公开(公告)号：US07754529B2

公开(公告)日：2010-07-13

申请号：US11814337

申请日：2006-02-02

Applicant: Yoshihiro Tomita ,  Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Toshio Fujii

Inventor： Yoshihiro Tomita ,  Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Toshio Fujii

IPC: H01L21/00

CPC classification number: H05K3/3436 ,  H01L21/565 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/742 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K3/323 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/0285 ,  Y02P70/613 ,  H01L2224/05599

Abstract: In a flip chip mounted body in which a semiconductor chip (20) having a plurality of electrode terminals (21) is disposed so as to be opposed to a wiring board (10) having a plurality of connection terminals (11), with the connection terminals (11) and the electrode terminals (21) being connected electrically, a resin (13) containing electrically conductive particles (12) is supplied between the connection terminals (11) and the electrode terminals (21), the electrically conductive particles (12) and the resin (13) are heated and melted, and vibrations are applied so as to make them flow. The molten electrically conductive particles (12) are allowed to self-assemble between the connection terminals (11) and the electrode terminals (21), thereby forming connectors (22) that connect them electrically. It becomes more likely that the molten electrically conductive particles in the resin contact the connection terminals or the electrode terminals, whereby the molten electrically conductive particles self-assemble between the electrode terminals and the connection terminals that have a high wettability, making it possible to form connectors for establishing an electric connection between these terminals in a uniform manner.

Abstract translation: 在其中具有多个电极端子（21）的半导体芯片（20）设置成与具有多个连接端子（11）的布线板（10）相对的倒装芯片安装体中，连接 端子（11）和电极端子（21）电连接，在连接端子（11）和电极端子（21）之间提供包含导电颗粒（12）的树脂（13），导电颗粒（12） ）和树脂（13）被加热和熔化，并且施加振动以使其流动。 允许熔融的导电颗粒（12）在连接端子（11）和电极端子（21）之间自组装，从而形成将它们电连接的连接器（22）。 树脂中的熔融的导电性粒子更可能接触连接端子或电极端子，由此熔融的导电性粒子在电极端子和具有高润湿性的连接端子之间自组装，从而形成 用于以均匀的方式在这些端子之间建立电连接的连接器。

公开(公告)号：US20090203169A1

公开(公告)日：2009-08-13

申请号：US11814337

申请日：2006-02-02

Applicant: Yoshihiro Tomita ,  Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Toshio Fujii

Inventor： Yoshihiro Tomita ,  Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Toshio Fujii

IPC: H01L21/60 ,  H01L21/768

CPC classification number: H05K3/3436 ,  H01L21/565 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/742 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K3/323 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/0285 ,  Y02P70/613 ,  H01L2224/05599

Abstract: In a flip chip mounted body in which a semiconductor chip (20) having a plurality of electrode terminals (21) is disposed so as to be opposed to a wiring board (10) having a plurality of connection terminals (11), with the connection terminals (11) and the electrode terminals (21) being connected electrically, a resin (13) containing electrically conductive particles (12) is supplied between the connection terminals (11) and the electrode terminals (21), the electrically conductive particles (12) and the resin (13) are heated and melted, and vibrations are applied so as to make them flow. The molten electrically conductive particles (12) are allowed to self-assemble between the connection terminals (11) and the electrode terminals (21), thereby forming connectors (22) that connect them electrically. It becomes more likely that the molten electrically conductive particles in the resin contact the connection terminals or the electrode terminals, whereby the molten electrically conductive particles self-assemble between the electrode terminals and the connection terminals that have a high wettability, making it possible to form connectors for establishing an electric connection between these terminals in a uniform manner.

Abstract translation: 在其中具有多个电极端子（21）的半导体芯片（20）设置成与具有多个连接端子（11）的布线板（10）相对的倒装芯片安装体中，连接 端子（11）和电极端子（21）电连接，在连接端子（11）和电极端子（21）之间提供含有导电颗粒（12）的树脂（13），导电颗粒（12） ）和树脂（13）被加热和熔化，并且施加振动以使其流动。 允许熔融的导电颗粒（12）在连接端子（11）和电极端子（21）之间自组装，从而形成将它们电连接的连接器（22）。 树脂中的熔融的导电性粒子更可能接触连接端子或电极端子，由此熔融的导电性粒子在电极端子和具有高润湿性的连接端子之间自组装，从而形成 用于以均匀的方式在这些端子之间建立电连接的连接器。

公开(公告)号：US07531387B1

公开(公告)日：2009-05-12

申请号：US11887332

申请日：2006-03-16

Applicant: Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

Inventor： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

IPC: H01L21/00 ,  H01L21/44 ,  H01R12/02 ,  H05K1/11 ,  B23K35/14

CPC classification number: H05K3/3484 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/742 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11005 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/16505 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/29347 ,  H01L2224/294 ,  H01L2224/29411 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83211 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/301 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10977 ,  H05K2203/0425 ,  H05K2203/087 ,  H05K2203/1178 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a resin 14 containing a solder powder 16 and a gas bubble generating agent is supplied to a space between a circuit board 21 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 12, the resin 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 14. The resin 14 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof and self-assembled between the connecting terminals 11 and the electrode terminals 12. By further heating the resin 14 and melting the solder powder 16 contained in the resin 14 self-assembled between the terminals, connectors 22 are formed between the terminals to complete a flip chip mounting body.

