公开(公告)号：US20070036952A1

公开(公告)日：2007-02-15

申请号：US11381528

申请日：2006-05-03

Applicant: Tao-Chih Chang ,  Chiao-Yun Chang ,  Shan-Pu Yu

Inventor： Tao-Chih Chang ,  Chiao-Yun Chang ,  Shan-Pu Yu

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L24/12 ,  H01L21/563 ,  H01L23/49582 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1182 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15311 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T428/24917 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: A method and a device for enhancing the solderability of a lead-free component are provided. The provided method is compatible with the conventional soldering process and is capable of improving the wetting ability of the solder so as to enhance the solderability and the ability of anti-oxidation thereof. Besides, it is also achievable for providing a recognizable lead-free device so as to prevent the process confusion.

Abstract translation: 提供了一种用于增强无铅部件的可焊性的方法和装置。 所提供的方法与传统的焊接工艺兼容，并且能够提高焊料的润湿能力，从而提高可焊性和抗氧化能力。 此外，还可以提供可识别的无铅装置，以防止过程混淆。

公开(公告)号：US06680128B2

公开(公告)日：2004-01-20

申请号：US09963605

申请日：2001-09-27

Applicant: Zequn Mei

Inventor： Zequn Mei

IPC: B23K3522

CPC classification number: C23C18/31 ,  B22F1/025 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/282 ,  B23K35/36 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2203/0435 ,  Y10T428/12181

Abstract: Solder compositions, solder pastes and methods of manufacturing thereof having a solder material coated with a coating material by an immersion coating process or an electroless plating process. The solder composition and solder pastes are substantially lead-free and have melting temperatures approaching those of traditional tin-lead solders.

Abstract translation: 焊剂组合物，焊膏及其制造方法，其具有通过浸涂法或无电镀工艺涂覆有涂料的焊料材料。 焊料组合物和焊膏基本上是无铅的，并具有接近传统锡铅焊料的熔化温度。

公开(公告)号：US20020151164A1

公开(公告)日：2002-10-17

申请号：US09834273

申请日：2001-04-12

Inventor： Hunt Hang Jiang ,  Mark McCormack ,  Lei Zhang

IPC: H01L021/44

CPC classification number: H01L24/12 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/1184 ,  H01L2224/11901 ,  H01L2224/131 ,  H01L2224/13155 ,  H01L2224/13582 ,  H01L2224/13611 ,  H01L2224/13616 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0379 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/0435 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A method for depositing solder bumps on a circuit substrate. The method comprises forming a dielectric layer on the circuit substrate which includes a plurality of conductive regions. The dielectric layer is patterned and opened to expose the conductive regions. A solder bump is disposed on each of the conductive regions, and a barrier layer is disposed on each of the solder bumps. Subsequently, the method includes forming a second solder bump on each of the first solder bumps. In an alternative method, solder bumps are initially disposed on each of the conductive regions and are then covered with a dielectric material. Subsequently, the dielectric material and a portion of the solder bumps are removed, and a barrier layer is disposed on each of the remaining structures of the solder bumps. The second solder bump material may then be disposed on the barrier layer. The articles produced by the methods of the present invention include semiconductor substrates or wafers having stacked solder bumps.

Abstract translation: 一种在电路基板上沉积焊锡凸块的方法。 该方法包括在电路基板上形成包括多个导电区域的电介质层。 将介电层图案化并打开以暴露导电区域。 在每个导电区域上设置焊料凸块，并且在每个焊料凸块上设置阻挡层。 随后，该方法包括在每个第一焊料凸块上形成第二焊料凸点。 在替代方法中，焊料凸块最初设置在每个导电区域上，然后用电介质材料覆盖。 随后，去除电介质材料和焊料凸块的一部分，并且在焊料凸块的每个剩余结构上设置阻挡层。 然后可以将第二焊料凸块材料设置在阻挡层上。 通过本发明的方法制造的制品包括具有堆叠的焊料凸块的半导体衬底或晶片。

公开(公告)号：US20020071961A1

公开(公告)日：2002-06-13

申请号：US09729967

申请日：2000-12-06

Inventor： Shigeki Miura

IPC: B21F001/00 ,  B22D025/00

CPC classification number: H05K3/3436 ,  H01L23/488 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/3463 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T428/12 ,  H01L2924/00

Abstract: A material for an electronic component having a plating layer A formed of metals X and Y mixed with each other on a base metal material and a coating layer B formed of the metal X provided on the plating layer A is provided, whereby wettability of soldering is satisfactory ensured, degradation of solderability and appearance is prevented and generation of whiskers can also be prevented.

Abstract translation: 提供了一种具有由金属X和Y形成的镀层A的电子部件的材料，并且由设置在镀层A上的由金属X形成的涂层B由基体金属材料和涂层B组成，因此焊接的润湿性为 令人满意地确保，防止可焊性和外观的劣化，并且也可以防止生成晶须。

公开(公告)号：US5957364A

公开(公告)日：1999-09-28

申请号：US661179

申请日：1996-06-10

Applicant: Paul A. Socha

Inventor： Paul A. Socha

IPC: B23K35/02 ,  B23K35/14 ,  H05K3/34 ,  B23K35/22

CPC classification number: H05K3/3478 ,  B23K35/0222 ,  H05K2201/0305 ,  H05K2201/10424 ,  H05K2203/0415 ,  H05K2203/0435 ,  H05K3/3447

Abstract: An integrated solder preform array is composed of a metal or metal alloy suitable for use in a soldering or bonding process. The preform includes a series of discrete solder islands disposed in a desired matrix. Each island contains a hole for receiving a pin, and bridging strands for joining each of said islands in a matrix. The bridging strands are formed of the same solder material as the islands, with the solder preform containing a substantially uniform coating of tin over its entire outer surface for the purpose of improving solder wetting and therefore elimination of unwanted shorting of circuits and other electrical components being soldered.

