公开(公告)号：US3919767A

公开(公告)日：1975-11-18

申请号：US45469774

申请日：1974-03-25

Applicant: SIEMENS AG

Inventor： MAAZ KARL

IPC: H01R12/50 ,  H05K1/00 ,  H05K3/20 ,  H05K3/22 ,  H05K3/28 ,  H01R43/00

CPC classification number: H05K3/222 ,  H05K1/0298 ,  H05K1/0393 ,  H05K3/202 ,  H05K3/281 ,  H05K2201/10212 ,  H05K2201/10363 ,  Y10T29/4914

Abstract: An arrangement and method of manufacturing a connector for electrical circuit points lying in the same plane, such as occurs with printed circuit boards, is disclosed. The arrangement comprises a plurality of U-shaped comb-like, conducting elements, formed, for example, from etched copper foils, joined together with a layer of insulating material between the conductors. A portion of the conductors are bent to permit their insertion through the support surface of the circuit for soldering and electrical connection between the circuit points.

Abstract translation: 公开了一种制造用于位于同一平面中的电路连接器的连接器的布置和方法，例如印刷电路板的出现。 该布置包括多个U形梳状导电元件，例如由蚀刻的铜箔形成的导电元件，其与导体之间的绝缘材料层连接在一起。 导体的一部分被弯曲以允许它们插入电路的支撑表面以进行焊接和电路点之间的电连接。

公开(公告)号：US3726989A

公开(公告)日：1973-04-10

申请号：US3726989D

申请日：1970-07-27

Applicant: HUGHES AIRCRAFT CO

Inventor： LESLEY A

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/22 ,  H05K3/34 ,  H05K3/40 ,  H05K1/04

CPC classification number: H05K1/0263 ,  H05K1/117 ,  H05K3/222 ,  H05K3/3447 ,  H05K3/403 ,  H05K3/4092 ,  H05K2201/10212 ,  H05K2201/10272 ,  H05K2201/10363 ,  H05K2201/10689

Abstract: A multilayer conductor strip construction for interconnections in a circuit module is disclosed wherein narrow, flat and elongated sections of multilevel laminations retain the high density characteristic of multilayer construction and lateral extensions of flat conductors outside the laminations expose ends of the conductors at connection sites of a printed circuit board. Uniformly spaced holes in the circuit boards provide the sites for solder connections to circuit components positioned over the strips. The holes are arranged in parallel rows between conductor strips and are staggered to provide for high density interlacing of conductor ends projecting laterally from opposing sides of adjacent strips.

Abstract translation: 公开了一种用于电路模块中的互连的多层导体条构造，其中多层叠片的狭窄，平坦和细长部分保持了多层结构的高密度特性，并且在叠片外部的扁平导体的横向延伸暴露在导体的连接位置处的端部 印刷电路板。 电路板中均匀间隔的孔提供了焊接连接到位于条上的电路元件的位置。 孔在导体条之间平行地布置并且交错以提供从相邻条的相对侧横向突出的导体端的高密度交织。

公开(公告)号：US3267407A

公开(公告)日：1966-08-16

申请号：US34001564

申请日：1964-01-24

Applicant: HEWLETT PACKARD CO

Inventor： JOHN HUMPHRIES ,  PIERCE ROBERT B

IPC: H01R29/00 ,  H05K1/00 ,  H05K3/22

CPC classification number: H05K3/222 ,  H01R29/00 ,  H05K1/0289 ,  H05K2201/10363

公开(公告)号：US2066511A

公开(公告)日：1937-01-05

申请号：US3235335

申请日：1935-07-20

Applicant: BELL TELEPHONE LABOR INC

Inventor： ARLT HERBERT G

IPC: H05K1/09 ,  H05K3/22 ,  H05K3/40

CPC classification number: H05K3/225 ,  H05K1/095 ,  H05K3/222 ,  H05K3/4046 ,  H05K2201/10234 ,  H05K2201/10363 ,  H05K2201/10401 ,  Y10S29/039

公开(公告)号：US20190013271A1

公开(公告)日：2019-01-10

申请号：US16129577

申请日：2018-09-12

Applicant: INTEL CORPORATION

Inventor： Yueli Liu ,  Qinglei Zhang ,  Amanda E. Schuckman ,  Rui Zhang

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/482 ,  H01L25/18 ,  H01L23/532

CPC classification number: H01L23/5381 ,  H01L23/4821 ,  H01L23/53238 ,  H01L23/538 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/26 ,  H01L24/27 ,  H01L24/33 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/171 ,  H01L2224/2746 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33505 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81411 ,  H01L2224/81455 ,  H01L2224/81463 ,  H01L2224/81466 ,  H01L2224/8147 ,  H01L2224/81472 ,  H01L2224/81479 ,  H01L2224/81481 ,  H01L2224/81484 ,  H01L2224/81487 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/0496 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/185 ,  H05K3/3436 ,  H05K2201/10363 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/04941 ,  H01L2924/01074 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0481 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for layered interconnect structures for bridge interconnection in integrated circuit assemblies. In one embodiment, an apparatus may include a substrate and a bridge embedded in the substrate. The bridge may be configured to route electrical signals between two dies. An interconnect structure, electrically coupled with the bridge, may include a via structure including a first conductive material, a barrier layer including a second conductive material disposed on the via structure, and a solderable material including a third conductive material disposed on the barrier layer. The first conductive material, the second conductive material, and the third conductive material may have different chemical composition. Other embodiments may be described and/or claimed.

