公开(公告)号：US20170167042A1

公开(公告)日：2017-06-15

申请号：US14967861

申请日：2015-12-14

Applicant: International Business Machines Corporation

Inventor： QIANWEN CHEN ,  Bing Dang ,  Yu Luo ,  Joana Sofia Branquinho Teresa Maria

IPC: C25D7/04 ,  C25D3/30 ,  H01L21/288 ,  C25D5/02 ,  C25D17/12 ,  B23K35/26 ,  C25D3/54 ,  C25D3/60

CPC classification number: C25D7/04 ,  B23K35/26 ,  B23K35/262 ,  C25D3/30 ,  C25D3/54 ,  C25D3/60 ,  C25D5/02 ,  C25D7/123 ,  C25D17/001 ,  C25D17/12 ,  H01L21/2885 ,  H01L23/147

Abstract: A method provides a structure that includes a substrate having a metal layer disposed on a surface and a metal feature disposed on the metal layer. The method further includes immersing the structure in a plating bath contained in an electroplating cell, the plating bath containing a selected solder material; applying a voltage potential to the structure, where the structure functions as a working electrode in combination with a reference electrode and a counter electrode that are also immersed in the plating bath; and maintaining the voltage potential at a predetermined value to deposit the selected solder material selectively only on the metal feature and not on the metal layer. An apparatus configured to practice the method is also disclosed.

公开(公告)号：US09472859B2

公开(公告)日：2016-10-18

申请号：US14281951

申请日：2014-05-20

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Peter Jerome Sorce ,  Cornelia Kang-I Tsang

IPC: H01Q21/00 ,  H01Q1/22 ,  H01Q21/06

CPC classification number: H01Q21/065 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2924/15192 ,  H01Q1/2208 ,  H01Q1/2283 ,  H01Q1/48 ,  H01Q21/0075

Abstract: Package structures are provided for integrally packaging antennas with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter-wave and terahertz frequency ranges. For example, a package structure includes an RFIC chip, and an antenna package bonded to the RFIC chip. The antenna package includes a glass substrate, at least one planar antenna element formed on a first surface of the glass substrate, a ground plane formed on a second surface of the glass substrate, opposite the first surface, and an antenna feed line formed through the glass substrate and connected to the at least one planar antenna element. The antenna package is bonded to a surface of the RFIC chip using a layer of adhesive material.

Abstract translation: 提供封装结构，用于将天线与半导体RFIC（射频集成电路）芯片整体封装，以形成在毫米波和太赫兹频率范围内工作的紧凑型集成无线电/无线通信系统。 例如，封装结构包括RFIC芯片和结合到RFIC芯片的天线封装。 天线封装包括玻璃基板，形成在玻璃基板的第一表面上的至少一个平面天线元件，形成在玻璃基板的与第一表面相对的第二表面上的接地平面，以及通过 玻璃基板并连接到所述至少一个平面天线元件。 使用一层粘合剂材料将天线封装结合到RFIC芯片的表面。

公开(公告)号：US20160284582A1

公开(公告)日：2016-09-29

申请号：US14668534

申请日：2015-03-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bing Dang ,  Jeffrey D. Gelorme ,  John U. Knickerbocker

IPC: H01L21/683 ,  C09J171/12 ,  C08K3/04 ,  H01L21/02 ,  C09J9/00

CPC classification number: H01L21/6835 ,  C08G59/063 ,  C08G2650/56 ,  C08K3/04 ,  C08L63/00 ,  C08L71/00 ,  C09J9/00 ,  C09J163/00 ,  C09J171/00 ,  H01L21/02057 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

公开(公告)号：US20160084882A1

公开(公告)日：2016-03-24

申请号：US14962331

申请日：2015-12-08

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Yu Luo ,  John Knickerbocker ,  Yang Liu ,  Steven L. Wright