Abstract translation: 集成的焊料预制件阵列由适用于焊接或焊接工艺的金属或金属合金构成。 预型件包括设置在所需矩阵中的一系列离散焊料岛。 每个岛包含用于接收销的孔和用于将每个所述岛连接成矩阵的桥接线。 桥接线由与岛状物相同的焊料材料形成，其中焊料预制件在其整个外表面上含有基本上均匀的锡涂层，以改善焊料润湿并因此消除电路和其它电气部件的不需要的短路 焊接。

公开(公告)号：US5384204A

公开(公告)日：1995-01-24

申请号：US166620

申请日：1993-12-14

Applicant: Kazuhito Yumoto ,  Norio Wakabayashi ,  Masao Nakazawa ,  Shinichi Wakabayashi ,  Norio Wada ,  Fumio Kuraishi ,  Toshihiko Shimada

Inventor： Kazuhito Yumoto ,  Norio Wakabayashi ,  Masao Nakazawa ,  Shinichi Wakabayashi ,  Norio Wada ,  Fumio Kuraishi ,  Toshihiko Shimada

IPC: C25D5/10 ,  C23C28/00 ,  C25D7/06 ,  H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H05K1/00 ,  H05K3/24 ,  H05K3/34

CPC classification number: H01L23/49572 ,  H01L23/49866 ,  H05K3/3473 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K2201/0338 ,  H05K2201/10681 ,  H05K2203/0435 ,  H05K3/244 ,  Y10T428/12569 ,  Y10T428/12715 ,  Y10T428/12875 ,  Y10T428/12889 ,  Y10T428/1291

Abstract: A tape useful for an automatic bonding process when manufacturing a high-frequency semiconductor device, the tape comprising an insulating flexible film, and circuit patterns consisting of copper or copper-alloy formed on the insulating film, each of the circuit patterns having inner and an outer lead portions. A tin or tin-lead plated film is formed on the pattern, and an intermediate plated film is formed on at least the outer lead portion as an underlayer. The intermediate plated film consists of a metal or metal alloy selected from nickel, cobalt, gold, silver, platinum, palladium, indium or rhodium.

Abstract translation: 一种用于在制造高频半导体器件时的自动接合工艺的带子，所述带包括绝缘柔性膜，以及形成在绝缘膜上的由铜或铜合金组成的电路图案，每个电路图案具有内部和 外引线部分。 在图案上形成锡或锡铅镀膜，至少在作为底层的外引线部分上形成中间镀膜。 中间镀膜由选自镍，钴，金，银，铂，钯，铟或铑的金属或金属合金构成。

公开(公告)号：US5341980A

公开(公告)日：1994-08-30

申请号：US890255

申请日：1992-05-29

Applicant: Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

Inventor： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

IPC: B23K1/00 ,  B23K1/008 ,  B23K1/20 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K3/34 ,  B23K31/02

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/206 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/75 ,  H05K3/3436 ,  H05K3/3489 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/742 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/81141 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H05K2201/10984 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  H05K3/3426 ,  Y02P70/613

Abstract: In a method of soldering for use in fabricating electronic circuit device, after an oxide layer and/or contaminated layer on a surface of a soldering material and members to be soldered thereby is removed by sputter-cleaning with atom or ion, the members are aligned in an oxidizing atmosphere within a predetermined time period and, then, the soldering material is heated in non-oxidizing atmosphere to performe soldering. An apparatus for performing the above method comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to cleaning a surface of solder or a member to be bonded or a solder ball plated with gold may be used. An alignment between two members to be bonded is provided by an alignment mark means which comprises a protrusion on a surface of one member and a complimental recess formed at a center portion of a protrusion means formed on a corresponding surface of the other member.

Abstract translation: 在用于制造电子电路器件的焊接方法中，在焊料的表面上的氧化物层和/或污染层和由此被焊接的部件被去除之后，通过用原子或离子进行溅射清洗，这些部件对准 在预定时间段内的氧化气氛中，然后，在非氧化性气氛中加热焊接材料进行焊接。 用于执行上述方法的装置包括溅射清洁装置，可在大气条件下操作的对准装置和可在非氧化或还原环境中操作的带式炉的形式的加热和焊接装置。 代替溅射清洁装置，可以使用机械抛光或切割装置来清洁焊料或待结合的部件的表面，或者可以使用镀有金的焊球。 要结合的两个构件之间的对准由对准标记装置提供，该对准标记装置包括在一个构件的表面上的突起和形成在形成在另一构件的相应表面上的突出装置的中心部分处的补充凹部。

公开(公告)号：US5025553A

公开(公告)日：1991-06-25

申请号：US415718

申请日：1989-10-02

Applicant: Paul Telco

Inventor： Paul Telco

IPC: H05K1/11 ,  B23K35/02 ,  H01R13/52 ,  H05K3/34 ,  H05K3/40 ,  H05K13/04

CPC classification number: H05K13/04 ,  B23K35/0222 ,  H05K3/3478 ,  H05K3/4038 ,  H05K3/4046 ,  H01R13/5202 ,  H05K2201/09572 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/0415 ,  H05K2203/0435 ,  H05K2203/308 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/53174

Abstract: Electrically conductive patterns on opposite sides of a printed circuit board are connected by way of through holes formed in the board. A plug formed of fusible material such as solder and having an electrically conductive coating is located in the or each hole. The plug is upset to expand it so that the electrically conductive coating contacts the wall of the hole. Solder is applied to opposite ends of the plug to bridge any gap between the conductive pattern and the conductive coating. The body of the plug may then be removed by a desoldering step.