公开(公告)号：US10080286B2

公开(公告)日：2018-09-18

申请号：US13985363

申请日：2012-02-15

Applicant: Hiroyuki Waku

Inventor： Hiroyuki Waku

IPC: H05K1/11 ,  B29C70/88 ,  B64C3/20 ,  B64C3/26 ,  B64D45/02 ,  H05K13/00 ,  B64C3/18 ,  B29K307/04 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K1/115 ,  B29C70/882 ,  B29K2307/04 ,  B64C3/18 ,  B64C3/20 ,  B64C3/26 ,  B64D45/02 ,  H05K1/0366 ,  H05K3/4602 ,  H05K3/4632 ,  H05K13/00 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/10363 ,  Y02T50/43 ,  Y10T29/49117

Abstract: A spar includes a conductive layer laminated and formed on a carbon-fiber prepreg, and a jumper formed of a conductor which penetrates through the conductive layer and the carbon-fiber prepreg.

公开(公告)号：US20180199432A1

公开(公告)日：2018-07-12

申请号：US15912388

申请日：2018-03-05

Applicant: Applied Materials, Inc.

Inventor： David Thompson ,  Mark Saly ,  Bhaskar Jyoti Bhuyan

IPC: H05K1/02 ,  H05K3/40 ,  G03G15/00 ,  G03G21/16 ,  H05K1/11

CPC classification number: H05K1/0296 ,  C07F7/00 ,  C23C16/04 ,  C23C16/455 ,  C23C16/45525 ,  C23C16/50 ,  G03G15/50 ,  G03G15/80 ,  G03G21/1652 ,  H01L21/0217 ,  H01L21/02211 ,  H01L21/0228 ,  H01L21/02307 ,  H01L21/3105 ,  H01L21/31133 ,  H01L21/32 ,  H01L21/67207 ,  H05K1/0269 ,  H05K1/117 ,  H05K3/4015 ,  H05K3/403 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/10287 ,  H05K2201/10363

Abstract: Methods of depositing a film selectively onto a first substrate surface relative to a second substrate surface. Methods include soaking a substrate surface comprising hydroxyl-terminations with a silylamine to form silyl ether-terminations and depositing a film onto a surface other than the silyl ether-terminated surface.

公开(公告)号：US20180139862A1

公开(公告)日：2018-05-17

申请号：US15351087

申请日：2016-11-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Hoon Park ,  Jin Woo Kim ,  Dae Kwang Kim

IPC: H05K7/14 ,  H05K1/11 ,  H05K1/09 ,  H05K5/02

CPC classification number: H05K1/09 ,  H05K1/0271 ,  H05K2201/09063 ,  H05K2201/10363 ,  H05K2201/2009

Abstract: An electronic device including reinforced printed circuit board is provided. The electronic device includes the printed circuit board including a first area, and a second area that extends from a first end of the first area. A width of the second area is smaller than a width of the first area, and at least a portion of a surface of the second area is covered by a material layer that provides the second area with a specific strength.

公开(公告)号：US09907188B2

公开(公告)日：2018-02-27

申请号：US14882404

申请日：2015-10-13

Applicant: ELIFECONNECTION CO., LTD.

Inventor： Cheng-Tsuen Hsu

IPC: H02J3/14 ,  H05K3/34 ,  H05K1/02

CPC classification number: H05K3/3447 ,  H05K1/0209 ,  H05K1/0263 ,  H05K2201/09563 ,  H05K2201/10272 ,  H05K2201/10363

Abstract: A multiport power transmission apparatus is provided. The multiport power transmission apparatus includes a PCB, sockets, switching modules, metal cross-lines, a neutral-line metal bar, and a live-line metal bar. The sockets and the switching modules are disposed on a component side of the PCB. The neutral-line metal bar and the live-line metal bar are disposed on a solder side of the PCB. The live-line metal bar is disposed between an orthogonal projection pattern of each socket and the neutral-line metal bar. A power input pin of each switching module is connected to the live-line metal bar through the solder side. A power-output pin of each switching module is connected to a live pin of a corresponding socket through the solder side. Two terminals of each metal cross-line are respectively connected to a neutral pin of a corresponding socket and the neutral-line metal bar through the solder side.

公开(公告)号：US20180031974A1

公开(公告)日：2018-02-01

申请号：US15662214

申请日：2017-07-27

Applicant: X-Celeprint Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Matthew Meitl

IPC: G03F7/20 ,  H05K3/30

CPC classification number: G03F7/20 ,  H01L23/00 ,  H01L33/00 ,  H05K1/16 ,  H05K3/30 ,  H05K3/305 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/1189 ,  Y02P70/613

Abstract: A printable component includes a component substrate and one or more electrical conductors. One or more electrically conductive connection posts protrudes from the component substrate to form an exposed electrical contact. Each connection post is electrically connected to at least one of the electrical conductors and one or more wicking posts protrude from the component substrate. The wicking post can be insulating. In certain embodiments, a printable component source wafer comprises a source wafer, a plurality of sacrificial portions separated by anchor portions formed in a sacrificial layer of the source wafer, and a plurality of printable components. Each printable component is disposed over a corresponding sacrificial portion and connected to an anchor portion by a tether. A destination substrate structure comprises a destination substrate having one or more electrically conductive contact pads, an adhesive layer disposed on the destination substrate, and one or more printable components.