first die, a second die, and a material. The substrate may define a cavity. The first and second dies may be connected to the substrate. The material may be attached to the substrate. The material may include a first portion and a second portion. The first portion of the material may be located proximate the first bump and the second portion of the material may be located proximate the second bump.

公开(公告)号：US20180308792A1

公开(公告)日：2018-10-25

申请号：US15762548

申请日：2015-09-25

Applicant: Vivek Raghunathan ,  Yonggang Li ,  Aleksandar Aleksov ,  Adel A. Elsherbini ,  Johanna M. Swan

Inventor： Vivek Raghunathan ,  Yonggang Li ,  Aleksandar Aleksov ,  Adel A. Elsherbini ,  Johanna M. Swan

IPC: H01L23/498 ,  H01L21/48 ,  B23K26/06 ,  H01L21/768 ,  B23K26/36

Abstract: Discussed generally herein are methods and devices for flexible fabrics or that otherwise include thin traces. A device can include a flexible polyimide material, and a first plurality of traces on the flexible polyimide material, wherein the first plurality of traces are patterned on the flexible polyimide material using laser spallation.

公开(公告)号：US20180097268A1

公开(公告)日：2018-04-05

申请号：US15282050

申请日：2016-09-30

Applicant: Sasha Oster ,  Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Teles Kamgaing ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

Inventor： Sasha Oster ,  Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Teles Kamgaing ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  H01P11/00 ,  H05K7/14

CPC classification number: H01P3/122 ,  H01P3/14 ,  H01P3/16 ,  H01P11/006

Abstract: A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.

公开(公告)号：US20170083051A1

公开(公告)日：2017-03-23

申请号：US14859894

申请日：2015-09-21

Applicant: Nadine L. Dabby ,  Lakshman Krishnamurthy ,  Braxton Lathrop ,  Aleksandar Aleksov ,  Adel Elsherbini ,  Sasha Oster ,  Tom L. Simmons

Inventor： Nadine L. Dabby ,  Lakshman Krishnamurthy ,  Braxton Lathrop ,  Aleksandar Aleksov ,  Adel Elsherbini ,  Sasha Oster ,  Tom L. Simmons

IPC: G06F1/16

CPC classification number: G06F1/1633 ,  H01L23/5385 ,  H01L23/5387 ,  H01L25/105 ,  H01L2225/1017 ,  H01L2225/1047 ,  H01L2924/00

Abstract: Some forms relate to a method of making a stretchable computing system. The method includes attaching a first set of conductive traces to a stretchable member; attaching a first electronic component to the first set of conductive traces; adding a first set of flexible conductors to the stretchable member such that the first set of flexible conductors is electrically connected to the first set of conductive traces; adding stretchable material to the stretchable member such that the first set of conductive traces is surrounded by the stretchable member; forming an opening in the stretchable member that exposes the first set of conductive traces; and attaching a second set of conductive traces to the stretchable member such that the second set of conductive traces fills the opening to form a via in the stretchable member that electrically connects the first set of conductive traces with the second set of conductive traces.

公开(公告)号：US20140205851A1

公开(公告)日：2014-07-24

申请号：US13748489

申请日：2013-01-23

Applicant: Ravindranath V. MAHAJAN ,  Aleksandar ALEKSOV ,  Debendra MALLIK ,  Ian A. YOUNG ,  Rajasekaran SWAMINATHAN ,  Sairam AGRAHARAM ,  John S. GUZEK

Inventor： Ravindranath V. MAHAJAN ,  Aleksandar ALEKSOV ,  Debendra MALLIK ,  Ian A. YOUNG ,  Rajasekaran SWAMINATHAN ,  Sairam AGRAHARAM ,  John S. GUZEK

IPC: B32B7/12 ,  B32B15/04 ,  H01F1/42

CPC classification number: B32B7/12 ,  B32B15/043 ,  C08K3/08 ,  C08K2201/01 ,  C09J9/02 ,  C09J11/04 ,  H01F1/083 ,  H01F1/28 ,  H01F7/0252 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/11332 ,  H01L2224/11436 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13193 ,  H01L2224/13211 ,  H01L2224/1336 ,  H01L2224/13393 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27334 ,  H01L2224/2741 ,  H01L2224/2929 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/2936 ,  H01L2224/29369 ,  H01L2224/29384 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/321 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75265 ,  H01L2224/75266 ,  H01L2224/81121 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/9211 ,  H01L2924/12042 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0338 ,  H05K2201/083 ,  Y10T428/12028 ,  Y10T428/12069 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/01078 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01062 ,  H01L2924/0106 ,  H01L2924/01026 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: An interconnect structure for electrically joining two surfaces includes magnetic attachment structures and an anisotropic conductive adhesive (ACA). Magnetic attachment structures on a first surface are magnetically attracted to magnetic attachment structures on a second surface. Opposing magnetic attachment structures are joined via an ACA, which conducts electricity when compressed, and is electrically insulating when not compressed. The magnetic attraction between opposing magnetic attachment structures generates a sufficient force to maintain compression of the intervening ACA in order to sustain a desired level of electrical conductivity between the first surface and second surface. A method for joining two surfaces using the interconnect structure is disclosed. Additionally, a magnetic anisotropic conductive adhesive having magnetic conductive particles dispersed therein is disclosed.

Abstract translation: 用于电连接两个表面的互连结构包括磁性附着结构和各向异性导电粘合剂（ACA）。 在第一表面上的磁性附着结构被磁吸引到第二表面上的磁性附着结构上。 相反的磁性连接结构通过ACA连接，ACA在压缩时传导电力，并且在未压缩时电绝缘。 相对的磁性连接结构之间的磁吸引力产生足够的力以维持中间ACA的压缩，以便在第一表面和第二表面之间维持期望的电导率水平。 公开了一种使用互连结构连接两个表面的方法。 另外，公开了一种其中分散有导电颗粒的磁各向异性导电粘合剂。

公开(公告)号：US20140176452A1

公开(公告)日：2014-06-26

申请号：US13726078

申请日：2012-12-22

Applicant: ALEKSANDAR ALEKSOV ,  RAVINDRANATH V. MAHAJAN ,  BRIAN S. DOYLE

Inventor： ALEKSANDAR ALEKSOV ,  RAVINDRANATH V. MAHAJAN ,  BRIAN S. DOYLE

IPC: G06F3/041

CPC classification number: G06F3/016 ,  G06F3/014 ,  G06F3/0412 ,  G06F3/04812 ,  G06F3/0488

Abstract: A system and method for providing tactile feedback in a user interface. The system includes a tactile feedback assembly configured to communicate with a user interface of an electronic device. The tactile feedback assembly is configured to provide mechanical and/or nerve stimulation to a user during user interaction (e.g. navigation, input of data, etc.) of the user interface. The mechanical and/or nerve stimulation is configured to provide a user with tactile sensation (in the form of the sense of touch) in response to user interaction with the user interface, including, but not limited to, sense of texture and sense of pressure.

Abstract translation: 一种用于在用户界面中提供触觉反馈的系统和方法。 该系统包括被配置为与电子设备的用户界面通信的触觉反馈组件。 触觉反馈组件被配置为在用户界面的用户交互（例如，导航，数据输入等）期间向用户提供机械和/或神经刺激。 机械和/或神经刺激被配置为响应于用户与用户界面的交互而向用户提供触觉（以触觉的形式），包括但不限于纹理感和压力感 。