公开(公告)号：US20160044786A1

公开(公告)日：2016-02-11

申请号：US14456606

申请日：2014-08-11

申请人： Rajasekaran Swaminathan ,  Sairam Agraharam ,  Amruthavalli Pallavi Alur ,  Ram Viswanath ,  Wei-Lun Kane Jen

发明人： Rajasekaran Swaminathan ,  Sairam Agraharam ,  Amruthavalli Pallavi Alur ,  Ram Viswanath ,  Wei-Lun Kane Jen

IPC分类号： H05K1/11 ,  H05K1/09 ,  H05K3/40 ,  H01L23/00

CPC分类号： H05K1/112 ,  H01L23/5381 ,  H01L23/5385 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/131 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/1403 ,  H01L2224/16165 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/16501 ,  H01L2224/29082 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81444 ,  H01L2224/81464 ,  H01L2224/83101 ,  H01L2224/83191 ,  H05K1/09 ,  H05K1/113 ,  H05K1/185 ,  H05K3/243 ,  H05K3/244 ,  H05K3/4046 ,  H05K2201/09472 ,  H05K2201/10189 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01079

摘要： This disclosure relates generally to an electronic package and methods that include an electrically conductive pad, a package insulator layer including a substantially non-conductive material, the package insulator layer being substantially planar, and a via. The via may be formed within the package insulator layer and electrically coupled to the electrically conductive pad. The via may include a conductor extending vertically through at least part of the package insulator layer and having a first end proximate the electrically conductive pad and a second end opposite the first end and a finish layer secured to the second end of the conductor, the finish layer including a gold compound.

摘要翻译： 本公开一般涉及电子封装和方法，其包括导电焊盘，包括基本上不导电的材料的封装绝缘体层，封装绝缘体层基本上是平面的，以及通孔。 通孔可以形成在封装绝缘体层内并电耦合到导电焊盘。 通孔可以包括垂直延伸穿过封装绝缘体层的至少一部分并且具有靠近导电焊盘的第一端和与第一端相对的第二端和固定到导体的第二端的光洁度层的导体， 层包括金化合物。

公开(公告)号：US08939347B2

公开(公告)日：2015-01-27

申请号：US12768842

申请日：2010-04-28

申请人： Rajasekaran Swaminathan ,  Ravindranath V. Mahajan

发明人： Rajasekaran Swaminathan ,  Ravindranath V. Mahajan

IPC分类号： B23K31/02 ,  B23K35/12 ,  H01L23/498 ,  B82Y25/00 ,  H01L23/00

CPC分类号： H01L23/49816 ,  B82Y25/00 ,  H01L23/49866 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/13211 ,  H01L2224/13239 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81385 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2224/81805

摘要： The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.

摘要翻译： 本公开涉及制造微电子封装的领域，其中分布在焊膏内的磁性颗粒可用于形成磁性金属间化合物互连。 金属间化合物互连可以暴露于磁场，磁场可以将焊料材料加热到回流温度，以附接包括微电子封装的微电子部件。

公开(公告)号：US08287996B2

公开(公告)日：2012-10-16

申请号：US12653791

申请日：2009-12-21

申请人： Dingying Xu ,  Leonel R. Arana ,  Nachiket R. Raravikar ,  Mohit Mamodia ,  Rajasekaran Swaminathan ,  Rahul Manepalli

发明人： Dingying Xu ,  Leonel R. Arana ,  Nachiket R. Raravikar ,  Mohit Mamodia ,  Rajasekaran Swaminathan ,  Rahul Manepalli

IPC分类号： B32B27/32

CPC分类号： H01L23/3737 ,  H01L24/81 ,  H01L2924/12042 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/265 ,  Y10T428/3154 ,  H01L2924/00

摘要： A coating for a microelectronic device comprises a polymer film (131) containing a filler material (232). The polymer film has a thermal conductivity greater than 3 W/m·K and a thickness (133) that does not exceed 10 micrometers. The polymer film may be combined with a dicing tape (310) to form a treatment (300) that simplifies a manufacturing process for a microelectronic package (100) and may be used in order to manage a thermal profile of the microelectronic device.

摘要翻译： 用于微电子器件的涂层包括含有填料（232）的聚合物膜（131）。 聚合物膜的热导率大于3W / m·K，厚度（133）不超过10微米。 聚合物膜可以与切割带（310）组合以形成简化微电子封装（100）的制造工艺的处理（300），并且可以使用该处理（300）来管理微电子器件的热分布。

公开(公告)号：US20110291276A1

公开(公告)日：2011-12-01

申请号：US12787968

申请日：2010-05-26

申请人： Rajasekaran Swaminathan ,  Ravindranath V. Mahajan

发明人： Rajasekaran Swaminathan ,  Ravindranath V. Mahajan

IPC分类号： H01L29/40 ,  H01L21/00

CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/76877 ,  H01L21/76883 ,  H01L21/76898 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/05552

摘要： The present disclosure relates to the field of fabricating microelectronic packages, wherein microelectronic components of the microelectronic packages may have sintered conductive vias comprising sintered metal and magnetic particles.

