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162 条记录 (耗时 0.03 秒)

    Greensheet carriers and processing thereof
    32.
    发明授权
    Greensheet carriers and processing thereof 失效
    格林板载体及其加工

    公开(公告)号：US06607620B2

    公开(公告)日：2003-08-19

    申请号：US09757071

    申请日：2001-01-08

    申请人： John U. Knickerbocker ,  Govindarajan Natarajan

    发明人： John U. Knickerbocker ,  Govindarajan Natarajan

    IPC分类号： B32B3118

    CPC分类号： B32B18/00 ,  B32B37/22 ,  B32B38/04 ,  B32B2038/042 ,  B32B2305/38 ,  B32B2305/77 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/38 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/561 ,  C04B2237/567 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0169 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/108 ,  Y10T428/161 ,  Y10T428/23 ,  Y10T428/24793 ,  Y10T428/24926

    摘要： A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that the frame and greensheet side are substantially coplanar.

    摘要翻译： 处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工 毛坯和粘合框架，并从加工的毛坯上移除框架。 毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架 一个其他图案化的毛坯和粘合框架，并且层压绿叶片。 在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。 框架与毛坯的接合可以通过层压或通过粘合剂或其他方式进行。 优选地，框架具有小于毛坯厚度的厚度。 框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。 框架可以施加到毛坯的一侧，并且被压入毛坯一侧，使得框架和毛坯面基本上共面。

    Decoupling capacitor method and structure using metal based carrier
    33.
    发明授权
    Decoupling capacitor method and structure using metal based carrier 有权
    使用金属载体去耦电容器的方法和结构

    公开(公告)号：US06461493B1

    公开(公告)日：2002-10-08

    申请号：US09472136

    申请日：1999-12-23

    申请人： Mukta S. Farooq ,  Shaji Farooq ,  John U. Knickerbocker ,  Robert A. Rita ,  Srinivasa N. Reddy

    发明人： Mukta S. Farooq ,  Shaji Farooq ,  John U. Knickerbocker ,  Robert A. Rita ,  Srinivasa N. Reddy

    IPC分类号： C25D502

    CPC分类号： H05K3/445 ,  H01G4/10 ,  H05K1/053 ,  H05K1/162 ,  H05K3/4069 ,  H05K2201/09554 ,  H05K2203/0315 ,  H05K2203/1142

    摘要： A process for fabricating a structure using a metal carrier and forming a double capacitor structure. The process comprises forming a first via hole through the metal carrier, forming a dielectric layer around the metal carrier and inside the first via hole, forming a second via hole through the dielectric layer and the metal carrier, and filling at least one of the via holes with conductive material. In one preferred embodiment, the process further comprises forming a third via hole through the metal carrier before the forming of a dielectric layer, wherein the dielectric layer is formed around the metal carrier, inside the first via hole, and inside the third via hole. The first via hole, the second via hole, and the third via hole are all filled with a conductive material. In one preferred embodiment, the dielectric layer comprises a top surface opposed to a bottom surface, and electrodes are formed on at least one of the top surface and the bottom surface of the dielectric layer.

    摘要翻译： 一种使用金属载体制造结构并形成双电容器结构的方法。 该工艺包括形成通过金属载体的第一通孔，在金属载体周围形成电介质层，并在第一通孔内部形成介电层，形成穿过电介质层和金属载体的第二通孔，并填充至少一个通孔 孔与导电材料。 在一个优选实施例中，该方法还包括在形成电介质层之前通过金属载体形成第三通孔，其中介电层围绕金属载体形成在第一通孔的内部，以及在第三通孔的内部。 第一通孔，第二通孔和第三通孔均填充有导电材料。 在一个优选实施例中，电介质层包括与底表面相对的顶表面，并且在介电层的顶表面和底表面中的至少一个上形成电极。

    Powdered metallic sheet method for deposition of substrate conductors
    34.
    发明授权
    Powdered metallic sheet method for deposition of substrate conductors 失效
    用于沉积衬底导体的粉末金属片方法

    公开(公告)号：US06402866B1

    公开(公告)日：2002-06-11

    申请号：US09410474

    申请日：1999-09-30

    申请人： Jon A. Casey ,  John U. Knickerbocker ,  David C. Long ,  Brenda L. Peterson

    发明人： Jon A. Casey ,  John U. Knickerbocker ,  David C. Long ,  Brenda L. Peterson

    IPC分类号： B32B3126

    CPC分类号： H05K3/046 ,  H01L21/4867 ,  Y10T29/49163

    摘要： A method and apparatus are provided for forming metal circuit patterns and other designs on greensheets and other substrates. The method and apparatus utilize a metal containing transfer sheet whereby selected portions of the metal containing transfer sheet are transferred to the greensheet forming the desired circuit pattern and then the transfer sheet removed. The metal containing transfer sheet may contain a release layer. Transfer methods include stamping, hot rolling, laser beam, heat, etc. and combinations thereof The transfer sheet may also have a stratified or graded vertical profile so that different conductivities or other circuit properties (transfer sheet adhesion, etc.) may be obtained in the formed pattern on the substrate.