IPC: G01R1/073 ,  G01R31/28

CPC classification number: G01R1/07314 ,  B23K35/00 ,  B81C1/00111 ,  G01R31/2886 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/13663 ,  H01L2224/14051 ,  H01L2224/14181 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/92 ,  H01L2224/92222 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/381 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/07802 ,  H01L2924/01104 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/83 ,  H01L21/563

Abstract: A test probe head for probe testing multiple chips on a wafer in a single probing. A probe head substrate includes an array of probe tip attach pads on one surface. The array includes a subarray for each probe head chip test site. Probe tips attached to each probe tip attach pad have an across the head tip height variation less than one micrometer (1 μm). The subarray probe tips may be on a pitch at or less than fifty microns (50 μm). The test probe head may be capable of test probing all chips in a quadrant and even up to all chips on a single wafer in a single probing.

Abstract translation: 用于在单次探测中测试晶片上的多个芯片的测试探头。 探头头基板包括在一个表面上的探针尖端附接垫的阵列。 该阵列包括每个探针头芯片测试点的子阵列。 探针尖端附着在每个探头尖端附着垫上，头尖高度变化小于1微米（1微米）。 子阵列探针尖端可以在等于或小于50微米（50μm）的间距上。 测试探头可以在单次探测中测试探测单个晶圆上的所有芯片，甚至可以探测单个晶片上的所有芯片。

公开(公告)号：US20160049344A1

公开(公告)日：2016-02-18

申请号：US14460671

申请日：2014-08-15

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Bing Dang ,  Eric P. Lewandowski ,  Jae-Woong Nah ,  Bucknell C Webb

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L27/02 ,  H01L21/82 ,  H01L21/56

CPC classification number: H01L21/565 ,  H01L21/56 ,  H01L21/561 ,  H01L21/82 ,  H01L23/3121 ,  H01L23/5387 ,  H01L23/564 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of the invention include a method for shaping a flexible integrated circuit to a curvature and the resulting structure. A flexible circuit is provided. An epoxy resin and amine composition is deposited on the flexible integrated circuit. The deposited epoxy resin and amine composition is B-staged. The flexible integrated circuit is placed within a mold of a curvature. The B-staged epoxy resin and amine composition is cured subsequent to placing the flexible integrated circuit within the mold of the curvature.

Abstract translation: 本发明的实施例包括一种用于将柔性集成电路成形为曲率的方法以及所得到的结构。 提供了一个灵活的电路。 环氧树脂和胺组合物沉积在柔性集成电路上。 沉积的环氧树脂和胺组合物是B阶段的。 柔性集成电路放置在曲率的模具内。 在将柔性集成电路放置在曲率的模具中之后，B阶环氧树脂和胺组合物被固化。

公开(公告)号：US20150241476A1

公开(公告)日：2015-08-27

申请号：US14708198

申请日：2015-05-09

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John Knickerbocker ,  Yang Liu ,  Maurice Mason ,  Lubomyr T. Romankiw

IPC: G01R1/073 ,  B81B3/00 ,  G01R31/26

CPC classification number: G01R1/0735 ,  B23K35/00 ,  B81B3/00 ,  B81B2201/02 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81C1/00626 ,  G01R31/2607 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/13663 ,  H01L2224/73207 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/381 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01104

Abstract: A method of forming surface protrusions on an article, and the article with the protrusions attached. The article may be an Integrated Circuit (IC) chip, a test probe for the IC chip or any suitable substrate or nanostructure. The surface protrusions are electroplated to a template or mold wafer, transferred to the article and easily separated from the template wafer. Thus, the attached protrusions may be, e.g., micro-bumps or micro pillars on an IC chip or substrate, test probes on a probe head, or one or more cantilevered membranes in a micro-machine or micro-sensor or other micro-electro-mechanical systems (MEMS) formed without undercutting the MEMS structure.