公开(公告)号：US20090008433A1

公开(公告)日：2009-01-08

申请号：US12166673

申请日：2008-07-02

Applicant: Hideaki Sakaguchi ,  Kiyoaki Iida ,  Mitsutoshi Higashi

Inventor： Hideaki Sakaguchi ,  Kiyoaki Iida ,  Mitsutoshi Higashi

IPC: B23K31/02 ,  B23K3/08 ,  C23F1/00

CPC classification number: H01L24/11 ,  H01L24/742 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3478 ,  H05K2203/041 ,  H05K2203/0485 ,  H05K2203/0557 ,  H05K2203/082

Abstract: There is provided a conductive ball mounting apparatus. The conductive ball mounting apparatus includes: a conductive ball mounting mask disposed to oppose a substrate having a plurality of pads coated with an adhesive flux, the conductive ball mounting mask having a plurality of ball mounting through holes for mounting each of conductive balls on each of the plurality of pads, the plurality of ball mounting through holes being arranged to oppose to the plurality of pads; and a conductive ball supplying unit for moving or removing the conductive balls on the conductive ball mounting mask by sucking an air on an upper surface side of the conductive ball mounting mask. The conductive ball mounting mask includes through portions formed to block passing of the conductive balls.

Abstract translation: 提供了导电球安装装置。 导电球安装装置包括：导电球安装掩模，设置为与具有涂覆有粘合剂焊剂的多个焊盘的基板相对，导电球安装掩模具有多个球安装通孔，用于将每个导电球安装在每个导电球上 所述多个焊盘，所述多个球安装通孔布置成与所述多个焊盘相对; 以及导电球供给单元，用于通过在导电性球安装掩模的上表面侧吸入空气来移动或去除导电性球安装掩模上的导电球。 导电球安装掩模包括形成为阻挡导电球通过的通孔部分。

公开(公告)号：US20080142966A1

公开(公告)日：2008-06-19

申请号：US11885562

申请日：2006-03-06

Applicant: Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Yoshihiro Tomita

Inventor： Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Yoshihiro Tomita

IPC: H01L23/48 ,  H01L21/60 ,  C08K3/10 ,  C08L75/00 ,  C08L67/00 ,  C08G59/00 ,  C08L31/00 ,  C08L9/00 ,  H01L21/44

CPC classification number: H01L24/81 ,  H01L21/6835 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1141 ,  H01L2224/1152 ,  H01L2224/11524 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/293 ,  H01L2224/294 ,  H01L2224/73104 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/323 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/0425 ,  H05K2203/087 ,  H05K2203/1178 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: There is provided a composition that is suitably used for a flip chip mounting process or a bump-forming process. The composition comprises a first component 3a, a second component 3b, metal particles 1,1′ and a convection additive. The metal particles 1,1′ are dispersed in the second component 3b. The convection additive is contained in the second component 3b. The first component 3a is contained in an interior of at least one particle 1. When such at least one metal particle 1 melts upon heating, the first component 3a comes in contact with the second component 3b to form a thermoset resin 3c. The convection additive is capable of generating a gas upon heating, so that the gas provides a convection effect in the composition.

Abstract translation: 提供了适合用于倒装芯片安装工艺或凹凸形成工艺的组合物。 组合物包含第一组分3a，第二组分3b，金属颗粒1,1'和对流添加剂。 金属颗粒1,1'分散在第二部件3b中。 对流添加剂包含在第二组分3b中。 第一组分3a包含在至少一个颗粒1的内部。 当这样的至少一种金属颗粒1在加热时熔化时，第一组分3a与第二组分3b接触以形成热固性树脂3c。 对流添加剂能够在加热时产生气体，使得气体在组合物中提供对流效果。

公开(公告)号：US20070257362A1

公开(公告)日：2007-11-08

申请号：US11661821

申请日：2005-08-30

Applicant: Seiji Karashima ,  Yoshihisa Yamashita ,  Satoru Tomekawa ,  Takashi Kitae ,  Seiichi Nakatani

Inventor： Seiji Karashima ,  Yoshihisa Yamashita ,  Satoru Tomekawa ,  Takashi Kitae ,  Seiichi Nakatani

IPC: H01L21/44 ,  B23K35/34

CPC classification number: H05K3/3484 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1579 ,  H05K3/323 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/083 ,  H05K2203/087 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00014

Abstract: There is provided a process for forming bumps wherein a plurality of fine bumps are uniformly formed with high productivity. In this process, a resin (13) comprising solder powder and a convection additive (12) is supplied onto a substrate (10) having a plurality of electrodes (11) thereon. And subsequently the substrate (10) is heated to a temperature that enables the solder powder to melt while keeping a flat plate (14) in contact with a surface of the supplied resin (13). During this heating step, the molten solder powder is allowed to self-assemble onto the electrodes (11) so that a plurality of solder balls resulting from the grown molten solder powder are concurrently formed on the electrodes (11) in self-alignment manner. Finally, by moving the flat plate (14) away from the surface of the supplied resin (13), followed by removing such resin (13), there is provided the substrate (10) wherein the bumps (16) are formed on the plurality of the electrodes.

