公开(公告)号：US20100276803A1

公开(公告)日：2010-11-04

申请号：US12771507

申请日：2010-04-30

申请人： Takayuki Higuchi ,  Yoshihiro Tomura

发明人： Takayuki Higuchi ,  Yoshihiro Tomura

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/83 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/838 ,  H01L2224/92225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1579 ,  H01L2924/3011 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor element (101) includes an electrode section (102) and a bump (105), a circuit board (103) includes an electrode section (104) and a bump (106), and a conductive filler (108) having a lower melting point than the melting points of the bumps (105, 106) electrically bonds the bumps (105, 106) to each other.

摘要翻译： 半导体元件（101）包括电极部分（102）和凸起（105），电路板（103）包括电极部分（104）和凸块（106），以及具有下部电极部分 熔点高于凸点（105,106）的熔点将凸块（105,106）彼此电连接。

公开(公告)号：US20100213609A1

公开(公告)日：2010-08-26

申请号：US12707872

申请日：2010-02-18

申请人： Shigeru Kondou ,  Yoshihiro Tomura

发明人： Shigeru Kondou ,  Yoshihiro Tomura

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/05557 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1184 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/81204 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068 ,  H05K2203/0292 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/207

摘要： A solder bump and a conductive connection structure are provided which can conductively connect a semiconductor chip and a substrate with high connection reliability. Filler 5 is contained in a solder bump 6 and a solder joint 17 which connect a connection electrode 3 of a semiconductor chip 2 and a substrate 11, and the filler has a larger density on the side of the connection electrode 3 than on the side of the substrate 11 in the solder joint 17. Therefore, in the cooling solidification of solder, the shrinkage of the solder joint 17 near the connection electrode 3 of the semiconductor chip 2 is reduced by the filler 5 and the occurrence of a stress is reduced on the peripheral portion of the connection electrode 3, thereby preventing the occurrence of cracks near the joint.

摘要翻译： 提供了一种焊料凸块和导电连接结构，其可以以高连接可靠性导电地连接半导体芯片和基板。 填料5包含在焊料凸块6和连接半导体芯片2的连接电极3和基板11的焊接接头17上，并且填料在连接电极3的一侧具有比在侧面 因此，在焊料的冷却固化中，通过填料5减少了半导体芯片2的连接电极3附近的焊料接合部17的收缩，并且减少了应力的发生 连接电极3的周边部分，从而防止在接头附近发生裂纹。

公开(公告)号：US20100187675A1

公开(公告)日：2010-07-29

申请号：US12692872

申请日：2010-01-25

申请人： Kazumichi Shimizu ,  Yoshihiro Tomura ,  Masahiro Ono

发明人： Kazumichi Shimizu ,  Yoshihiro Tomura ,  Masahiro Ono

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L21/563 ,  H01L21/561 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/0401

摘要： This semiconductor device is a semiconductor device in which a semiconductor element is flip-chip mounted onto a circuit substrate and the semiconductor element is covered and sealed with a sealing resin. A recess portion is formed in the sealing resin on a surface opposite to the mounting surface of the semiconductor element. Warping of the semiconductor device is reduced by the action of this recess portion.

摘要翻译： 该半导体装置是将半导体元件倒装芯片安装在电路基板上的半导体装置，半导体元件被密封树脂​​覆盖并密封。 在与半导体元件的安装表面相对的表面上的密封树脂中形成凹部。 通过该凹部的作用可以减小半导体器件的翘曲。

公开(公告)号：US20090215287A1

公开(公告)日：2009-08-27

申请号：US11918121

申请日：2006-07-06

申请人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

发明人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

IPC分类号： H01R12/14

CPC分类号： H05K3/368 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/2018

摘要： A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

摘要翻译： 衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。 基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

公开(公告)号：US20080139013A1

公开(公告)日：2008-06-12

申请号：US11995339

申请日：2006-04-17

申请人： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

发明人： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

IPC分类号： H01R12/00 ,  H01R43/00

CPC分类号： H01R12/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1627 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/145 ,  H05K3/28 ,  H05K3/284 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09018 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49117 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

摘要翻译： 安装有电子部件（16）和第二电路板（2）的第一电路板（1）通过互连板（3）垂直连接，其中焊盘电极（5）的端子部分（6） 在互连板（3）上的埋设在互连板（3）的端接材料（9）中。 因此，可以抑制或缓冲由于高密度安装，热冲击或落下冲击而在上下电路板和焊盘电极之间作用的剥离应力或剪切应力的剥离或破裂的机会，从而导致高可靠性。

