公开(公告)号：US07062014B2

公开(公告)日：2006-06-13

申请号：US10935610

申请日：2004-09-07

Applicant: Kiyoshi Hasegawa

Inventor： Kiyoshi Hasegawa

IPC: G01T1/36

CPC classification number: G01N23/223 ,  G01N33/44 ,  G01N2223/076

Abstract: An object is to reduce the influence of chlorine in plastics when the metal concentrations in the plastics are analyzed. In an X-ray analyzer including an X-ray generating part for irradiating primary X-rays onto a sample and an X-ray detector for detecting an X-ray from the sample, primary X-rays is irradiated onto a plastic sample from the X-ray generating part, the X-ray intensity of chlorine is obtained from the plastic sample by the X-ray detector, and the scattered X-ray intensity where the primary X-ray has been scattered by the plastic sample is obtained by the X-ray detector. A chlorine X-ray intensity ratio calculating means for dividing the X-ray intensity of chlorine by the scattered X-ray intensity to calculate a chlorine X-ray intensity ratio is provided. The calculated chlorine X-ray intensity ratio and the chlorine concentration in the plastic sample have positive correlation each other. A relative chlorine concentration calculating means adapted to calculate the relative chlorine concentration in the plastic sample from the chlorine X-ray intensity ratio is provided.

Abstract translation: 当分析塑料中的金属浓度时，目的是减少塑料中氯的影响。 在包括用于将原始X射线照射到样品上的X射线产生部件和用于检测来自样品的X射线的X射线检测器的X射线分析仪中，将主X射线从 X射线产生部，通过X射线检测器从塑料样品获得氯的X射线强度，并且通过塑料样品获得主X射线已被散射的散射X射线强度 X射线探测器。 提供一种用于将X射线强度除以散射X射线强度以计算氯X射线强度比的氯X射线强度比计算装置。 计算的氯X射线强度比和塑料样品中的氯浓度呈正相关。 提供了一种适用于从氯X射线强度比计算塑料样品中的相对氯浓度的相对氯浓度计算装置。

公开(公告)号：US20050202261A1

公开(公告)日：2005-09-15

申请号：US11044533

申请日：2005-01-28

Applicant: Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

Inventor： Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

IPC: B32B3/00 ,  H05K1/00 ,  H05K3/00 ,  H05K3/10 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4655 ,  H05K3/108 ,  H05K3/28 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4652 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T428/12431 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/31681

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract translation: 本发明涉及一种粘附辅助剂金属箔，其包含在金属上含有环氧树脂作为不可或缺成分的粘合助剂层，其中粘合助剂层的厚度为0.1-10μm。 本发明还涉及作为具有多层的多层布线基板的印刷布线板，其中在绝缘层之间形成粘附辅助剂层。

公开(公告)号：US20050118600A1

公开(公告)日：2005-06-02

申请号：US10507389

申请日：2002-03-13

Applicant: Yuko Aoki ,  Kiyoshi Hasegawa ,  Nobuya Ishii ,  Kazushige Mori

Inventor： Yuko Aoki ,  Kiyoshi Hasegawa ,  Nobuya Ishii ,  Kazushige Mori

IPC: G01N33/53 ,  C12M1/00 ,  C12N15/09 ,  C12Q1/68 ,  G01N33/574 ,  G01N37/00 ,  G06F17/17 ,  G06F19/00 ,  G06K9/62 ,  G01N33/48 ,  G01N33/50

CPC classification number: C12Q1/6886 ,  C12Q1/6837 ,  C12Q2600/106 ,  C12Q2600/158 ,  G16B20/00 ,  G16B25/00 ,  G16B40/00

Abstract: Based on drug sensitivity data and extensive gene expression data, a model was constructed by multivariate analysis with the partial least squares method type 1. Further, the model was optimized using modeling power and genetic algorithm. Thereby, the degree of contribution of the respective genes to drug sensitivity was determined to select genes with a high degree of contribution. In addition, the levels of gene expression in specimens were analyzed, and then the drug sensitivity was predicted based on the model. The predicted values agreed well with those drug sensitivity values determined experimentally. The drug sensitivity-predicting method provided by the present invention enables assessment of the effectiveness of a drug prior to administration using small quantities of specimens associated with diseases such as cancer. Since this enables the selection of the most suitable drug for each patient, the present invention is very useful in improving a patient's quality of life (QOL).