Abstract translation: 提供了一种用于形成凸块的方法，其中以高生产率均匀地形成多个细小凸块。 在该方法中，将包含焊料粉末和对流添加剂（12）的树脂（13）供给到其上具有多个电极（11）的基板（10）上。 然后将衬底（10）加热到使焊料粉末熔化同时保持平板（14）与所供应的树脂（13）的表面接触的温度。 在该加热步骤中，允许熔融焊料粉末自组装到电极（11）上，从而以自对准的方式在电极（11）上同时形成由生长的熔融焊料粉末产生的多个焊料球。 最后，通过将平板（14）移动远离所提供的树脂（13）的表面，随后除去这种树脂（13），设置有多个基板（10），其中凸块（16）形成在多个 的电极。

公开(公告)号：US07275676B2

公开(公告)日：2007-10-02

申请号：US10977301

申请日：2004-10-29

Applicant: Chad A. Cobbley ,  Michael B. Ball ,  Marjorie L. Waddel

Inventor： Chad A. Cobbley ,  Michael B. Ball ,  Marjorie L. Waddel

IPC: B23K31/02

CPC classification number: H01L24/12 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3478 ,  H05K2203/0126 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49211 ,  Y10T29/49222 ,  Y10T29/53178 ,  Y10T29/532 ,  H01L2224/05599

Abstract: Apparatus for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

Abstract translation: 用于使用具有定位在接合焊盘上方的通孔图案的模板将导电球放置在衬底的预先焊接的焊盘上的装置。 导电球通过移动进给机构放置在通孔中，并且球体通过通孔落到接合垫上。 在一个实施例中，进给机构是穿过整个通孔图案的球形料斗。 在另一个实施例中，梭板从储存器供给球体并可逆地移动约一半的间距，从非排放位置移动到排出位置。

公开(公告)号：US07205177B2

公开(公告)日：2007-04-17

申请号：US11171483

申请日：2005-06-30

Applicant: Walter De Raedt ,  Steven Brebels ,  Steven Sanders ,  Tom Torfs ,  Eric Beyne

Inventor： Walter De Raedt ,  Steven Brebels ,  Steven Sanders ,  Tom Torfs ,  Eric Beyne

IPC: H01L21/48 ,  H01L23/48 ,  B23K31/02

CPC classification number: H01L23/3128 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3171 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/552 ,  H01L23/66 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/27013 ,  H01L2224/2741 ,  H01L2224/29017 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83051 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/92125 ,  H01L2224/92222 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/1433 ,  H01L2924/15331 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/381 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/81 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2224/45099

Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.

Abstract translation: 公开了在微电子应用中使用诸如晶片之类的两个元件的方法。 一个发明方面涉及一种用于接合的方法，包括在第一元件的第一主表面上产生第一焊球，在第二元件的第一主表面上产生第二焊球，在第一焊球和第二焊球之间提供接触 焊球，通过施加回流作用来接合第一元件和第二元件，由此焊球熔化并形成接合的焊球结构。 在接合之前，第一焊球侧向嵌入非导电材料，使得第一焊球的上部不被非导电材料覆盖。 还公开了与这些方法相关的装置。

公开(公告)号：US20060003569A1

公开(公告)日：2006-01-05

申请号：US11210606

申请日：2005-08-23

Applicant: Warren Farnworth ,  Alan Wood ,  James Wark ,  David Hembree ,  Syed Ahmad ,  Michael Hess ,  John Jacobson

Inventor： Warren Farnworth ,  Alan Wood ,  James Wark ,  David Hembree ,  Syed Ahmad ,  Michael Hess ,  John Jacobson

IPC: H01L21/44

CPC classification number: H01L23/544 ,  B33Y30/00 ,  B33Y80/00 ,  H01L21/563 ,  H01L23/293 ,  H01L23/3157 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/5448 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11005 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/16 ,  H01L2224/293 ,  H01L2224/81011 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.

公开(公告)号：US20040238208A1

公开(公告)日：2004-12-02

申请号：US10447169

申请日：2003-05-27

Applicant: Xerox Corporation

Inventor： John R. Andrews ,  Bradley J. Gerner ,  Richard Schmachtenberg III ,  Chad Slenes ,  Samuel V. Schultz

IPC: H05K001/11

CPC classification number: H05K3/1225 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11005 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/13007 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13309 ,  H01L2224/16013 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/2711 ,  H01L2224/27438 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3484 ,  H05K3/361 ,  H05K2201/2036 ,  H05K2203/0537 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T428/24843 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2924/07025

Abstract: A multi-layer standoff/mask structure including a standoff having a plurality of standoff openings and a mask having a plurality of mask openings aligned with the standoff openings.

Abstract translation: 包括具有多个支座开口的支座和具有与支座开口对准的多个掩模开口的掩模的多层间隔/掩模结构。