    摘要翻译： 提供了一种方法和装置，用于在刮板和其它基底上形成金属电路图案和其它设计。 该方法和设备利用含金属的转印片，由此将含金属转印片的选定部分转移到形成所需电路图案的毛坯上，然后移除转印片。 含金属的转印片可以含有剥离层。 转印方法包括冲压，热轧，激光束，热等及其组合。转印片材还可以具有分层或分级的垂直轮廓，从而可以获得不同的电导率或其它电路性质（转印片粘合等） 衬底上形成的图案。

    Structure and process for making substrate packages for high frequency application
    35.
    发明授权
    Structure and process for making substrate packages for high frequency application 有权
    制造高频应用基板封装的结构和工艺

    公开(公告)号：US06291272B1

    公开(公告)日：2001-09-18

    申请号：US09471563

    申请日：1999-12-23

    申请人： Ajay P. Giri ,  John U. Knickerbocker ,  David C. Long ,  Subhash L. Shinde ,  Lisa M. Studzinski ,  Rao V. Vallabhaneni

    发明人： Ajay P. Giri ,  John U. Knickerbocker ,  David C. Long ,  Subhash L. Shinde ,  Lisa M. Studzinski ,  Rao V. Vallabhaneni

    IPC分类号： H01L2144

    CPC分类号： H01L21/4867 ,  H01L21/4857 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/15311

    摘要： A process for fabricating a microelectronic structure. The process comprises processing a metal carrier having a top surface and a bottom surface, wherein the top surface and the bottom surface are processed to promote adhesion, forming a dielectric layer around the metal carrier, wherein the dielectric layer substantially covers the top surface and the bottom surface of the metal carrier, and applying a first patterned layer of conductive material to the microelectronic structure. In one preferred embodiment, the process further comprises comprising sintering the metal carrier, the dielectric layer, and the first patterned layer of conductive material. In one preferred embodiment, the process further comprises forming a via hole through the metal carrier before the forming of the dielectric layer around the metal carrier, wherein the forming of the dielectric layer comprises forming the dielectric layer inside the via hole.

    摘要翻译： 一种制造微电子结构的方法。 该方法包括处理具有顶表面和底表面的金属载体，其中处理顶表面和底表面以促进粘附，在金属载体周围形成电介质层，其中电介质层基本上覆盖顶表面和 金属载体的底表面，以及将第一图案化的导电材料层施加到微电子结构。 在一个优选实施例中，该方法还包括包括烧结金属载体，电介质层和导电材料的第一图案化层。 在一个优选实施例中，该方法还包括在金属载体周围形成电介质层之前通过金属载体形成通孔，其中介电层的形成包括在通孔内形成电介质层。

    Aqueous cleaning of paste residue
    36.
    发明授权
    Aqueous cleaning of paste residue 失效
    糊状残留物的水性清洗

    公开(公告)号：US06277799B1

    公开(公告)日：2001-08-21

    申请号：US09344886

    申请日：1999-06-25

    申请人： Krishna G. Sachdev ,  James N. Humenik ,  John U. Knickerbocker ,  Glenn A. Pomerantz

    发明人： Krishna G. Sachdev ,  James N. Humenik ,  John U. Knickerbocker ,  Glenn A. Pomerantz

    IPC分类号： C11D172

    CPC分类号： C11D11/0047 ,  C11D1/008 ,  C11D1/02 ,  C11D1/24 ,  C11D1/29 ,  C11D1/66 ,  C11D1/662 ,  C11D1/72 ,  C11D1/88 ,  C11D1/90 ,  C11D3/2086 ,  H05K3/1216 ,  H05K3/26

    摘要： This invention relates to an aqueous cleaning method for removal of metal-organic composite paste residue from the surface of components, such as, screening masks, associated paste screening equipment, substrates, to name a few. The invention is particularly concerned with aqueous alkaline cleaning solutions comprising alkali metal salt and/or quaternary ammonium salt of an organic acid preferably &agr;-hydroxy carboxylic acid in the presence of excess alkali and optionally a surface active agent for use in cleaning components, such as, screening masks, associated screening equipment, substrates, etc., which are used in the production of electronic components.

    摘要翻译： 本发明涉及从组分表面除去金属 - 有机复合糊状残留物的水性清洗方法，例如筛选掩模，相关的糊状物筛选设备，底物等等。 本发明特别涉及含有碱金属盐和/或季铵盐的含水碱性清洗溶液，所述碱性金属盐和/或有机酸优选为α-羟基羧酸的季铵盐，所述碱性金属盐和/或季铵盐在过量碱和任选的表面活性剂存在下用于清洁组分，例如 ，筛选掩模，相关筛选设备，基材等，用于生产电子元件。