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61.
公开(公告)号:US10004459B2
公开(公告)日:2018-06-26
申请号:US14422941
申请日:2013-08-30
申请人: ACUTUS MEDICAL, INC.
发明人: Randell L. Werneth , Graydon E. Beatty , Timothy J. Corvi , J. Christopher Flaherty , Marcus Frederick Julian
IPC分类号: A61B5/00 , A61B8/00 , A61B8/12 , A61B5/042 , A61B18/14 , A61B5/0205 , A61B5/046 , A61B5/0464 , A61B5/06 , A61B17/22 , A61B18/02 , A61B18/18 , A61B18/20 , A61B17/00 , A61B18/00 , A61N1/05 , A61B5/053 , A61B34/30
摘要: The present invention includes systems, devices and methods for treating and/or diagnosing a heart arrhythmia, such as atrial fibrillation. Specifically, the present invention provides a system including a diagnostic catheter and an ablation catheter. The diagnostic catheter includes a shaft, multiple dipole mapping electrodes and multiple ultrasound transducers. The ablation catheter is slidingly received by the diagnostic catheter shaft.
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公开(公告)号:US09991844B2
公开(公告)日:2018-06-05
申请号:US15030964
申请日:2014-11-14
申请人: PowerOwners, LLC.
发明人: Daniel P. Leary , Roy S. Greenwood
CPC分类号: H02S50/00 , F24S50/20 , F24S2201/00 , G01J1/44 , G01J2001/4276 , G01J2001/4285 , G01K13/00 , Y02E10/47
摘要: A device comprises a platform constructed and arranged to be mounted to one or more solar array modules and one or more solar irradiance sensors on the platform configured to receive incident solar energy, the solar irradiance sensors oriented on the platform so that the received incident solar energy is comparable to that received by the solar array modules, the one or more solar irradiance sensors providing solar irradiance signals in response to the incident solar energy. A processor is on the platform, the processor configured to receive the solar irradiance signals and, in response, generating a performance reference metric based on the solar irradiance signals, the performance reference metric related to the expected performance of the one or more solar array modules to which the platform is mounted. A transmitter is on the platform, the transmitter configured to periodically transmit the performance reference metric to a receiver.
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公开(公告)号:US09991234B2
公开(公告)日:2018-06-05
申请号:US15401341
申请日:2017-01-09
发明人: Gwang Sun Seo , Myung Sung Kang , Won Keun Kim , Jin Woo Park , Yong Won Choi
IPC分类号: H01L23/48 , H01L25/065 , H01L23/31 , H01L23/00
CPC分类号: H01L25/0657 , H01L21/561 , H01L23/3128 , H01L24/06 , H01L24/16 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/06181 , H01L2224/14181 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/33505 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81005 , H01L2224/83005 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06575 , H01L2924/15311 , H01L2924/18161 , H01L2924/3511 , H01L2224/81 , H01L2224/83 , H01L2224/1403 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要: A semiconductor package includes a substrate, a plurality of semiconductor chips stacked on the substrate, and a plurality of bonding layers bonded to lower surfaces of the plurality of semiconductor chips. The plurality of bonding layers may be divided into a plurality of groups, each having different physical properties depending on a distance from the substrate.
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公开(公告)号:US09986634B2
公开(公告)日:2018-05-29
申请号:US15381301
申请日:2016-12-16
发明人: Michael Rose , Robert Sullivan
CPC分类号: H05K1/0251 , H05K1/0216 , H05K1/024 , H05K1/0245 , H05K1/0298 , H05K1/115 , H05K3/20 , H05K3/4038 , H05K2201/0187 , H05K2201/09063 , H05K2201/09227 , H05K2201/09636 , H05K2201/09718 , H05K2201/1059
摘要: A circuit board comprises a plurality of layers, first and second reference conductive vias extending in a vertical direction through at least a portion of the plurality of layers, first and second signal conductive vias extending in the vertical direction between and spaced apart in a horizontal direction from the first and second reference conductive vias through at least a portion of the plurality of layers, and a dielectric region extending in the vertical direction between the first and second signal conductive vias. An air via extends in the vertical direction through the dielectric region between the first and second signal conductive vias. An anti-pad extends in the horizontal direction between the first and second reference conductive vias and surrounding in the horizontal direction the first and second signal conductive vias, the air via, and the dielectric region.
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公开(公告)号:US09983229B2
公开(公告)日:2018-05-29
申请号:US14743163
申请日:2015-06-18
发明人: Jong-won Han , Jong-woo Lee , Young-gi Min , Soon-won Lee , Yong-in Lee
IPC分类号: G01R31/00 , G01R1/04 , H01R24/20 , H01B1/02 , H01B1/04 , H01R13/03 , G01R31/26 , H01R13/24 , H01R107/00
CPC分类号: G01R1/0433 , G01R31/26 , H01B1/02 , H01B1/04 , H01R13/03 , H01R13/2414 , H01R24/20 , H01R2107/00 , H01R2201/20
摘要: A test socket is provided that includes a base material including an insulating elastic material and a conductive portion extending through the base material in a thickness direction of the base material, wherein the conductive portion includes a plurality of conductive particle structures arranged in the thickness direction of the base material, and each of the plurality of conductive particle structures includes a plurality of conductive particles having at least one insulating wire and/or at least one conductive wire extending from a surface of the conductive particle, bonded with a material having a functional group.
