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70 条记录 (耗时 0.022 秒)

    Image sensor ball grid array package and the fabrication thereof
    32.
    发明授权
    Image sensor ball grid array package and the fabrication thereof 有权
    图像传感器球栅阵列封装及其制造

    公开(公告)号：US06566745B1

    公开(公告)日：2003-05-20

    申请号：US09538385

    申请日：2000-03-29

    申请人： Eric Beyne ,  Steve Lerner

    发明人： Eric Beyne ,  Steve Lerner

    IPC分类号： H01L2302

    CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/16235 ,  H01L2924/00

    摘要： The present invention is related to an image sensor packaging technique based on a Ball Grid Array (BGA) IC packaging technique, further referred to as image sensor ball grid array (ISBGA). A transparent cover is attached to a semiconductor substrate. Depending on the method of attaching the cover to the substrate a hermetic or non-hermitic sealing is obtained. The obtained structure can be connected trough wire-bonding or flip chip connection.

    摘要翻译： 本发明涉及一种基于球形阵列（BGA）IC封装技术的图像传感器封装技术，还被称为图像传感器球栅阵列（ISBGA）。 透明盖附接到半导体衬底。 根据将盖子附着到基板的方法，获得密封或非密封密封。 所获得的结构可以通过引线键合或倒装芯片连接来连接。

    Imager or particle or radiation detector and method of manufacturing the same
    34.
    发明授权
    Imager or particle or radiation detector and method of manufacturing the same 失效
    成像仪或粒子或辐射探测器及其制造方法

    公开(公告)号：US06362484B1

    公开(公告)日：2002-03-26

    申请号：US09247627

    申请日：1999-02-10

    申请人： Eric Beyne ,  Amos Breskin ,  Rachel Chechik ,  Stefaan Tavernier ,  Walter Van Doninck

    发明人： Eric Beyne ,  Amos Breskin ,  Rachel Chechik ,  Stefaan Tavernier ,  Walter Van Doninck

    IPC分类号： G01J528

    CPC分类号： G01T1/2935 ,  H01J47/02

    摘要： The present invention may provide a particle or radiation detector or imager which may be used for accurate recording of medical (2-D) X-ray images. The imager includes at least one detector panel. The detector panel includes a microgap detector with an array of pixel electrodes of a novel form. Each pixel electrode is insulated from a planar cathode by means of an insulating layer. Each pixel electrode is connected to an underlying contact by means of a via hole in the insulating layer. The insulating layer is preferably conformal with the electrodes. The underlying contact is connected to an electronic measuring element which preferably lies underneath the electrode and is about the same size as the electrode. The measuring element may be a storage device, a digital counter or similar. A switching transistor is connected to the measuring device. The switching transistor may be a thin film transistor. Alternatively, both measuring element and transistor may be formed in a single crystal semiconductor, e.g. a VLSI, and a complete imager formed from several detector panels in an array. The drift electrode of the microgap detector preferably includes a photocathode. The photocathode may be directly evaporated onto a phosphor.

    摘要翻译： 本发明可以提供可用于医疗（2-D）X射线图像的精确记录的粒子或辐射检测器或成像器。 成像器包括至少一个检测器面板。 检测器面板包括具有新颖形式的像素电极阵列的微隙检测器。 每个像素电极通过绝缘层与平面阴极绝缘。 每个像素电极通过绝缘层中的通孔连接到下面的触点。 绝缘层优选与电极保持一致。底层触点连接到电子测量元件，电子测量元件优选地位于电极下方并且与电极大致相同的尺寸。 测量元件可以是存储装置，数字计数器等。 开关晶体管连接到测量装置。 开关晶体管可以是薄膜晶体管。 或者，测量元件和晶体管都可以形成在单晶半导体中，例如， VLSI，以及由阵列中的多个检测器面板形成的完整成像器。微间隙检测器的漂移电极优选包括光电阴极。 光电阴极可以直接蒸发到磷光体上。

    Device for cooling integrated circuits
    37.
    发明授权
    Device for cooling integrated circuits 有权
    集成电路冷却装置

    公开(公告)号：US08493736B2

    公开(公告)日：2013-07-23

    申请号：US13151021

    申请日：2011-06-01

    申请人： Herman Oprins ,  Bart Vandevelde ,  Paolo Fiorini ,  Eric Beyne ,  Joeri De Vos ,  Bivragh Majeed

    发明人： Herman Oprins ,  Bart Vandevelde ,  Paolo Fiorini ,  Eric Beyne ,  Joeri De Vos ,  Bivragh Majeed

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present disclosure is related to a device for cooling the surface of a semiconductor device such as an integrated circuit or the like, the cooling device comprising a plurality of channels (3′) which are non-parallel to the surface to be cooled, each channel comprising a plurality of separate electrodes (5) or equivalent conducting areas arranged along the length of each channel, the device further comprising or being connectable to means for applying a voltage to the electrodes or conducting areas in each channel according to a sequence, the sequence being such that a droplet (6) of cooling liquid in a channel may be moved from one electrode to the next, thereby transporting the droplet from the top of the channel to the bottom, from where the droplet impinges on the surface to be cooled.

    摘要翻译： 本公开涉及用于冷却诸如集成电路等的半导体器件的表面的器件，该冷却器件包括与待冷却表面不平行的多个通道（3'），每个通道 通道包括沿着每个通道的长度布置的多个单独的电极（5）或等效的导电区域，所述设备还包括或可连接到根据序列向每个通道中的电极或导电区域施加电压的装置， 序列使得通道中的冷却液体的液滴（6）可以从一个电极移动到下一个电极，从而将液滴从通道的顶部输送到底部，从而液滴撞击在待冷却的表面上 。