Abstract translation: 基于药物敏感性数据和广泛的基因表达数据，通过偏最小二乘法1型多元分析构建了一个模型。此外，使用建模能力和遗传算法优化了模型。 因此，确定各基因对药物敏感性的贡献度，以选择具有高度贡献的基因。 另外，分析标本中基因表达水平，然后根据模型预测药物敏感性。 预测值与实验确定的药物敏感性值吻合良好。 由本发明提供的药物敏感性预测方法能够使用少量与诸如癌症的疾病相关的标本在给药前评估药物的有效性。 由于这能够为每个患者选择最合适的药物，本发明在改善患者的生活质量（QOL）方面是非常有用的。

公开(公告)号：US06624008B2

公开(公告)日：2003-09-23

申请号：US09499455

申请日：2000-02-07

Applicant: Kiyoshi Hasegawa

Inventor： Kiyoshi Hasegawa

IPC: H01L2144

CPC classification number: H01L23/4985 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/10666 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor chip mounting tape on which external connecting terminals are formed in accordance with a layout pattern has post portions which are to be connected to a semiconductor chip and external connecting terminals. Post portions are formed on the first surface of an insulation tape used as a base of the semiconductor chip mounting tape. External connecting terminals are formed on the second surface of the insulation tape. The post portions and the external connecting terminals are integrally formed by same solder balls via through holes formed in the insulation tape.

Abstract translation: 根据布局图案形成有外部连接端子的半导体芯片安装带具有要连接到半导体芯片和外部连接端子的端子部分。 在用作半导体芯片安装带的基座的绝缘带的第一表面上形成有柱部分。 外部连接端子形成在绝缘带的第二表面上。 后端部分和外部连接端子通过形成在绝缘带中的通孔由相同的焊球一体地形成。

公开(公告)号：US06518655B2

公开(公告)日：2003-02-11

申请号：US09975198

申请日：2001-10-12

Applicant: Yuichi Morinaga ,  Kiyoshi Hasegawa ,  Kenji Fuchinoue

Inventor： Yuichi Morinaga ,  Kiyoshi Hasegawa ,  Kenji Fuchinoue

IPC: H01L2302

CPC classification number: H01L25/0657 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A multi-chip package type semiconductor device includes a first insulating substrate having a hollow on its main surface, a second insulating substrate having on its main surface an opening, which is larger than the hollow, and being on the first substrate wherein the opening encompasses the hollow, a first semiconductor chip being formed in the hollow, a second first semiconductor chip whose size is approximately the same as that of the first semiconductor chip, being supported by the first insulating substrate in an area, which encompasses the hollow.

公开(公告)号：US5906697A

公开(公告)日：1999-05-25

申请号：US968978

申请日：1997-11-12

Applicant: Kiyoshi Hasegawa ,  Katsuhiro Shibata

Inventor： Kiyoshi Hasegawa ,  Katsuhiro Shibata

IPC: B60J1/02 ,  B60J1/00 ,  B60J10/02 ,  C09J167/02 ,  C09J175/04

CPC classification number: B60J1/006 ,  B60J10/70

Abstract: An adhesive for a vehicular glass is disclosed which comprises urethane as a base material added with 2% to 8% by weight of a thermoplastic resin. The thermoplastic resin may be a polyester-based resin. The adhesive is heated to a temperature of 60.degree. C.-80.degree. C. and then applied to a peripheral edge of a windshield. The windshield is sucked by a suction cup and pressed against a window frame of a vehicle body. Thereafter, the adhesive is cooled by blowing air having a temperature on the order of 20.degree. C. thereat. The adhesive is forcibly cooled down to 50.degree. C. or lower in a short time, thereby exhibiting temporary retention property.

Abstract translation: 公开了一种用于车辆玻璃的粘合剂，其包含氨基甲酸乙酯作为添加有2重量％至8重量％的热塑性树脂的基材。 热塑性树脂可以是聚酯类树脂。 将粘合剂加热到60℃-80℃的温度，然后施加到挡风玻璃的周边边缘。 挡风玻璃被吸盘吸入并压靠在车体的窗框上。 此后，通过吹入温度为20℃左右的空气来冷却粘合剂。 粘合剂在短时间内强制冷却至50℃以下，从而显示临时保持性。

公开(公告)号：US5849631A

公开(公告)日：1998-12-15

申请号：US683765

申请日：1996-07-17

Applicant: Natsuya Ishikawa ,  Kiyoshi Hasegawa ,  Masaki Hatano

Inventor： Natsuya Ishikawa ,  Kiyoshi Hasegawa ,  Masaki Hatano

IPC: H01L21/60 ,  H01L23/485 ,  H01L21/321

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  Y10S438/909

Abstract: A method of manufacturing a semiconductor device includes the steps of: patterning a first passivation film on a semiconductor substrate; patterning a ball limiting metal film; patterning a second passivation film; performing a heat-treatment for hardening the second passivation film and annealing the ball limiting metal film; patterning a bump forming metal film; and wet-back processing the bump forming metal film. In this method, the heat-treatment may be performed in an atmosphere having an oxygen concentration of 50 ppm or less at a temperature of from 300.degree. to 400.degree. C. for 10 to 30 minutes. Additionally, at least one of the first and second passivation films may be a polyimide film, and the ball limiting metal film may has a three layer structure of a Ti layer, a Cu layer and an Au layer laminated from the bottom in this order.