摘要翻译： 本公开涉及制造微电子封装的领域，其中微电子封装的微电子部件可以具有包括烧结金属和磁性颗粒的烧结导电通孔。

公开(公告)号：US20110159228A1

公开(公告)日：2011-06-30

申请号：US12655366

申请日：2009-12-29

申请人： Rajasekaran Swaminathan ,  Hong Dong ,  Sandeep Razdan ,  Nisha Ananthakrishana ,  Rahul Manepalli

发明人： Rajasekaran Swaminathan ,  Hong Dong ,  Sandeep Razdan ,  Nisha Ananthakrishana ,  Rahul Manepalli

IPC分类号： B32B5/16 ,  B05D5/00 ,  C08L63/00

CPC分类号： H01L23/293 ,  C08L63/00 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81911 ,  H01L2924/14 ,  Y10T428/23 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/31529 ,  Y10T428/31678 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/0665

摘要： Methods and associated structures of forming underfill material are described. Those methods may include applying an underfill to an interconnect structure comprising residue from a no clean flux, wherein the underfill comprises at least one of a functionalized nanofiller and a micron-sized filler.

摘要翻译： 描述形成底部填充材料的方法和相关结构。 这些方法可以包括将底部填充物施加到包含来自不干净焊剂的残余物的互连结构，其中底部填充物包括官能化纳米填料和微米级填料中的至少一种。

公开(公告)号：US07906376B2

公开(公告)日：2011-03-15

申请号：US12164996

申请日：2008-06-30

申请人： Rajasekaran Swaminathan

发明人： Rajasekaran Swaminathan

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L23/10 ,  H01L23/295 ,  H01L23/367 ,  H01L23/42 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83222 ,  H01L2224/8385 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/00 ,  H01L2924/3512

摘要： A semiconductor package is described. The semiconductor package includes a substrate and an integrated heat spreader disposed above and coupled with the substrate. A cavity is disposed between the substrate and the integrated heat spreader. A semiconductor die is disposed above the substrate and in the cavity. An array of first-level solder joints is disposed between the substrate and the semiconductor die. A layer of magnetic particle-based composite material is also disposed in the cavity.

摘要翻译： 描述半导体封装。 半导体封装包括设置在基板上方并与基板耦合的集成散热器。 空腔设置在基板和集成散热器之间。 半导体管芯设置在衬底上方和空腔中。 在衬底和半导体管芯之间设置一系列一级焊点。 一层磁性颗粒基复合材料也设置在空腔中。

公开(公告)号：US20140322932A1

公开(公告)日：2014-10-30

申请号：US13870938

申请日：2013-04-25

申请人： Donald T. Tran ,  Rajasekaran Swaminathan

发明人： Donald T. Tran ,  Rajasekaran Swaminathan

IPC分类号： H01R13/627 ,  H01R13/652 ,  H01R4/48

CPC分类号： H01R12/721 ,  H01R12/714 ,  H01R12/81 ,  H01R13/6581 ,  H01R13/6592 ,  H01R43/205 ,  Y10T29/49174 ,  Y10T29/49176

摘要： Embodiments of the present disclosure are directed to an interconnect cable including a edge finger connector, and associated configurations and methods. The edge finger connector may be disposed at a first end of the interconnect cable and may connect the interconnect cable to an edge finger included in or coupled to a package substrate. The package substrate may be included in a processor package assembly, and a processor may be mounted on the substrate. The interconnect cable may include one or more elongate conductors, with contacts directly coupled to respective conductors. A second connector may be disposed at a second end of the interconnect cable, and may couple the interconnect cable to a small form-factor pluggable (SFP) case that is configured to connect the interconnect cable to an SFP cable. Other embodiments may be described and claimed.

摘要翻译： 本公开的实施例涉及包括边缘指状连接器以及相关联的配置和方法的互连电缆。 边缘指状连接器可以设置在互连电缆的第一端处，并且可以将互连电缆连接到包括在封装衬底中或耦合到封装衬底的边缘指状物。 封装衬底可以包括在处理器封装组件中，并且处理器可以安装在衬底上。 互连电缆可以包括一个或多个细长导体，其中触点直接耦合到相应的导体。 第二连接器可以设置在互连电缆的第二端处，并且可以将互连电缆耦合到被配置为将互连电缆连接到SFP电缆的小型可插拔（SFP）壳体。 可以描述和要求保护其他实施例。