公开(公告)号：US06613180B2

公开(公告)日：2003-09-02

申请号：US10114089

申请日：2002-04-01

申请人： Yoshitaka Sunagawa ,  Yoshitake Hayashi ,  Masayoshi Koyama ,  Yoshihiro Tomura ,  Toshiyuki Kojima ,  Osamu Shibata ,  Ryuichi Saito

发明人： Yoshitaka Sunagawa ,  Yoshitake Hayashi ,  Masayoshi Koyama ,  Yoshihiro Tomura ,  Toshiyuki Kojima ,  Osamu Shibata ,  Ryuichi Saito

IPC分类号： B32B3100

CPC分类号： H01L21/67132 ,  H01L21/50 ,  H01L21/563 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/3025 ,  Y10T156/1089 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for fabricating a semiconductor-mounting body having at least one semiconductor device mounted on a substrate and a sealing resin set in the gap between the substrate and the semiconductor device, has a first step of setting a flexibly deformable sheet on a face of the semiconductor device not facing the substrate; and a second step of generating an air-pressure difference between the side where the semiconductor device is not present and the side where the semiconductor device is present on the basis of the sheet so that the air pressure at the side where the semiconductor device is not present becomes higher than the side where the semiconductor device is present and pressurizing the semiconductor device by the sheet after the first step.

摘要翻译： 一种制造半导体安装体的方法，其具有安装在基板上的至少一个半导体器件和设置在基板和半导体器件之间的间隙中的密封树脂，具有将柔性可变形薄片设置在半导体的表面上的第一步骤 设备不面向基板; 以及基于片材在半导体器件不存在的一侧和存在半导体器件的一侧之间产生气压差的第二步骤，使得半导体器件不存在的一侧的空气压力 变得高于存在半导体器件的一侧并且在第一步骤之后通过片材对半导体器件加压。

公开(公告)号：US5628919A

公开(公告)日：1997-05-13

申请号：US439980

申请日：1995-05-12

申请人： Yoshihiro Tomura ,  Yoshihiro Bessho ,  Yasuhiko Hakotani

发明人： Yoshihiro Tomura ,  Yoshihiro Bessho ,  Yasuhiko Hakotani

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/485 ,  H01L23/498 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/40 ,  B44C1/22

CPC分类号： H05K3/4007 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H05K3/321 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/181 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/10568 ,  H05K2201/10719 ,  H05K2201/10984 ,  H05K2203/0577 ,  H05K2203/167 ,  H05K3/243

摘要： A chip carrier according to the present invention includes: a carrier body including an upper face, a lower face, and an internal conductor; and a plurality of terminal electrodes formed on the upper face of the carrier body, the plurality of terminal electrodes electrically connecting an LSI chip to the internal conductor. A plurality of concave portions for electrically connecting a plurality of electrodes on a circuit substrate to the internal conductor are provided on the lower face of the carrier body, the concave portions being electrically connected to the internal conductor.

摘要翻译： 根据本发明的芯片载体包括：载体，其包括上表面，下表面和内导体; 以及形成在所述载体主体的上表面上的多个端子电极，所述多个端子电极将LSI芯片电连接到所述内部导体。 多个用于将电路基板上的多个电极电连接到内部导体的凹部设置在载体主体的下表面上，凹部电连接到内部导体。

公开(公告)号：US5004364A

公开(公告)日：1991-04-02

申请号：US510080

申请日：1990-04-17

申请人： Yoshihiro Tomura ,  Keiji Maruhashi ,  Nobuyuki Ozawa

发明人： Yoshihiro Tomura ,  Keiji Maruhashi ,  Nobuyuki Ozawa

IPC分类号： B43K24/08

CPC分类号： B43K24/084

摘要： A device for advancing and retracting a writing element in a writing instrument, of the type comprising a cylinder, a stationary cam provided on an inner surface of the cylinder, a rotary cam follower disposed inside the stationary cam to be rotatable and slidable axially of the cylinder, the rotary cam follower being in abutting engagement at a front end thereof with the writing element, and a knocking rod disposed in the cylinder and having a front cam portion. When the knocking rod is pushed forward, the knocking rod, the stationary cam and the rotary cam follower cooperate to advance the writing element and maintain the same in an advanced position and to allow the writing element to retract to a retracted position. The knocking rod has projections which are in slidable engagement with slots formed axially through the cylinder. The knocking rod has slots to make it resilient. The knocking rod is inserted into the cylinder through the rear opening of the cylinder until the projections snappingly engage the slots. The capability of inserting the knocking rod from the rear side makes the assembly easy and simple.