Abstract translation: 制造半导体器件的方法包括以下步骤：对半导体衬底上的第一钝化膜进行构图; 图案化球限制金属膜; 图案化第二钝化膜; 进行硬化所述第二钝化膜的热处理并使所述球限制金属膜退火; 图案化凸块形成金属膜; 并且对凸块形成金属膜进行湿回加工。 在该方法中，可以在300〜400℃的温度下在氧浓度为50ppm以下的气氛中进行热处理10〜30分钟。 此外，第一和第二钝化膜中的至少一个可以是聚酰亚胺膜，并且球限制金属膜可以具有从底部依次层叠的Ti层，Cu层和Au层的三层结构。

公开(公告)号：US5403672A

公开(公告)日：1995-04-04

申请号：US59658

申请日：1993-05-12

Applicant: Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kiyoshi Hasegawa ,  Shuichi Hatakeyama ,  Akinari Kida ,  Akishi Nakaso ,  Hiroshi Nomura

Inventor： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kiyoshi Hasegawa ,  Shuichi Hatakeyama ,  Akinari Kida ,  Akishi Nakaso ,  Hiroshi Nomura

IPC: H05K3/02 ,  H05K3/06 ,  H05K3/38 ,  B32B15/20 ,  B32B3/30

CPC classification number: H05K3/025 ,  H05K3/062 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0723 ,  H05K2203/0726 ,  H05K3/383 ,  Y10S428/935 ,  Y10T29/49155 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/1291 ,  Y10T428/12993

Abstract: A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.

Abstract translation: 一种用于印刷电路板的金属箔，包括要粘附到树脂上的第一铜层，具有足够强度作为金属层的第二铜层和含有1.1重量％以上的磷的镍 - 磷合金层， 第一和第二铜层适用于制造具有优异耐热性的印刷电路板，特别是在制造过程中。

公开(公告)号：US5309632A

公开(公告)日：1994-05-10

申请号：US970925

申请日：1992-11-02

Applicant: Hiroshi Takahashi ,  Shin Takanezawa ,  Masao Kanno ,  Yorio Iwasaki ,  Toshirou Okamura ,  Akishi Nakaso ,  Kiyoshi Hasegawa

Inventor： Hiroshi Takahashi ,  Shin Takanezawa ,  Masao Kanno ,  Yorio Iwasaki ,  Toshirou Okamura ,  Akishi Nakaso ,  Kiyoshi Hasegawa

IPC: H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  H01K3/10

CPC classification number: H05K3/181 ,  H05K3/184 ,  H05K3/426 ,  H05K1/0373 ,  H05K2201/0236 ,  H05K2201/0344 ,  H05K2203/0709 ,  H05K2203/1407 ,  H05K2203/1415 ,  H05K3/387 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A process for producing a printed wiring board characterized by forming a nickel layer by electroless plating and a copper layer formed thereon by electroless plating, or forming a copper undercoating layer before the nickel layer by electroless plating can produce printed circuit boards excellent in resistance to electrolytic corrosion and suitable for mounting parts in high density.

Abstract translation: 一种印刷电路板的制造方法，其特征在于，通过无电解电镀形成镍层，通过无电镀形成在其上的铜层，或者通过化学镀在镍层之前形成铜底涂层，可以制造出耐电解质优异的印刷电路板 腐蚀，适合高密度安装。

公开(公告)号：US5185777A

公开(公告)日：1993-02-09

申请号：US661187

申请日：1991-02-27

Applicant: Kiyoshi Hasegawa

Inventor： Kiyoshi Hasegawa

IPC: G03B42/02 ,  A61B6/00 ,  G21K4/00

CPC classification number: A61B6/4283 ,  G21K4/00

Abstract: An X-ray radiographing system is provided with a table having a spot-film device which moves synchronously with an X-ray generator along a longitudinal axis (a patient's body axis) of the table. The spot-film device comprises a fluoroscopic area and a radiographic area arranged along a transverse axis at a front portion of the table. A film holder holding an X-ray sheet film (unexposed or exposed) shuttles along a transverse rail between the fluoroscopic area and a radiographic area. A feed magazine and a take-up magazine are provided under the fluoroscopic area. Unexposed X-ray sheet film is removed by suction cups from an opening in the feed magazine, and fed to the film holder. Exposed X-ray film is returned to the take-up magazine. Both the magazines can be loaded and unloaded from the front portion of the device.