公开(公告)号：US20140205851A1

公开(公告)日：2014-07-24

申请号：US13748489

申请日：2013-01-23

申请人： Ravindranath V. MAHAJAN ,  Aleksandar ALEKSOV ,  Debendra MALLIK ,  Ian A. YOUNG ,  Rajasekaran SWAMINATHAN ,  Sairam AGRAHARAM ,  John S. GUZEK

发明人： Ravindranath V. MAHAJAN ,  Aleksandar ALEKSOV ,  Debendra MALLIK ,  Ian A. YOUNG ,  Rajasekaran SWAMINATHAN ,  Sairam AGRAHARAM ,  John S. GUZEK

IPC分类号： B32B7/12 ,  B32B15/04 ,  H01F1/42

CPC分类号： B32B7/12 ,  B32B15/043 ,  C08K3/08 ,  C08K2201/01 ,  C09J9/02 ,  C09J11/04 ,  H01F1/083 ,  H01F1/28 ,  H01F7/0252 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/11332 ,  H01L2224/11436 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13193 ,  H01L2224/13211 ,  H01L2224/1336 ,  H01L2224/13393 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27334 ,  H01L2224/2741 ,  H01L2224/2929 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/2936 ,  H01L2224/29369 ,  H01L2224/29384 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/321 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75265 ,  H01L2224/75266 ,  H01L2224/81121 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/9211 ,  H01L2924/12042 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0338 ,  H05K2201/083 ,  Y10T428/12028 ,  Y10T428/12069 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/01078 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01062 ,  H01L2924/0106 ,  H01L2924/01026 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： An interconnect structure for electrically joining two surfaces includes magnetic attachment structures and an anisotropic conductive adhesive (ACA). Magnetic attachment structures on a first surface are magnetically attracted to magnetic attachment structures on a second surface. Opposing magnetic attachment structures are joined via an ACA, which conducts electricity when compressed, and is electrically insulating when not compressed. The magnetic attraction between opposing magnetic attachment structures generates a sufficient force to maintain compression of the intervening ACA in order to sustain a desired level of electrical conductivity between the first surface and second surface. A method for joining two surfaces using the interconnect structure is disclosed. Additionally, a magnetic anisotropic conductive adhesive having magnetic conductive particles dispersed therein is disclosed.

摘要翻译： 用于电连接两个表面的互连结构包括磁性附着结构和各向异性导电粘合剂（ACA）。 在第一表面上的磁性附着结构被磁吸引到第二表面上的磁性附着结构上。 相反的磁性连接结构通过ACA连接，ACA在压缩时传导电力，并且在未压缩时电绝缘。 相对的磁性连接结构之间的磁吸引力产生足够的力以维持中间ACA的压缩，以便在第一表面和第二表面之间维持期望的电导率水平。 公开了一种使用互连结构连接两个表面的方法。 另外，公开了一种其中分散有导电颗粒的磁各向异性导电粘合剂。

公开(公告)号：US20140175644A1

公开(公告)日：2014-06-26

申请号：US13721329

申请日：2012-12-20

申请人： Sriram Srinivasan ,  Ram S. Viswanath ,  Paul R. Start ,  Rajen S. Sidhu ,  Rajasekaran Swaminathan

发明人： Sriram Srinivasan ,  Ram S. Viswanath ,  Paul R. Start ,  Rajen S. Sidhu ,  Rajasekaran Swaminathan

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/81 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81801 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/20105 ,  H01L2924/2064 ,  H01L2924/20643 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00

摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage, attaching the assembled device and patch substrate to an interposer to form a package structure, and then reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure.

摘要翻译： 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法和结构可以包括将装置附接到贴片基板，其中组装的装置和贴片基板包括翘曲，将组装的装置和贴片基板附接到插入件以形成封装结构，然后在温度下回流封装结构 低于大约200摄氏度以形成基本平坦的包装结构。

公开(公告)号：US20130224444A1

公开(公告)日：2013-08-29

申请号：US13855100

申请日：2013-04-02

申请人： ALEKSANDAR ALEKSOV ,  RAJASEKARAN SWAMINATHAN ,  TING ZHONG

发明人： ALEKSANDAR ALEKSOV ,  RAJASEKARAN SWAMINATHAN ,  TING ZHONG

IPC分类号： H01F1/01

CPC分类号： H01F1/01 ,  B23K1/0016 ,  B23K1/20 ,  H01L24/05 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05547 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13584 ,  H01L2224/16225 ,  H01L2224/75264 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2224/05552

摘要： The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and attach microelectronic components of the microelectronic package.

摘要翻译： 本公开涉及制造微电子封装的领域，其中微电子封装的部件可具有包括磁性部件和金属部件的磁性附接结构。 磁性附着结构可能暴露于磁场，通过磁性部件的振动可以加热磁性附着结构，并且当与焊料材料接触时，磁性附着结构可以回流焊料材料并附着微电子部件 微电子封装。