摘要翻译： 一种用于在书写工具中前进和后退书写元件的装置，包括一个圆柱体，设置在该圆柱体的内表面上的固定凸轮;一个设置在固定凸轮内部的旋转凸轮从动件，该旋转凸轮随动件可旋转并沿轴向滑动 旋转凸轮从动件在其前端处与书写元件邻接，以及设置在气缸中并具有前凸轮部分的敲击杆。 当敲击杆向前推时，敲杆，固定凸轮和旋转凸轮从动件协作以使书写元件前进并将其保持在前进位置，并允许书写元件缩回到缩回位置。 该敲击杆具有与轴向穿过圆筒形成的槽滑动接合的突出部。 敲击杆具有槽以使其具有弹性。 敲击杆通过气缸的后开口插入气缸中，直到突出部紧紧地接合槽。 从后侧插入敲击杆的能力使组装变得容易和简单。

公开(公告)号：US4148591A

公开(公告)日：1979-04-10

申请号：US824303

申请日：1977-08-12

申请人： Yoshihiro Tomura

发明人： Yoshihiro Tomura

IPC分类号： B43K24/16 ,  B43K27/02 ,  B43K27/12

CPC分类号： B43K27/02 ,  B43K24/166

摘要： A writing unit locking mechanism in a writing implement having a mechanical pencil unit and a ball point pen unit both housed in a single holder cylinder. The locking mechanism has a writing unit selection member having a shift member shiftable under gravitational force to select one or the other writing unit and operated manually to actuate a chuck in the pencil unit and a catch shoulder provided on a unit cylinder of the pencil unit and adapted to engage directly with the holder cylinder or with an engagement member resiliently supported on the holder cylinder thereby to lock the pencil unit in its writing position. The pencil unit is released from its locked state simultaneously with the release of the selection member.

摘要翻译： 一种书写工具中的写入单元锁定机构，其具有容纳在单个保持筒中的自动铅笔单元和圆珠笔单元。 所述锁定机构具有书写单元选择构件，所述书写单元选择构件具有可在重力作用下移动的移位构件，以选择一个或另一个书写单元并手动操作以致动笔单元中的卡盘和设置在该笔单元的单位圆柱体上的卡扣肩部， 适于直接与保持筒或与弹性地支撑在保持器筒上的接合构件接合，从而将铅笔单元锁定在其书写位置。 铅笔单元与选择构件的释放同时从其锁定状态释放。

公开(公告)号：US08415794B2

公开(公告)日：2013-04-09

申请号：US12989777

申请日：2009-04-14

申请人： Kentaro Kumazawa ,  Yoshihiro Tomura

发明人： Kentaro Kumazawa ,  Yoshihiro Tomura

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/05 ,  B33Y80/00 ,  H01L24/03 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0501 ,  H01L2224/0502 ,  H01L2224/05099 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/06051 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A semiconductor device includes a semiconductor element having a plurality of element electrodes formed thereon, a circuit board having board electrodes respectively corresponding to the element electrodes formed thereon and having the semiconductor element mounted thereon, and bumps each of which is provided on at least one of the element electrode and the board electrode, and connects together the element electrode and the board electrode corresponding to each other when the semiconductor element is mounted on the circuit board. Furthermore, at least one of a dielectric layer and a resistive layer is provided between at least one of the bumps and the element or board electrode on which the at least one of the bumps is provided, so that the element or board electrode, the dielectric layer or the resistive layer, and the bump form a parallel-plate capacitor or electrical resistance.

摘要翻译： 半导体器件包括其上形成有多个元件电极的半导体元件，具有分别对应于其上形成有元件电极并且具有安装有半导体元件的基板电极的电路板，以及设置在其上的至少一个上的凸块 元件电极和基板电极，并且当将半导体元件安装在电路板上时，将元件电极和板电极彼此对应连接在一起。 此外，在至少一个凸块和设置有至少一个凸块的元件或电路板电极之间提供电介质层和电阻层中的至少一个，使得元件或板电极，电介质 层或电阻层，并且凸起形成平行板电容器或电阻。