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公开(公告)号:US09975272B1
公开(公告)日:2018-05-22
申请号:US13408529
申请日:2012-02-29
申请人: Troy D. Guinther
发明人: Troy D. Guinther
IPC分类号: B28B19/00
CPC分类号: B28B19/0007 , B28B7/0079 , B28B7/08 , B28B19/0053 , B28B19/0061
摘要: Provided is a system and method for building retaining and freestanding stone walls, wherein wall panels are made, then transported to an installation location, and installed on site quickly and efficiently. The wall panels are made in wall frames that use joint forms to provided wall panels having sides that reliably and securely mater together. The joint forms include “zig-zag” like connections and a structural interlocking key, engineered to prevent vertical and lateral deformation of the assembled wall. Drainage and strengthening materials are built into the wall panels while in the wall frames. A lifting apparatus is also provided that engages a wall panel through openings formed in a rear side, and stably lifts and flips the wall panel from a facedown orientation to an upright orientation.
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67.
公开(公告)号:US09968268B2
公开(公告)日:2018-05-15
申请号:US15672020
申请日:2017-08-08
申请人: Acutus Medical, Inc.
IPC分类号: A61B5/00 , A61B5/0205 , A61B8/08 , A61B8/00 , A61B5/04 , A61B18/14 , A61B8/12 , A61B5/042 , A61B5/06
CPC分类号: A61B5/0205 , A61B5/04012 , A61B5/0422 , A61B5/065 , A61B5/4836 , A61B5/6858 , A61B5/6869 , A61B8/0841 , A61B8/0883 , A61B8/12 , A61B8/445 , A61B8/4483 , A61B8/5207 , A61B18/1492 , A61B2562/0204 , A61B2562/0209 , A61B2576/023
摘要: Disclosed are devices, systems, and methods for determining the dipole densities on heart walls. In particular, a triangularization of the heart wall is performed in which the dipole density of each of multiple regions correlate to the potential measured at various located within the associated chamber of the heart. To create a database of dipole densities, mapping information recorded by multiple electrodes located on one or more catheters and anatomical information is used. In addition, skin electrodes may be implemented. Additionally, one or more ultrasound elements are provided, such as on a clamp assembly or integral to a mapping electrode, to produce real time images of device components and surrounding structures.
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公开(公告)号:US09953725B2
公开(公告)日:2018-04-24
申请号:US15395213
申请日:2016-12-30
发明人: Ye-Sin Ryu , Sang-Uhn Cha , Hoi-Ju Chung , Seong-Jin Cho
IPC分类号: G11C29/44 , G11C29/56 , G11B20/18 , G01R31/3187 , G06F11/27 , G06F11/10 , G11C29/52 , G11C5/04 , G11C11/40 , G11C17/16 , G11C17/18 , G11C29/02 , G11C29/00
CPC分类号: G11C29/44 , G01R31/3187 , G06F11/1068 , G06F11/27 , G11B20/1816 , G11C5/04 , G11C11/40 , G11C17/16 , G11C17/18 , G11C29/027 , G11C29/4401 , G11C29/52 , G11C29/56004 , G11C29/56008 , G11C29/785 , G11C29/787 , G11C2029/4402 , G11C2029/5606
摘要: A method of operating a semiconductor memory device is provided. In a method of operating a semiconductor memory device including a memory cell array which includes a plurality of bank arrays, memory cells in a first region of the memory cell array are tested to detect one or more failed cells in the first region, a fail address corresponding to the detected one or more failed cells is determined and the determined fail address is stored in a second region different from the first region, in the memory cell array.
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69.
公开(公告)号:US09937464B2
公开(公告)日:2018-04-10
申请号:US14785445
申请日:2014-04-29
申请人: ARSTROMA Co., Ltd.
发明人: Gwan Shig Kim , Ky Yeong Shin
CPC分类号: B01D53/228 , B01D53/225 , B01D69/12 , B01D71/024 , B01D71/70 , B01D2053/221 , B01D2053/223 , B01D2256/245 , B01D2257/504 , B01D2258/0283 , B01D2259/80 , B01D2259/816 , Y02C10/10
摘要: Provided are an apparatus for separating and collecting carbon dioxide and a method of separating carbon dioxide, and more particularly, an apparatus and method of selectively separating carbon dioxide from a byproduct gas using a difference in negative pressure and a difference in carbon dioxide concentration between the inside of a separator, which is made of a ceramic-coated porous silicone membrane and in which the byproduct gas flows, and the outside of the separator in which carbon dioxide is collected.
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公开(公告)号:US09929099B2
公开(公告)日:2018-03-27
申请号:US15357299
申请日:2016-11-21
发明人: VietHa Nguyen , Wookyung You , Inoue Naoya , Hak-Sun Lee , Byung-Kwon Cho , Songyi Han , Jongmin Baek , Jiwon Kang , Byunghee Kim , Young-Ju Park , Sanghoon Ahn , Jiwon Yun , Naein Lee , YoungWoo Cho
IPC分类号: H01L23/48 , H01L23/532 , H01L23/522
CPC分类号: H01L23/53295 , H01L23/5222 , H01L23/53238 , H01L23/53266
摘要: A semiconductor device includes an interlayer insulating layer including a first insulating layer on a substrate, and a plurality of interconnections in the first insulating layer. The interlayer insulating layer includes a first region, and a second region including an air gap. The air gap is defined between a pair of the interconnections in the second region. A top surface of the first insulating layer of the first region is lower than a top surface of at least one of the interconnections in the first region.
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