Abstract translation: 在物品上形成表面突起的方法，以及附着有突起物的物品。 该物品可以是集成电路（IC）芯片，用于IC芯片的测试探针或任何合适的衬底或纳米结构。 表面突起电镀到模板或模具晶片上，转移到制品上，并容易地与模板晶片分离。 因此，附着的突起可以是例如IC芯片或衬底上的微凸起或微柱，探针头上的测试探针或微机或微传感器中的一个或多个悬臂膜或其它微电子 机械系统（MEMS）形成，而不会削弱MEMS结构。

公开(公告)号：US20150035173A1

公开(公告)日：2015-02-05

申请号：US14226953

申请日：2014-03-27

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Eric Peter Lewandowski ,  Cornelia Kang-I Tsang

IPC: H01L23/00 ,  H01L21/66 ,  C09J179/08 ,  B32B37/12 ,  H01L21/02

CPC classification number: B23K26/36 ,  G01R31/2607 ,  H01L21/302 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T428/265 ,  Y10T428/30 ,  Y10T428/31678

Abstract: Methods are provided to form adhesive materials that are used to temporarily bond handler wafers to device wafers, and which enable mid-wavelength infrared laser ablation release techniques to release handler wafers from device wafers.

Abstract translation: 提供了用于形成用于将处理器晶片暂时地接合到器件晶片的粘合剂材料的方法，并且使得能够使中波长红外激光烧蚀释放技术从器件晶片释放处理器晶片。

公开(公告)号：US20140201971A1

公开(公告)日：2014-07-24

申请号：US14224331

申请日：2014-03-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Tymon Barwicz ,  Bing Dang

IPC: B23P11/00

CPC classification number: B23P11/00 ,  B25B11/02 ,  H05K13/0404 ,  H05K13/0409 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49826 ,  Y10T29/49895 ,  Y10T29/49901 ,  Y10T29/53174 ,  Y10T29/53191 ,  Y10T29/53974

Abstract: A method for operating an assembly tool includes deposing a first component on an assembly surface with a first tool tip of a manipulator having a range of motion defined by a plane and an axis that is substantially normal to the plane, deposing a second component on the assembly surface, changing an orientation of the assembly surface relative to the axis from a first orientation to a second orientation, lifting the first component from the assembly surface with a second tool tip of the manipulator, and deposing the first component on the second component.

Abstract translation: 一种用于操作组装工具的方法包括：在装配表面上拆卸第一部件，其中操纵器的第一工具尖端具有由平面和基本垂直于该平面的轴限定的运动范围， 组装表面，使组装表面相对于轴线从第一方向改变到第二方向，使第一部件从组装表面用操纵器的第二工具尖端提升，并将第一部件放置在第二部件上。

公开(公告)号：US20140147986A1

公开(公告)日：2014-05-29

申请号：US13746359

申请日：2013-01-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bing Dang ,  John U. Knickerbocker ,  Cornelia Kang-I Tsang

IPC: H01L21/02

CPC classification number: H01L21/02002 ,  B82Y30/00 ,  H01L21/67092 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10S977/902 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T428/24355 ,  Y10T428/265 ,  Y10T428/31678

Abstract: Methods are provided for handling a device wafer. For example, a method includes providing a stack structure having a device wafer, a handler wafer, and a bonding structure disposed between the device wafer and handler wafer, and irradiating the bonding structure with long-wavelength infrared energy to ablate the bonding structure.

Abstract translation: 提供了处理器件晶片的方法。 例如，一种方法包括提供具有器件晶片，处理器晶片和布置在器件晶片和处理器晶片之间的接合结构的堆叠结构，并且用长波长红外能量照射接合结构以消融接合结构。

公开(公告)号：US20240177815A1

公开(公告)日：2024-05-30

申请号：US18059570

申请日：2022-11-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Erhan Bilal ,  Tian Hao ,  Bing Dang ,  Bo Wen ,  Jeffrey L. Rogers

IPC: G16H10/60

CPC classification number: G16H10/60

Abstract: Automated labeling of user sensor data is provided. It is determined that a user is at a medical facility using a location of a user device. User sensor data is collected from one or more user devices while the user is at the medical facility. A result is retrieved of a medical evaluation of the user performed at the medical facility. User sensor data collected during the medical evaluation is tagged with the retrieved result from the medical evaluation.